Polymer Property : Glass Transition Temp, Tg = 110 °C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Glass Transition Temp, Tg	110 °C	230 °F
NextGen Adhesives G907-08 Epoxy Adhesive Description: NGAC G907-08 is a low viscosity, electrically insulating, heat cured and 2-part adhesive systems designed for applications where temperature and chemical resistance is critical. The NGA..
Glass Transition Temp, Tg	110 °C	230 °F
NextGen Adhesives G907-21 Structural Epoxy Adhesive Description: NGAC G907-21 is a high viscosity and thixotropic adhesive system that is specifically formulated for structural bonding applications: industrial, electronics and aerospace.Advantages an..
Glass Transition Temp, Tg	110 - 165 °C	230 - 329 °F	Average value: 151 °C Grade Count:5
Overview of materials for Epoxy, Encapsulating, Glass or Mineral Filled This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Encapsulating, Glass or Mineral Filled". Each property range of values reported is minimum and ma..
Glass Transition Temp, Tg	110 °C	230 °F
Eastman Tenite 383A-08 Cellulose Acetate Propionate (discontinued **) 8% Plasticized. ISO data as provided by the manufacturer, Eastman Chemical.
Glass Transition Temp, Tg	110 °C	230 °F
Eastman Tenite 371A-10 Cellulose Acetate Propionate (discontinued **) 10% Plasticized. ISO data as provided by the manufacturer, Eastman Chemical.
Glass Transition Temp, Tg	110 °C	230 °F	DSC
Wolf Kunststoff ZEDEX® ZX-530 A5D Polymer Alloy Main Characteristics: Low Creep; Low moisture absorption; Flame retardant; Low impurity ions; Good machinability; FDA compliant LABS; Extremely low outgassing; Less expensive than PEEK; Stress resis..
Glass Transition Temp, Tg	110 °C	230 °F	Ultimate Tg
Tra-Con Tra-Bond 2123 Metal Repair Steel/Epoxy Adhesive TRA-BOND 2123 is a versatile steel metal/epoxy adhesive formulation developed for modern industrial repair, casting and bonding applications where a steel-like or cast iron finish is required. This ..
Glass Transition Temp, Tg	110 °C	230 °F	Ultimate Tg
Tra-Con Tra-Bond 2230 Color Keyed, High Temperature Epoxy Adhesive TRA-BOND 2230 is a clear, low viscosity, high temperature, two-part epoxy adhesive that changes colors during the curing process to indicate cure status. The unmixed components are light yellow; the..
Glass Transition Temp, Tg	110 °C	230 °F	Ultimate Tg
Tra-Con Tra-Bond F230 Color Keyed High Temperature Epoxy Adhesive TRA-BOND F230 is a clear, low viscosity, high temperature, two-part epoxy adhesive that changes colors during the curing process to indicate cure status. The unmixed components are light yellow; the..
Glass Transition Temp, Tg	110 °C	230 °F	Ultimate Tg
Tra-Con Tra-Bond F253HV Color Keyed High Temperature Epoxy Adhesive TRA-BOND F253HV is a clear, high temperature, two-part epoxy formulation that changes colors during the curing process to indicate cure status. The unmixed components are light yellow; the mixture i..
Glass Transition Temp, Tg	110 - 120 °C	230 - 248 °F	DMA
Hexcel® HexPly® 1454 125°C Curing Epoxy Matrix HexPly® 1454 is a self-extinguishing epoxy resin system with very high self adhesion properties. It has good handling and is tolerant of a wide range of processing conditions. HexPly® 1454 is idea..
Glass Transition Temp, Tg	110 - 120 °C	230 - 248 °F	DAN 432
Hexcel® HexPly® 171/174/176 120°C Curing Epoxy Matrix The HexPly® 174 family is a range of flexible 120°C curing matrix systems for a wide variety of industrial applications and is ideally matched to the following processes: shrink wrap tape, vacuum ..
Glass Transition Temp, Tg	110 - 130 °C	230 - 266 °F	DMA
Hexcel® HexPly® M14 248°F (120°C) Curing Epoxy Matrix HexPly® M14 is a modified epoxy resin which provides good adhesion to honeycomb and foam cores. Its self-extinguishing characteristics meet the fire, smoke, and toxicity requirements of aerospace a..
Glass Transition Temp, Tg	110 °C	230 °F	DSC
Eastman Tritan FX100 Copolyester Eastman Tritan FX100 is an amorphous copolyester that combines clarity and toughness with heat and chemical resistance. Films manufactured from this new-generation copolyester can be thermoformed w..
Glass Transition Temp, Tg	110 °C	230 °F	DSC
Eastman Tritan MP100 Copolyester Eastman Tritan MP100 is an amorphous copolyester that combines excellent clarity and toughness with outstanding heat and chemical resistance. Film and sheet manufactured from this new-generation co..
Glass Transition Temp, Tg	>= 110 °C	>= 230 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding...
Glass Transition Temp, Tg	>= 110 °C	>= 230 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® CF6-2 High Temperature Epoxy Product Description: EPO-TEK® CF6-2 is a two component, high temperature and high Tg epoxy designed for fiber optic packaging. Advantages & Application Notes: The low viscosity nature allows for wi..
Glass Transition Temp, Tg	>= 110 °C	>= 230 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—250°C @ 20°C/Min
Epoxy Technology EPO-TEK® H31D Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31D is a single component, electrically conductive silver epoxy designed for die-bonding of semiconductors, including IC’s, resistors, capacitors, transistors, and d..
Glass Transition Temp, Tg	>= 110 °C	>= 230 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—250°C @ 20°C/Min
Epoxy Technology EPO-TEK® H31D-LV Epoxy Material Description: A single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and optoelectronic packaging. It i..
Glass Transition Temp, Tg	>= 110 °C	>= 230 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® H61 Unfilled Epoxy Adhesive Material Description: A single component, high Tg, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a liquid version of E..
Glass Transition Temp, Tg	110 °C	230 °F
Epoxyset Epoxibond EB-119SP Unfilled Epoxy Adhesive A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc...
Glass Transition Temp, Tg	>= 110 °C	>= 230 °F
Epoxyset Epoxiohm EO-98HT Electrically Conductive Epoxy Adhesive EO-98HT is a one component, electrically and thermally conductive, snap cure, die attach epoxy. It was designed for IC plastic packaging of semiconductors, hybrid micro-electronics, and photonic dev..
Glass Transition Temp, Tg	110 °C	230 °F
Atom Adhesives AA-BOND 2123 Epoxy Adhesive AA-BOND 2123 is a versatile steel metal/epoxy adhesive formulation developed for modern industrial repair, casting and bonding applications where a steel-like or cast iron finish is required. AA-BON..
Glass Transition Temp, Tg	110 °C	230 °F
Atom Adhesives AA-BOND 2153 Epoxy Adhesive AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits..