Polymer Property : UL RTI, Mechanical with Impact = 150 °C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
UL RTI, Mechanical with Impact	150 °C	302 °F
Resinoid 1340 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance
UL RTI, Mechanical with Impact	150 °C	302 °F
Resinoid 7051 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	UL746B
Covestro Apec® DP9-9371 High-Heat Polycarbonate, General Purpose (discontinued **) Information provided by Bayer Corporation, Plastics DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer AG and has officially adopted its new name – Covestro. This produ..
UL RTI, Mechanical with Impact	150 °C	302 °F	UL 746
Solvay Specialty Polymers Mindel® B-430 Polysulfone, Modified (PSU, Modified) (discontinued **) Mindel B-430 is a 30% glass reinforced thermoplastic with excellent dimensional stability, exceptional resistance to warp, good chemical resistance, and high stiffness. It was developed specifically..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(ALL)
Hexion Bakelite™ PF 31 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress, UL listed molding compound 1.5 mm/V-1 (All), 3 mm/V-0 (All), standardized molding compound.Applicat..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	ALL
Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	BK
Hexion Bakelite™ PF 13591 Phenolic Formaldehyde Resin, High Surface Quality, UL Listed (discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds, UL listed molding compound 1.5 mm/V-1 (BK), 3.0 mm/V-0 (BK).Application areas: Pan handles, various applications..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(BN, BK)
Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	BN, BK
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plenco 5440 Black General Purpose Phenolic Molding Compound (discontinued **) Plaslok 5440 is the replacement material for the former Union Carbide BMRS-5440. It is a two-stage, phenolic molding compound that has been successfully formulated to accommodate a very wide range ..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 501 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound (discontinued **) Plaslok 501 is a two-stage, mineral and flock-filled phenolic molding compound designed for use in heat resistant and electrical applications. It is designed for elevated temperature exposure for e..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plenco 504 Black (COM) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound (discontinued **)< Plaslok 504 is a two-stage, mineral and cellulose-filled phenolic molding compound having better impact and heat resistance than general purpose molding compounds. Since it also has good electrical..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plenco 504 Black (INJ) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound (discontinued **)< Plaslok 504 is a two-stage, mineral and cellulose-filled phenolic molding compound having better impact and heat resistance than general purpose molding compounds. Since it also has good electrical..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 5303 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound (discontinued **) Plaslok 5303 is a two-stage, mineral and flock-filled phenolic molding compound designed for use in appliance, automotive and electrical applications. It can be molded by compression, transfer or i..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 5314 Black (COM) Impact Grade Phenolic Molding Compound (discontinued **) Plaslok 5314 is the replacement material for the former Union Carbide BMMA-5314. It is a two-stage, impact grade phenolic molding compound suitable for compression, transfer or injection molding of..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.60 mm	302 °F @Thickness 0.0630 in
Plenco 309 Black (COM) Mineral/Fiber Filled Phenolic Molding Compound (discontinued **) Plaslok 309 is a two-stage, mineral and fiber-filled phenolic molding compound having excellent impact strength; and as such, is considered a good candidate for replacing chopped-fiber filled compou..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plaslok 201 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 201 is a two-stage, woodflour and min..
UL RTI, Mechanical with Impact	150 °C	302 °F	1.60 mm
Plaslok 309 Black (COM) Mineral/Fiber Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 309 is a two-stage, mineral and fiber..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.60 mm	302 °F @Thickness 0.0630 in
Plaslok 309 Black (INJ) Mineral/Fiber Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 309 is a two-stage, mineral and fiber..
UL RTI, Mechanical with Impact	150 Â°C	302 Â°F
Haysite UltratracÂ® H950 Glass Reinforced Polyester Sheet, Electrical Grade (GPO3) This new generation of high performance material meets or exceeds all requirements for NEMA GPO-2 or GPO-3. ULTRATRAC Â® H950 is recognized by U.L. as a 94V-0 material and offers greater arc and t..
UL RTI, Mechanical with Impact	150 °C	302 °F
Resinoid 1312 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance
UL RTI, Mechanical with Impact	150 °C	302 °F
Resinoid 2010 Phenolic Molding, Fabric Reinforced Data provided by the manufacturer.The Resinoid 2000 organic fiber reinforced series compounds feature mechanical strength, dimensional stability, and shock resistance
UL RTI, Mechanical with Impact	150 °C	302 °F
Resinoid 2016 Phenolic Molding, Fabric Reinforced Data provided by the manufacturer.The Resinoid 2000 organic fiber reinforced series compounds feature mechanical strength, dimensional stability, and shock resistance
UL RTI, Mechanical with Impact	150 °C @Thickness 0.750 mm	302 °F @Thickness 0.0295 in	BK
Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 302 Black Impact Grade Woodflour/Flock Filled Phenolic Molding Compound (discontinued **) Plaslok 302 is a two-stage, woodflour and flock-filled phenolic molding compound. It has low specific gravity, broad molding latitude and an excellent balance of electrical and physical properties...
UL RTI, Mechanical with Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plaslok 5000 Black General Purpose Woodflour Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use. Plaslok 5000 is the replacement material for ..
UL RTI, Mechanical with Impact	150 °C	302 °F	1.47 mm
Plaslok 5440 Black General Purpose Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5440 is the replacement material for ..
UL RTI, Mechanical with Impact	150 °C	302 °F	1.47 mm
Plaslok 7000 Black General Purpose Woodflour Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 7000 is the replacement material for ..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plaslok 5303 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5303 is a two-stage, mineral and floc..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plaslok 5314 Black (COM) Impact Grade Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5314 is the replacement material for ..