Physical Properties | Metric | English | Comments |
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Viscosity | 50000 - 100000 cP @Temperature 25.0 °C |
50000 - 100000 cP @Temperature 77.0 °F |
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Northstar Polymers MPC-070 Prepolymer Information provided by Northstar Polymers. |
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Viscosity | 50000 - 75000 cP | 50000 - 75000 cP | |
Huntsman HY 815 US Polyamide Approx. H+ equivalent weight 150. Mix Ratio with GY 6010 is 81.Comments/Applications: Solvent free, high molecular weight, low amine content. Superior adhesion, easily pigmented. Trade sale pain.. |
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Viscosity | 50000 - 70000 cP | 50000 - 70000 cP | B |
ITW Plexus Plexusâ„¢ AO420 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose adhesive , high toughness.Information provided by Illinois Tool Works. |
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Viscosity | 50000 - 70000 cP | 50000 - 70000 cP | B |
ITW Plexus Plexusâ„¢ MA1021 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose, low shrinkage.Information provided by Illinois Tool Works. |
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Viscosity | 50000 - 70000 cP | 50000 - 70000 cP | B |
ITW Plexus Plexusâ„¢ MA1023 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Low shrinkage, low odor, all purpose.Information provided by Illinois Tool Works. |
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Viscosity | 50000 - 75000 cP | 50000 - 75000 cP | B |
ITW Plexus Plexusâ„¢ MA821 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Designed for structural bonding of metals without primers.Information provided by Illinois Tool Wo.. |
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Viscosity | 50000 - 80000 cP | 50000 - 80000 cP | B |
ITW Plexus Plexusâ„¢ MA822 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Designed for structural bonding of metals without primers.Information provided by Illinois Tool Wo.. |
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Viscosity | 50000 cP @Temperature 25.0 °C |
50000 cP @Temperature 77.0 °F |
Dynamic |
Struktol POLYDIS 3605 Elastomer modified epoxy prepolymer Applications: STRUKTOL VP 3605 is used where conventional epoxy systems and prepolymers are unable to satisfy the demands of for example impact, flexural and peel strength. A higher compatibility ca.. |
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Viscosity | 50000 cP | 50000 cP | Before Curing |
Silikony Polskie Gumosil E Silicone Rubber Very flexible with low hardness |
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Viscosity | 50000 cP | 50000 cP | Before Curing |
Silikony Polskie Polastosil M-33 Silicone Rubber Medium hard with good tearing resistance |
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Viscosity | 50000 - 65000 cP | 50000 - 65000 cP | Part B |
Master Bond EP21AOLV-1 Two Part, Room Temperature Curing Epoxy System Product Description: Master Bond Polymer Adhesive EP21AOLV-1 is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant and coating. This versatile system will adhere t.. |
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Viscosity | 50000 - 60000 cP @Temperature 23.0 °C |
50000 - 60000 cP @Temperature 73.4 °F |
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Master Bond EP21HT High Temperature Resistant Two Component Epoxy Master Bond Polymer System EP21HT is a two component, room temperature curing epoxy adhesive, sealant and coating with high temperature resistance up to 400°F. EP21HT produces high strength, durabl.. |
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Viscosity | 50000 cP | 50000 cP | available as EP21TP |
Master Bond EP21TPND Two Component Polysulfide Epoxy Adhesive Master Bond Polymer Adhesive EP21TPND is a two component polysulfide epoxy based adhesive / sealant formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Pol.. |
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Viscosity | 50000 - 60000 cP | 50000 - 60000 cP | |
Master Bond EP45HTMED Epoxy Resists Radiation and Steam Sterilization Description: Master Bond Polymer System EP45HTMED is a two component heat cured epoxy system for high performance structural bonding, sealing, coating and casting. It is especially designed for the .. |
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Viscosity | 50000 cP @Temperature 25.0 °C |
50000 cP @Temperature 77.0 °F |
After mixing |
Tra-Con Tra-Bond F156 Optically Opaque Epoxy Adhesive TRA-BOND F156 is a black, solvent-free thixotropic epoxy system recommended for high quality photographic industry bonding, laminating, production and repair applications where a room-temperature cu.. |
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Viscosity | 50000 cP @Temperature 25.0 °C |
50000 cP @Temperature 77.0 °F |
Mixed |
Trelleborg Emerson & Cuming Stycast® 2762/17M-1 Two-Component Epoxy High Service Temp Encapsulant Features and Typical ApplicationsAbility to withstand high temperatures, thermal shock, and chemical exposure. These products are designed for heat generating electronic devices which operate in har.. |
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Viscosity | 50000 cP | 50000 cP | |
Cotronics Duralco™ 4703 Adhesive and Tooling Compound High temperature resin reinforced with ceramic and metallic fibers and particles, resulting in high thermal stability. Easily machined to close tolerances and will repair and rebuild worn or cracke.. |
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Viscosity | 50000 cP | 50000 cP | |
Dow Corning SYL-OFF® SL 7688 RELEASE COATING Base polymer component for Syl-Off® solvent-based platinum catalyzed silicone release coatingsInformation provided by Dow Corning |
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Viscosity | 50000 - 60000 cP @Temperature 23.0 °C |
50000 - 60000 cP @Temperature 73.4 °F |
5 rpm |
Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotr.. |
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Viscosity | 50000 cP | 50000 cP | "A" component |
ACC QLE 1020 QSI Quantum Silicones 45 Durometer Clear, Addition Cure Elastomer for Coating QLE 1020 is a 100% silicone solids elastomer designed for fabric or cloth coating applications. This two-component system offers a tough coating with excellent adhesion and fast cure.Key Features: .. |
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Viscosity | 50000 cP | 50000 cP | Base |
ACC QM 245 QSI Quantum Silicones 45 Durometer Addition Cure Moldmaking Material QM 245 is a two component, room temperature addition cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is a good choice for th.. |
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Viscosity | 50000 cP | 50000 cP | Base |
ACC QM Skin 30 QSI Quantum Silicones 30 Durometer Condensation Cure moldmaking Material QM Skin 30 is a two-component, room temperature condensation cure silicone material. The cured rubber is very soft, has excellent mechanical properties and very low bleed in addition to good shelf-l.. |
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Viscosity | 50000 cP | 50000 cP | After mixing, uncured |
Atom Adhesives AA-BOND F156 Epoxy Adhesive AA-BOND F156 is a black, solvent free thixotropic epoxy recommended for high quality photographic industry, laminating, production and repair applications where a room temperature cure optically opa.. |
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Viscosity | 50000 cP | 50000 cP | Part A, RVT, #7, 2.5 rpm; TM R050-12 |
Resinlab® EP1290 Gray Mineral Filled Epoxy Adhesive Resinlab™ EP1290 Gray is a two part mineral filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-flexible material. It has good wetting to m.. |
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Viscosity | 50000 cP | 50000 cP | Mixed; TM R050-12 |
Resinlab® EP1115 Clear Unfilled Epoxy Adhesive Resinlab™ EP1115 Clear is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and.. |