Polymer Property : Apparent Bulk Density = 0.0253 lb/in³ Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in³	ASTM D1895
Nilit Polynil® P-240 General Purpose Nylon 66 High Viscosity. Moisture content
Apparent Bulk Density	0.700 - 0.850 g/cc	0.0253 - 0.0307 lb/in³	ISO 60
Raschig Group 2557 AMC Polyester Glass fiber reinforced polyester molding compound. Very good mechanical strength, very good electrical properties and dimensional stability, exceptional processability with short cycle time and low ..
Apparent Bulk Density	0.700 - 0.850 g/cc	0.0253 - 0.0307 lb/in³	ISO 60
Raschig Group 2572 AMC Glass fiber reinforced Polyester molding compound. Very good mechanical strength, very good electrical properties and dimensional stability, good abrasion stability, high flame retardance in combin..
Apparent Bulk Density	0.700 - 0.850 g/cc	0.0253 - 0.0307 lb/in³	ISO 60
Raschig Group 6501 DAIP Glass-fiber reinforced diallyl isophthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensi..
Apparent Bulk Density	0.700 - 0.850 g/cc	0.0253 - 0.0307 lb/in³	ISO 60
Raschig Group 6502 DAIP Diallyl Phthalate (DAP), Cast, Mineral Filler Glass-fiber reinforced diallyl isophthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensi..
Apparent Bulk Density	0.700 - 0.850 g/cc	0.0253 - 0.0307 lb/in³	ISO 60
Raschig Group 6551 DAIP Diallyl Phthalate (DAP), Cast, Mineral Filler Glass-fiber reinforced diallyl isophthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensi..
Apparent Bulk Density	0.700 - 0.900 g/cc	0.0253 - 0.0325 lb/in³	ISO 60
Raschig Group AMPLA® 2500 melamine-modified polyester Halogen-free, organically and inorganically filled melamine-modified Polyester molding compound. Excellent elasticity and shock resistance, low post-shrinkage, very good electrical values, high heat..
Apparent Bulk Density	0.700 - 0.900 g/cc	0.0253 - 0.0325 lb/in³	ISO 60
Raschig Group AMPLA® 7500 melamine-modified polyester Organically and inorganically filled melamine modified Polyester molding compound. Low post-shrinkage, very good electrical values, excellent heat resistance, very good sliding behavior and wear sta..
Apparent Bulk Density	0.700 - 0.900 g/cc	0.0253 - 0.0325 lb/in³	ISO 60
Raschig Group DECAL® 572R Phenolic Glass-fiber reinforced phenolic molding compound. Exceptional heat resistance with regard to maintaining surface finish and mechanical properties, outstanding mechanical properties, excellent rotati..
Apparent Bulk Density	0.700 - 0.900 g/cc	0.0253 - 0.0325 lb/in³	ISO 60
Raschig Group DECAL® 937 Phenolic Mica reinforced phenolic molding compound. This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives 2002/95 (RoHS), 2002/96 (W..
Apparent Bulk Density	0.700 - 1.00 g/cc	0.0253 - 0.0361 lb/in³	ISO 60
Raschig Group EPOXIDUR® 3582 EP Epoxy Glass-fiber reinforced and inorganically filled epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures. Moldi..
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in³	ISO 60
Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof (discontinued ** Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t..
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in³	ASTM D1895
Plenco 501 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound (discontinued **) Plaslok 501 is a two-stage, mineral and flock-filled phenolic molding compound designed for use in heat resistant and electrical applications. It is designed for elevated temperature exposure for e..
Apparent Bulk Density	0.700 g/cc	0.0253 lb/inÂ³	Tap density
Momentive Performance Materials AC-6028 Boron Nitride (BN) Powder Grade AC-6028 consists of agglomerated particles of hexagonal Boron Nitride (BN) with a mean particle size between 100 and 150Âµ. It exhibits the unique properties of BN in a form readily used in..
Apparent Bulk Density	0.700 g/cc	0.0253 lb/inÂ³	ASTM D-1875
Lubrizol Advanced Materials PearlthaneÂ® MB-9005 Thermoplastic Polyurethane Elastomer PearlthaneÂ® MB-9005 is a TPU-based color masterbatch, supplied in the form of homogenously black colored pellets. It is specially intended for coloring TPUs (either polyester or polyether-based)..
Apparent Bulk Density	0.700 g/cc	0.0253 lb/inÂ³	Method B; ASTM D1895
Solvay Specialty Polymers IxefÂ® BXT 2000-0203 Polyarylamide (PARA) IxefÂ® BXT 2000-0203 resin was developed specifically for extrusion and blow-molding processes. Unlike grades targeted for injection molding, IxefÂ® BXT 2000-0203 resin can be successfully extru..
Apparent Bulk Density	0.700 g/cc	0.0253 lb/inÂ³	Apparent packing density; ISO 1068
SolVin 266SC Polyvinyl Chloride Pastes - filler Polymers Made by suspension polymerization. APPLICATIONS Filler polymer for plastisols. CHARACTERISTICS SolVin 266SC is a suspension resin with very low porosity, small particle size and a very low amount of..
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in³
Cosmic Plastics K31 Short Glass Fiber Filled Iso Diallyl Phthalate Molding Compound Data provided by the manufacturer.
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in³	TRM-37
Tipco Tipcolite® TG 211 Phenolic Compound, Mineral & Wood Flour, Soft Flow & High Electrical Properties Soft Flow Phenolic Compound, Reinforced with Mineral & Wood FlourApplications: Electrical & ElectronicsProcessing: Compression MoldingInformation provided by the Manufacturer, Tipco Industries Ltd..
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in³	TRM-37
Tipco Tipcolite® THD 121 Phenolic Compound, Wood Flour, having Medium Flow & High Strength Medium Flow Phenolic Compound, Reinforced with Wood FlourApplications: Electrical & ElectronicsProcessing: Compression MoldingInformation provided by the Manufacturer, Tipco Industries Ltd., India...
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in³	TRM-37
Tipco Tipcolite® TX 211 Phenolic Compound, Wood Flour, having Medium Flow & High Electrical Properties Medium Flow Phenolic Compound, Reinforced with Wood FlourApplications: Switchgear, HRC FusesProcessing: Compression MoldingInformation provided by the Manufacturer, Tipco Industries Ltd., India.
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in³	TRM-37
Tipco Tipcolite® VASW 150 Phenolic Compound, Glass Fibers & Minerals, Medium-Soft Flow & High Strength
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in³	Tap density
Carborundum CarboTherm™ CTH30 Boron Nitride Powder Boron Nitride powders have high thermal conductivity, low dielectric loss, and low thermal expansion. They are non-abrading to electronic components, lubricious, non-toxic, and retain their dielect..
Apparent Bulk Density	0.700 - 0.850 g/cc	0.0253 - 0.0307 lb/in³	IS 867-1963
Amity Thermosets ATE 183 M Phenolic Molding Mica and organic Filler, Compression Molded Characteristics:Electric low loss Low water absorption Low shrinkage Heat stableGlossy surface finishVery good mouldabilityGood electrical insulationGood chemical resistantColor-blackMedium flowAppl..
Apparent Bulk Density	0.700 - 0.750 g/cc	0.0253 - 0.0271 lb/in³	IS 867-1963
Amity Thermosets ATS 1612 Phenolic Molding Nylon, inorganic, and glass Filler, Compression Molded Characteristics:High dielectric & mechanical strengthWeather resistant Good electric insulationLow water absorption Good mechanical tension bearing capacityColor-blackSoft/Medium flow Applications:R..
Apparent Bulk Density	0.700 - 0.850 g/cc	0.0253 - 0.0307 lb/in³	IS 867-1963
Amity Thermosets ATE 183 Phenolic Molding Mica and organic Filler, Compression Molded Characteristics:Electric low loss Low water absorption Low shrinkage Heat stableGlossy surface finishVery good mouldabilityGood electrical insulationGood chemical resistantColor-blackMedium flowAppl..
Apparent Bulk Density	0.700 - 0.750 g/cc	0.0253 - 0.0271 lb/in³	IS 867-1963
Amity Thermosets ATS 1613-G Phenolic Molding Nylon and inorganic Filler, Compression Molded Characteristics:High dielectric & mechanical strengthWeather resistant Good electric insulationLow water absorption Good mechanical tension bearing capacityColor-blackSoft/Medium flow Applications:R..
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in³	ISO 60
Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m..
Apparent Bulk Density	0.700 - 1.30 g/cc	0.0253 - 0.0470 lb/in³	Average value: 0.950 g/cc Grade Count:5
Overview of materials for Epoxy Molding Compound This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Molding Compound". Each property range of values reported is minimum and maximum values of appropr..
Apparent Bulk Density	0.700 g/cc	0.0253 lb/in³	ASTM D1895
Plaslok 501 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 501 is a two-stage, mineral and flock..