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Polymer Property : CTE, linear = 13.3 µin/in-°F Product List

Thermal Properties

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Thermal Properties Metric English Comments
CTE, linear 24.0 - 80.0 µm/m-°C
13.3 - 44.4 µin/in-°F
Average value: 52.7 µm/m-°C Grade Count:3
Overview of materials for Fluorocarbon ETFE, with Glass or Carbon Fiber Filler
This property data is a summary of similar materials in the MatWeb database for the category "Fluorocarbon ETFE, with Glass or Carbon Fiber Filler". Each property range of values reported is minimum..
CTE, linear 24.0 µm/m-°C

@Temperature 20.0 °C
13.3 µin/in-°F

@Temperature 68.0 °F
Indium Corp. Indalloy 128 Pure Tin
Information Provided by Indium Corporation
CTE, linear 24.0 µm/m-°C

@Temperature 20.0 °C
13.3 µin/in-°F

@Temperature 68.0 °F
Indium Corp. Indalloy 257 Bismuth Solder Alloy
Information Provided by Indium Corporation
CTE, linear 24.0 µm/m-°C

@Temperature 20.0 °C
13.3 µin/in-°F

@Temperature 68.0 °F
Indium Corp. Indalloy® 181 Sn-Pb-Cd Solder Alloy
Good general purpose solder in the medium temperature range. Maintains its creep strength well. Not applicable against gold.Information provided by the manufacturer, Indium Corporation.
CTE, linear 24.0 µm/m-°C

@Temperature 20.0 °C
13.3 µin/in-°F

@Temperature 68.0 °F
Indium Corp. Indalloy® 9 Sn-Pb-In Solder Alloy
General purpose solder in 160° C range with good physical properties.Information provided by the manufacturer, Indium Corporation.
CTE, linear 24.0 µm/m-°C

@Temperature 20.0 °C
13.3 µin/in-°F

@Temperature 68.0 °F
Indium Corp. Indalloy® 8 In-Sn-Cd Fusible Alloy
General purpose fusible alloy.Information provided by the manufacturer, Indium Corporation.
CTE, linear 24.0 - 34.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
13.3 - 18.9 µin/in-°F

@Temperature -22.0 - 86.0 °F
TMA
SABIC Innovative Plastics NORYL HM3020H PPE+PS (Asia Pacific)
PPE+PS GF+MF 30% filled, FR V-1, high flow
CTE, linear 24.0 µm/m-°C

@Temperature 20.0 °C
13.3 µin/in-°F

@Temperature 68.0 °F
Cosmic Plastics 6130F Long Glass Fiber Filled Ortho Diallyl Phthalate Molding Compound
Data provided by the manufacturer.
CTE, linear 24.0 µm/m-°C

@Temperature 20.0 °C
13.3 µin/in-°F

@Temperature 68.0 °F
Cosmic Plastics K61 Long Glass Fiber Filled Iso Diallyl Phthalate Molding Compound
Data provided by the manufacturer.
CTE, linear 24.0 µm/m-°C

@Temperature 20.0 °C
13.3 µin/in-°F

@Temperature 68.0 °F
Cosmic Plastics K66 Long Glass Fiber Filled Iso Diallyl Phthalate Molding Compound
Data provided by the manufacturer.
CTE, linear 24.0 µm/m-°C

@Temperature 20.0 °C
13.3 µin/in-°F

@Temperature 68.0 °F
Williams Advanced Alloys WS296 Solder
All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys
CTE, linear 24.0 µm/m-°C
13.3 µin/in-°F
Absolute Drying; ASTM-D696
Toyobo GLAMIDE® T-521 Nylon-6
GLAMIDE® is very tough and exhibits high abrasion resistance. It has a high melting point and heat resistance, has well-balanced proportions of mechanical properties, performs self-distinguishing a..
CTE, linear 24.0 µm/m-°C
13.3 µin/in-°F
Absolute Drying; ASTM-D696
Toyobo GLAMIDE® TY-181GC Nylon/Elastomer
GLAMIDE® is very tough and exhibits high abrasion resistance. It has a high melting point and heat resistance, has well-balanced proportions of mechanical properties, performs self-distinguishing a..
CTE, linear 24.0 µm/m-°C

@Temperature 20.0 °C
13.3 µin/in-°F

@Temperature 68.0 °F
Cosmic Plastics D69 Long Glass Fiber Filled Ortho Diallyl Phthalate Molding Compound
Data provided by the manufacturer.
CTE, linear 24.0 µm/m-°C
13.3 µin/in-°F
Below Tg
Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy
Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or f..
CTE, linear 24.0 µm/m-°C
13.3 µin/in-°F
Below Tg
Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
CTE, linear 24.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
13.3 µin/in-°F

@Temperature -22.0 - 86.0 °F
ASTM Test
BASF Petra® 130 FR 30% Glass Filled PET
Petra 130 FR is a 30% glass fiber reinforced, flame retardant injection molding polyethylene terephthalate feedstocks. It is recognized as UL 94V-0/5VA by Underwriters Laboratories. It is also avail..
CTE, linear 24.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
13.3 µin/in-°F

@Temperature -22.0 - 86.0 °F
ASTM Test
BASF Petra® 130 FR BK-112 30% Glass Filled PET
Petra 130 FR BK-112 is a 30% glass fiber reinforced, black pigmented, flame retardant injection molding compound based on post-consumer and post-industrial recycle polyethylene erephthalate feedstoc..
CTE, linear 24.0 µm/m-°C

@Temperature 20.0 °C
13.3 µin/in-°F

@Temperature 68.0 °F
Armstrong A-1/E Epoxy Adhesive
A brown epoxy paste formulated with enhanced wetting capabilities to hard rubbers and rigid thermoplastics. Has low outgassing characteristics at temperatures below 250°FInformation provided by El..
CTE, linear 24.0 µm/m-°C

@Temperature 20.0 °C
13.3 µin/in-°F

@Temperature 68.0 °F
AIM 52In/48Sn Solder for Photonic Packaging
Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials.
CTE, linear 24.0 µm/m-°C

@Temperature 20.0 °C
13.3 µin/in-°F

@Temperature 68.0 °F
Cosmic Plastics D62 Long Glass Fiber Filled Ortho Diallyl Phthalate Molding Compound
Data provided by the manufacturer.
CTE, linear 24.0 - 34.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
13.3 - 18.9 µin/in-°F

@Temperature -22.0 - 86.0 °F
TMA
SABIC Innovative Plastics NORYL CN5246 PPE+PS (Asia Pacific)
CTE, linear 24.0 - 35.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
13.3 - 19.4 µin/in-°F

@Temperature -22.0 - 86.0 °F
TMA
SABIC Innovative Plastics NORYL FM3020V PPE+PS (Asia Pacific)
30% filled FR high modulus foam grade
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