Polymer Property : Density = 0.0672 lb/in³ Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Density	1.86 g/cc	0.0672 lb/in³	ASTM D792
Multibase Multi-Flex® TPE A 8832 E BLK Multi-Flex TPE contains Kraton™ G.Data provided by Multibase.
Density	1.86 g/cc	0.0672 lb/in³	ASTM D792
Rogers Corporation RO4350B Glass-Reinforced Hydrocarbon and Ceramic Laminate with Thin Film Resistor Foil RO4000® Series High Frequency Circuit Materials are glass-reinforced hydrocarbon and ceramic (not PTFE) laminates with TICER™ TCR® Thin Film Resistor Foils. These laminates are designed for perf..
Density	1.86 g/cc	0.0672 lb/in³	4.0 mil thickness; ASTM D792
Rogers Corporation RO4450B Prepreg Prepreg is commonly used to inexpensively form less critical signal layers in antenna designs. A high post-cure Tg makes RO4400 series prepreg an excellent choice for multi-layers requiring sequent..
Density	1.86 - 1.89 g/cc	0.0672 - 0.0683 lb/in³
Pyrotek Pyrocast AR FINE Castable Refractory Pyrocast AR Fine is a fine-grain fused silica castable, offering similar insulation properties, yet lighter weight that the Pyrocast AR formulation. Pyrocast AR Fine is suited for thin wall casting..
Density	1.86 - 1.89 g/cc	0.0672 - 0.0683 lb/in³
Pyrotek Pyrocast PCR Abrasion-Resistant Refractory Castable Pyrocast PCR is an abrasion resistant, thermal shock resistant castable. It is suitable to give exceptional resistance for conditions such as rapid heating or rapid cooling.ApplicationsCarbon anode..
Density	1.86 g/cc	0.0672 lb/in³
3M Dyneon™ Fluorel™ FE-5840Q Fluoroelastomer VF2 + HFP + TFE Terpolymer (discontinued **) Data provided by the manufacturer, Dyneon LLC.Incorporated cure polymer, 70.1%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, and 4% Ca(OH)2. The FE series O-ring grades are the c..
Density	1.86 g/cc	0.0672 lb/in³
3M Dyneon™ Fluorel™ FE-5730Q Fluoroelastomer VF2 + HFP + TFE Terpolymer (discontinued **) Data provided by the manufacturer, Dyneon LLC.Incorporated cure polymer, 69.2%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, and 4% Ca(OH)2. 69.2% F grade terpolymer with good pe..
Density	1.86 g/cc	0.0672 lb/in³
3M Dyneon™ Fluorel™ FT-2320 Fluoroelastomer VF2 + HFP + TFE Terpolymer (discontinued **) Data provided by the manufacturer, Dyneon LLC.Incorporated cure polymer, 69%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, and 4% Ca(OH)2. 69% F grade terpolymer for difficult ex..
Density	1.86 g/cc	0.0672 lb/in³
3M Dyneon™ Fluorel™ FT-2350 Fluoroelastomer VF2 + HFP + TFE Terpolymer (discontinued **) Data provided by the manufacturer, Dyneon LLC.Incorporated cure polymer, 68.6%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, and 4% Ca(OH)2. Improved retention of elongation afte..
Density	1.86 g/cc	0.0672 lb/in³
3M Dyneon™ Fluorel™ FT-2430 Fluoroelastomer VF2 + HFP + TFE Terpolymer (discontinued **) Data provided by the manufacturer, Dyneon LLC.Non-incorporated cure polymer, 69%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, 4% Ca(OH)2, 1.4% Dihydroxy Crosslinker, 0.4% Phospho..
Density	1.86 g/cc	0.0672 lb/in³
3M Dyneon™ Fluorel™ FT-2481 Fluoroelastomer VF2 + HFP Dipolymer (discontinued **) Data provided by the manufacturer, Dyneon LLC.Non-incorporated cure polymer, 68.6%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, 4% Ca(OH)2, 1.4% Dihydroxy Crosslinker, 0.4% Phosp..
Density	1.86 g/cc	0.0672 lb/in³	ISO 1183
Polykemi AB POLYfill PPH B8065 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Density	1.86 g/cc	0.0672 lb/in³	ISO 1183
Polykemi AB POLYfill PPH B8065 VT1 Polypropylene Homopolymer, Mineral Reinforced, Heat Resistant Information provided by Polykemi AB
Density	1.86 g/cc	0.0672 lb/in³
Cookson Group Plaskon® 1002 Conventional Encapsulant (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low cost, low stress, conventional molding compound recommended for high volume commodity-type packages that house simple linea..
Density	1.86 g/cc	0.0672 lb/inÂ³	ASTM D572
Haysite 18600 Polyester BMC, 15% Glass Reinforced The 18600 series bulk molding compound can be compression, transfer, or injection molded. Formulated with a high temperature resin system, this grade exhibits exceptional retention of physical and e..
Density	1.86 g/cc	0.0672 lb/inÂ³	ASTM D891
Solvay Specialty Polymers FOMBLINÂ® M60 PFPE Lubricant Information provided by Solvay Solexis, Inc.
Density	1.86 g/cc	0.0672 lb/inÂ³	ASTM D792
Sumitomo Bakelite North America E 3812M-1 Mineral and Glass Filled Electrical Encapsulation Grade Epoxy E 3812M-1 is a mineral and short fiberglass filled epoxy molding compound for low pressure encapsulation molding, featuring excellent dimensional stability, good thermal shock resistance, and good e..
Density	1.86 g/cc	0.0672 lb/in³	ASTM D792
Plenco 1500 Polyester, Granular, Compression Molded PLENCO 01500 is a general purpose, mineral filled granular polyester molding compound, offering excellent arc and track resistance, and low post shrinkage characteristics. UL recognized under compon..
Density	1.86 g/cc	0.0672 lb/in³	ISO 1183
Wolf Kunststoff ZEDEX® ZX-550PV A7A Polymer Alloy Main Characteristics: Modified friction wear; Tough; Soft; Reduced wear at temperatures at 100 ° CApplications: Chemical Engineering; Laboratory Technology; Automitve Technology; Machine ToolsInfor..
Density	1.86 g/cc	0.0672 lb/in³
Epoxyset Epoxibond EB-347 Low Expansion Epoxy Adhesive EB-347 is a highly filled, low coefficient expansion, epoxy adhesive. This low out-gassing adhesive exhibits excellent wettability without preheating metal bonding surfaces and has a good dimensiona..
Density	1.86 g/cc	0.0672 lb/in³	Liquid
3M Fluorinert™ FC-40 Electronic Liquid 3M™ Fluorinert™ Liquid FC-40 is a non-conductive, thermally and chemically stable fluid ideal for single phase heat transfer fluid applications, especially in the electronics and semiconductor ind..
Density	1.86 g/cc	0.0672 lb/in³	Liquid
3M Fluorinert™ FC-43 Electronic Liquid 3M™ Fluorinert™ Liquid FC-43 is a non-conductive, thermally and chemically stable liquid ideal for many single phase heat transfer fluid applications, especially in the electronics and semiconduct..
Density	1.86 g/cc	0.0672 lb/in³	ISO 1183
Vyncolit Neopreg Kinel® SK60 L8F Glass Fiber Reinforced Molding Compound Medium flow, epoxy based molding compound long glass fiber reinforced with excellent long term property retention over a wide temperature range and climate conditions. It is particularly suited f..
Density	1.86 g/cc	0.0672 lb/in³	ASTM D792
Sumitomo Bakelite North America FS-6 CAF Mineral Filled Diallyl Phthalate Isophthalate DAP Resin Isomer. Used for critical, high-performance military and commercial electrical components where long-term reliability is demanded.Meets the requirements of ASTM D5948 Type MI..
Density	1.86 g/cc	0.0672 lb/in³	Relative Density; ISO 1183
Sumitomo Bakelite North America RX® 852 Novolac Phenolic Fiberglass reinforced phenolic novolac compound with good dimensional stability and good strength at elevated temperatures.Information provided by Vyncolit, a Sumitomo Bak Group
Density	1.86 g/cc	0.0672 lb/in³
Cookson Group Plaskon® 3300S Mineral Filled Novolac Epoxy Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress, flame retardant, novolac hardened epoxy molding compound designed to provide hermeticity protection exceeding that ..