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- Polymer Property : CTE, linear = 8.89 µin/in-°F
Polymer Property : CTE, linear = 8.89 µin/in-°F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | X-Direction; TMA; 10°C/min; ASTM D3386; IPC-TM-650 2.4.41 |
| Rogers Corporation RT/duroid® 6002 High Frequency Laminate Features:Low loss for excellent high frequency performanceTight dielectric constant and thickness controlExcellent electrical and mechanical propertiesExtremely low thermal coefficient of dielectric.. |
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| CTE, linear | 16.0 µm/m-°C @Temperature 20.0 °C |
8.89 µin/in-°F @Temperature 68.0 °F |
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| Pyrotek B-3A REFRACTORY BOARD Pyrotek B-3A is a high density calcium silicate board specifically designed for demanding applications such as holding furnaces, launder linings and baffle plates. Its high density and superior har.. |
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| CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | ASTM D696 |
| Solvay Specialty Polymers Torlon® 5030 Polyamide-imide (PAI)
(Unverified Data**) Torlon 5030 is a 30% glass-fiber reinforced grade of polyamide-imide (PAI) resin. It offers high strength and modulus and exceptional creep resistance. It has thermal expansion characteristics simil.. |
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| CTE, linear | 16.0 - 85.5 µm/m-°C | 8.89 - 47.5 µin/in-°F | Average value: 50.8 µm/m-°C Grade Count:37 |
| Overview of materials for Epoxy Cure Resin This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Cure Resin". Each property range of values reported is minimum and maximum values of appropriate M.. |
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| CTE, linear | 16.0 µm/m-°C @Temperature 20.0 °C |
8.89 µin/in-°F @Temperature 68.0 °F |
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| Cookson Group Plaskon® SMT-B-1 LAS (146.408) Epoxy Molding Compound for PBGAs
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound optimized specifically for grid arrays (BGA/LGA) requiring low alpha particle count. It is formulated .. |
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| CTE, linear | 16.0 - 55.0 µm/m-°C | 8.89 - 30.6 µin/in-°F | Average value: 35.9 µm/m-°C Grade Count:9 |
| Overview of materials for Phenolic, Novolac, Mineral Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Mineral Filled". Each property range of values reported is minimum and maximum values.. |
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| CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 7/CF/30/BK Polyamide 610, with carbon fiber Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Especially suitable at dynamic.. |
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| CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 8-7190 High impact polyamide, with carbon fiber, toughness-modified Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Especially suitable at dynamic.. |
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| CTE, linear | 16.0 µm/m-°C @Temperature 20.0 °C |
8.89 µin/in-°F @Temperature 68.0 °F |
x-axis |
| Industrial Laminates/Norplex NP631 Paper Base Laminate Description: Hot punching grade with excellent electrical properties and low moisture absorption.Thickness Tested: 0.062", 0.125" and 0.500" |
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| CTE, linear | 16.0 - 17.1 µm/m-°C @Temperature 25.0 - 300 °C |
8.89 - 9.50 µin/in-°F @Temperature 77.0 - 572 °F |
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| Goodfellow Awa®, Nickeloid®, Simlet®, Spedex® Nickel Silver Good machinability, excellent cold working and welding characteristics. Poor hot forming. Uses include rivets, screws, zippers, optical parts and costume jewelry.Information provided by Goodfello.. |
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| CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | Absolute Drying; ASTM-D696 |
| Toyobo GLAMIDE® TY-592GHV 6T-Nylon GLAMIDE® is very tough and exhibits high abrasion resistance. It has a high melting point and heat resistance, has well-balanced proportions of mechanical properties, performs self-distinguishing a.. |
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| CTE, linear | 16.0 µm/m-°C @Temperature 20.0 °C |
8.89 µin/in-°F @Temperature 68.0 °F |
|
| CRP Technology 8601 Aerospace Grade Power Metallurgy Aluminum Alloy For Motorsport and Aerospace marketplaces: manufactured by a special powder metallurgy process using a high-energy mixing process which ensures excellent mechanical properties.Super Aluminium materi.. |
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| CTE, linear | 16.0 µm/m-°C @Temperature 0.000 - 100 °C |
8.89 µin/in-°F @Temperature 32.0 - 212 °F |
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| CLAL-MSX NICLAL 1300 0 Annealed Copper Alloy, Free Cutting Nickel-Silver Main Characteristics: Good ductilityGood corrosion resistanceTypical Applications:High volume turned partsKeysInformation provided by CLAL-MSX |
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| CTE, linear | 16.0 µm/m-°C @Temperature 0.000 - 100 °C |
8.89 µin/in-°F @Temperature 32.0 - 212 °F |
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| CLAL-MSX NICLAL 1800 0 Annealed Copper Alloy, Free Cutting Nickel-Silver Main Characteristics: Good corrosion resistanceHigh mechanical propertiesTypical Applications:Parts subject to high stressHigh quality fastenersInformation provided by CLAL-MSX |
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| CTE, linear | 16.0 µm/m-°C @Temperature 0.000 - 100 °C |
8.89 µin/in-°F @Temperature 32.0 - 212 °F |
|
| CLAL-MSX NICLAL 1800 H12 1/2 Hard Copper Alloy, Free Cutting Nickel-Silver Main Characteristics: Good corrosion resistanceHigh mechanical propertiesTypical Applications:Parts subject to high stressHigh quality fastenersInformation provided by CLAL-MSX |
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| CTE, linear | 16.0 µm/m-°C @Temperature 0.000 - 100 °C |
8.89 µin/in-°F @Temperature 32.0 - 212 °F |
|
| CLAL-MSX NICLAL 1800 H14 4/4 Hard Copper Alloy, Free Cutting Nickel-Silver Main Characteristics: Good corrosion resistanceHigh mechanical propertiesTypical Applications:Parts subject to high stressHigh quality fastenersInformation provided by CLAL-MSX |
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| CTE, linear | 16.0 µm/m-°C @Temperature 0.000 - 100 °C |
8.89 µin/in-°F @Temperature 32.0 - 212 °F |
|
| CLAL-MSX NICLAL 1300 H14 4/4 Hard Copper Alloy, Free Cutting Nickel-Silver Main Characteristics: Good ductilityGood corrosion resistanceTypical Applications:High volume turned partsKeysInformation provided by CLAL-MSX |
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| CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | x, before Tg; IPC TM-650 2.4.24 |
| Arlon 25FR Low-Cost Ceramic Hydrocarbon High Frequency, Low Loss Thermoset Laminate and Prepreg for Double-sided, Multilayer and Mixed Dielectric Printed Circuit BoardsLow loss ceramic-filled thermoset resinTight dielectric tolerance cont.. |
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| CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | IPC TM-650 2.4.41 |
| Arlon 35N Fast Cure Polyimide Laminate and Prepreg High reliability and high temperature material35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg results in low Z-direction expansi.. |
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| CTE, linear | 16.0 µm/m-°C @Temperature 20.0 °C |
8.89 µin/in-°F @Temperature 68.0 °F |
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| California Fine Wire Nickel Alloy 90 Copper Nickel Resistance Wire All values may vary dependent on specific design and usageCapabilities: WireRibbonSquareInsulatedPlatedInformation provided by California Fine Wire. |
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| CTE, linear | 16.0 µm/m-°C @Temperature 20.0 °C |
8.89 µin/in-°F @Temperature 68.0 °F |
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| AIM 80Au/20Sn Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials. |
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| CTE, linear | 16.0 µm/m-°C | 8.89 µin/in-°F | y direction |
| Arlon AD255A Glass, PTFE and Micro-Dispersed Ceramic Lower Loss and Improved Performance over Traditional AD Series.Information provided by Arlon Materials for Electronics (MED). |
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| CTE, linear | 16.0 µm/m-°C @Temperature 0.000 - 100 °C |
8.89 µin/in-°F @Temperature 32.0 - 212 °F |
IPC TM-650 2.4.24 |
| Arlon AD260A PTFE/Woven Fiberglass/Microdispersed Ceramic Filled Laminate for RF & Microwave PCBs For RF & Microwave Printed Circuit Boards. Low Loss PTFE and Ceramic Filled Composite Dielectric Constant (2.60)Low Dielectric Loss (Loss Tangent)Low Profile Copper (lower conductive losses)Low Z-d.. |
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| CTE, linear | 16.0 - 17.0 µm/m-°C | 8.89 - 9.44 µin/in-°F | IPC TM-650 2.4.41 |
| Arlon 33N Polyimide Laminate and Prepreg High reliability and high temperature material33N is a flame retardant polyimide laminate and prepreg system where the excellent high performance properties of polyimide need to be combined with fla.. |
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| CTE, linear | 16.0 - 500 µm/m-°C | 8.89 - 278 µin/in-°F | Average value: 183 µm/m-°C Grade Count:12 |
| Overview of materials for Polyethylene Terephthalate (PET), 40% Glass Reinforced This property data is a summary of similar materials in the MatWeb database for the category "Polyethylene Terephthalate (PET), 40% Glass Reinforced". Specific grades with glass content between 35% .. |
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