Trelleborg Emerson & Cuming Stycast® E-1000 One-Component Epoxy Low Stress Encapsulant

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer	Trelleborg Emerson & Cuming, Inc.
Trade Name	Stycast®
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Trelleborg Emerson & Cuming Stycast® E-1000 One-Component Epoxy Low Stress Encapsulant.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Emerson & Cuming E-1000 Stycast® One-Component Epoxy Low Stress EncapsulantDesigned for the encapsulation of a wide range of stress sensitive electronics. They offer excellent performance at low temperatures and provide protection from mechanical shock and vibration. Low viscosity, good chemical resistance. Mix Ratio (by weight) = 100:120 Cure Type: Heat Bonding Type: Epoxy

Physical Properties	Metric	English	Comments
Density	1.05 g/cc	0.0379 lb/in³
Viscosity	1500 cP @Temperature 25.0 °C	1500 cP @Temperature 77.0 °F	Mixed

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	30	30

Thermal Properties	Metric	English
Maximum Service Temperature, Air	65.0 °C	149 °F
Minimum Service Temperature, Air	-40.0 °C	-40.0 °F
Glass Transition Temp, Tg	-18.0 °C	-0.400 °F

Electrical Properties	Metric	English	Comments
Dielectric Constant	4.9 @Frequency 1e+6 Hz	4.9 @Frequency 1e+6 Hz
Dielectric Strength	11.8 kV/mm	300 kV/in

Processing Properties	Metric	English	Comments
Cure Time	>= 180 min	>= 3.00 hour

Users viewing this material also viewed the following: