Polymer Property : Apparent Bulk Density = 0.0253 lb/in³ Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in³	ASTM D1895
Nilit Polynil® P-240 General Purpose Nylon 66 High Viscosity. Moisture content
Apparent Bulk Density	0.700 - 0.850 g/cc	0.0253 - 0.0307 lb/in³	ISO 60
Raschig Group 2557 AMC Polyester Glass fiber reinforced polyester molding compound. Very good mechanical strength, very good electrical properties and dimensional stability, exceptional processability with short cycle time and low ..
Apparent Bulk Density	0.700 - 0.850 g/cc	0.0253 - 0.0307 lb/in³	ISO 60
Raschig Group 2567 AMC Glass fiber-reinforced and inorganically filled polyester molding compound (UP) in various colors. Outstanding mechanical strength similar to BMC/SMC, very good electrical isolation properties and ..
Apparent Bulk Density	0.700 - 0.850 g/cc	0.0253 - 0.0307 lb/in³	ISO 60
Raschig Group 6501 DAIP Glass-fiber reinforced diallyl isophthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensi..
Apparent Bulk Density	0.700 - 0.850 g/cc	0.0253 - 0.0307 lb/in³	ISO 60
Raschig Group 6502 DAIP Diallyl Phthalate (DAP), Cast, Mineral Filler Glass-fiber reinforced diallyl isophthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensi..
Apparent Bulk Density	0.700 - 0.850 g/cc	0.0253 - 0.0307 lb/in³	ISO 60
Raschig Group 6551 DAIP Diallyl Phthalate (DAP), Cast, Mineral Filler Glass-fiber reinforced diallyl isophthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensi..
Apparent Bulk Density	0.700 - 0.850 g/cc	0.0253 - 0.0307 lb/in³	ISO 60
Raschig Group 6552 DAIP Glass-fiber reinforced diallyl isophthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensi..
Apparent Bulk Density	0.700 - 0.900 g/cc	0.0253 - 0.0325 lb/in³	ISO 60
Raschig Group AMPLA® 2500 melamine-modified polyester Halogen-free, organically and inorganically filled melamine-modified Polyester molding compound. Excellent elasticity and shock resistance, low post-shrinkage, very good electrical values, high heat..
Apparent Bulk Density	0.700 - 0.900 g/cc	0.0253 - 0.0325 lb/in³	ISO 60
Raschig Group AMPLA® 7500 melamine-modified polyester Organically and inorganically filled melamine modified Polyester molding compound. Low post-shrinkage, very good electrical values, excellent heat resistance, very good sliding behavior and wear sta..
Apparent Bulk Density	0.700 - 0.900 g/cc	0.0253 - 0.0325 lb/in³	ISO 60
Raschig Group DECAL® 666/8 Phenolic Glass-fiber reinforced phenolic molding compound with mineral fillers. High heat resistance, reduced mould shrinkage and post-shrinkage, good chemical resistance and mechanical properties. This prod..
Apparent Bulk Density	0.700 - 1.00 g/cc	0.0253 - 0.0361 lb/in³	ISO 60
Raschig Group EPOXIDUR® 3582 EP Epoxy Glass-fiber reinforced and inorganically filled epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures. Moldi..
Apparent Bulk Density	0.700 - 1.00 g/cc	0.0253 - 0.0361 lb/in³	ISO 60
Raschig Group EPOXIDUR® 3585 EP Epoxy, Molded, Glass Fiber Filler Glass-fiber reinforced and inorganically filled epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures, excel..
Apparent Bulk Density	0.700 - 0.800 g/cc	0.0253 - 0.0289 lb/in³	ISO 60
Raschig Group SURAPLAST 54 UPA Glass fiber reinforced polyester molding compound. Minimal mold shrinkage and post-shrinkage, very good arc resistance, very good mechanical strength. This product meets the allowed upper limits for..
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in³	ISO 60
Hexion Bakelite™ MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, High Mechanical Strength (d Melamine/phenolic molding compound, inorganically filled, glass fiber reinforced, good temperature stability, high level of mechanical properties, copper adhesive, flammability UL 94/V-0/1.6 mm (not..
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in³	Apparent density per ASTM D1895
Plenco 4759 Phenolic, Granular, Injection Molded (discontinued **) Two-stage Phenolic. PLENCO 04759 is a black, two stage, medium heat resistant phenolic molding compound. It has excellent molded finish and possesses good electrical properties. It is used in appli..
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in³	ASTM D1895
Plenco Valite 759 Novolac Phenolic, Granular, Injection Molded (discontinued **) This Valite product has been replaced by Plenco 4759. Data provided by Plenco.VALITE 759 is a black, two stage, medium heat resistant phenolic molding compound. It has excellent molded finish and p..
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in³	ASTM D1895
Plenco 506 Black Heat Resistant Mineral Filled Phenolic Molding Compound (discontinued **) Plaslok 506 is a two-stage, mineral-filled phenolic molding compound. It is formulated for automotive ashtrays and for appliance applications such as utensil handles receiving repeated exposure to ..
Apparent Bulk Density	0.700 g/cc	0.0253 lb/inÂ³	ASTM D-1875
Lubrizol Advanced Materials PearlthaneÂ® MB-9005 Thermoplastic Polyurethane Elastomer PearlthaneÂ® MB-9005 is a TPU-based color masterbatch, supplied in the form of homogenously black colored pellets. It is specially intended for coloring TPUs (either polyester or polyether-based)..
Apparent Bulk Density	0.700 g/cc	0.0253 lb/inÂ³	Method B; ASTM D1895
Solvay Specialty Polymers IxefÂ® BXT 2000-0203 Polyarylamide (PARA) IxefÂ® BXT 2000-0203 resin was developed specifically for extrusion and blow-molding processes. Unlike grades targeted for injection molding, IxefÂ® BXT 2000-0203 resin can be successfully extru..
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in³
Cosmic Plastics K31 Short Glass Fiber Filled Iso Diallyl Phthalate Molding Compound Data provided by the manufacturer.
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in³	TRM-37
Tipco Tipcolite® TG 311 Phenolic Compound, Mineral & Wood Flour, Medium Flow & High Electrical Properties Medium Flow Phenolic Compound, Reinforced with Mineral & Wood FlourApplications: Electrical & ElectronicsProcessing: Compression & TransferInformation provided by the Manufacturer, Tipco Industrie..
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in³	TRM-37
Tipco Tipcolite® TG 618 Phenolic Compound, Mineral & Wood Flour, Medium Flow & High Electrical Properties Medium Flow Phenolic Compound, Reinforced with Mineral & Wood FlourApplications: Electrical & ElectronicsProcessing: Compression & TransferInformation provided by the Manufacturer, Tipco Industrie..
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in³	Tap density
Carborundum CarboTherm™ CTH30 Boron Nitride Powder Boron Nitride powders have high thermal conductivity, low dielectric loss, and low thermal expansion. They are non-abrading to electronic components, lubricious, non-toxic, and retain their dielect..
Apparent Bulk Density	0.700 - 0.800 g/cc	0.0253 - 0.0289 lb/in³	IS 867-1963
Amity Thermosets ATS 135 Phenolic Molding Inorganic and glass fiber Filler, Compression Molded Characteristics: Self lubricating Good mechanical strength Low co-efficient of friction Good thermal conductivity Heat stable (200°C) Good mouldability Not suitable for electrical application Color..
Apparent Bulk Density	0.700 - 0.750 g/cc	0.0253 - 0.0271 lb/in³	IS 867-1963
Amity Thermosets ATS 1612 Phenolic Molding Nylon, inorganic, and glass Filler, Compression Molded Characteristics:High dielectric & mechanical strengthWeather resistant Good electric insulationLow water absorption Good mechanical tension bearing capacityColor-blackSoft/Medium flow Applications:R..
Apparent Bulk Density	0.700 - 0.850 g/cc	0.0253 - 0.0307 lb/in³	IS 867-1963
Amity Thermosets ATE 183 Phenolic Molding Mica and organic Filler, Compression Molded Characteristics:Electric low loss Low water absorption Low shrinkage Heat stableGlossy surface finishVery good mouldabilityGood electrical insulationGood chemical resistantColor-blackMedium flowAppl..
Apparent Bulk Density	0.700 - 0.750 g/cc	0.0253 - 0.0271 lb/in³	IS 867-1963
Amity Thermosets ATS 1613-G Phenolic Molding Nylon and inorganic Filler, Compression Molded Characteristics:High dielectric & mechanical strengthWeather resistant Good electric insulationLow water absorption Good mechanical tension bearing capacityColor-blackSoft/Medium flow Applications:R..
Apparent Bulk Density	0.700 - 1.30 g/cc	0.0253 - 0.0470 lb/in³	Average value: 0.950 g/cc Grade Count:5
Overview of materials for Epoxy Molding Compound This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Molding Compound". Each property range of values reported is minimum and maximum values of appropr..
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in³	ISO 60
Hexion Bakelite™ PF 4010 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage (disconti Glass fiber reinforced and inorganically filled molding compound. High heat resistance, reduced molding shrinkage, good chemical resistance and mechanical properties.Application areas: Switch housi..
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in³	ISO 60
Hexion Bakelite™ PF 8052 Phenolic Formaldehyde Resin, Resistant to High Temperatures (discontinued **) Phenolic molding compound, glass fiber reinforced and inorganically filled. Excellent heat resistance with respect to surface finish and mechanical properties.Application areas: Pan handles, heat r..