Trelleborg Emerson & Cuming Stycast® E-1030 One-Component Epoxy Low Stress Encapsulant

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced , Epoxy, Thermally Conductive
Manufacturer	Trelleborg Emerson & Cuming, Inc.
Trade Name	Stycast®
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Trelleborg Emerson & Cuming Stycast® E-1030 One-Component Epoxy Low Stress Encapsulant.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Emerson & Cuming E-1030 Stycast® One-Component Epoxy Low Stress EncapsulantDesigned for the encapsulation of a wide range of stress sensitive electronics. They offer excellent performance at low temperatures and provide protection from mechanical shock and vibration. Thermally conductive, good chemical resistance. Mix Ratio (by weight) = 100:14 Cure Type: Heat Bonding Type: Epoxy

Physical Properties	Metric	English	Comments
Density	1.93 g/cc	0.0697 lb/in³
Viscosity	12000 cP @Temperature 25.0 °C	12000 cP @Temperature 77.0 °F	Mixed

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	79	79

Thermal Properties	Metric	English
CTE, linear	159 µm/m-°C @Temperature 20.0 °C	88.3 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	0.580 W/m-K	4.03 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	105 °C	221 °F
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F

Electrical Properties	Metric	English	Comments
Dielectric Constant	5.8 @Frequency 1e+6 Hz	5.8 @Frequency 1e+6 Hz
Dielectric Strength	14.8 kV/mm	375 kV/in

Processing Properties	Metric	English	Comments
Cure Time	>= 180 min	>= 3.00 hour

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