Polymer Property : Thermal Conductivity = 0.500 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.500 W/m-K @Temperature 80.0 °C	3.47 BTU-in/hr-ft²-°F @Temperature 176 °F	Z Direction; ASTM C518
Rogers Corporation RO3003 Ceramic-Filled PTFE Composite, High Frequency Circuit Material Features and Benefits:
Thermal Conductivity	0.500 W/m-K @Temperature 80.0 °C	3.47 BTU-in/hr-ft²-°F @Temperature 176 °F	ASTM C518
Rogers Corporation RO4535 Ceramic-Filled, Glass-Reinforced Hydrocarbon Laminate The RO4500™ Series Cost Performance Antenna Grade Laminates are ceramic-filled, glass-reinforced hydrocarbon based materials that provides the controlled dielectric constant, low loss performance a..
Thermal Conductivity	0.500 - 0.700 W/m-K	3.47 - 4.86 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group 3536 Epoxy Glass-fiber reinforced epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures. This product meets the allowed..
Thermal Conductivity	0.500 - 0.600 W/m-K	3.47 - 4.16 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group MELOPAS® 156 MF Melamine Glass fiber reinforced Melamine molding compound. This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives 2002/95 (RoHS), 200..
Thermal Conductivity	0.500 - 0.600 W/m-K	3.47 - 4.16 BTU-in/hr-ft²-°F	DIN 52 612
Raschig Group MELOPLAS® 181 MF Cellulose-reinforced, phenol-modified MF molding compound (MPF) in white and colored shades. High surface hardness, good electrical properties, good mechanical strength, high UV and heat resistanc..
Thermal Conductivity	0.500 W/m-K	3.47 BTU-in/hr-ft²-°F
Resinlab® EP1340 Medium Viscosity, Flame Retardant Epoxy Casting Resin System Resinlab™ EP1340 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034) for U..
Thermal Conductivity	0.500 - 0.600 W/m-K	3.47 - 4.16 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group RALUPOL® 8602 UP Glass-fiber reinforced polyester molding compound. Mold shrinkage similar to phenolic molding compounds, low post-shrinkage, good electrical values, excellent heat resistance, good mechanical streng..
Thermal Conductivity	0.500 W/m-K	3.47 BTU-in/hr-ft²-°F
Permabond ES569 Epoxy Resin PERMABOND® ES569 is a single-part heat cured epoxy adhesive with excellent adhesion to metal surfaces as well as composite materials. The high bond strength of this adhesive allows it to replace me..
Thermal Conductivity	0.500 - 0.580 W/m-K @Temperature 100 - 100 °C	3.47 - 4.03 BTU-in/hr-ft²-°F @Temperature 212 - 212 °F	Average value: 0.540 W/m-K Grade Count:3
Overview of materials for Phenolic, Novolac, Glass Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Glass Filled". Each property range of values reported is minimum and maximum values o..
Thermal Conductivity	0.500 W/m-K	3.47 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Lehmann & Voss LUVOCOMÂ® 7/CF/30/BK Polyamide 610, with carbon fiber Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Especially suitable at dynamic..
Thermal Conductivity	>= 0.500 W/m-K	>= 3.47 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Fluorseals PTFE Unfilled Information provided by TEKU GmbH Fluorkunststoffe, a distributor of Fluorseals materials.
Thermal Conductivity	0.500 W/m-K	3.47 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Lehmann & Voss LUVOCOMÂ® 1/XCF/30 Polyamide 66, with carbon fiber, heat stabilized Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Reduced moment of inertia comp..
Thermal Conductivity	0.500 W/m-K @Temperature 90.0 Â°C	3.47 BTU-in/hr-ftÂ²-Â°F @Temperature 194 Â°F
Schott Glass 8650 Sealing Glass Sealing glass for molybdenum, free from Na and K, of high lead content Implosion diodesInformation provided by SCHOTT AG.
Thermal Conductivity	0.500 W/m-K @Temperature 121 °C	3.47 BTU-in/hr-ft²-°F @Temperature 250 °F
Tra-Con Tra-Bond 77-1S One Component SMD Adhesive TRA-BOND 77-1S one component, solvent-free, insulating epoxy adhesive is designed specifically for attaching surface mounted devices (SMDs) to printed circuit boards prior to wave solder. TRA-BOND 7..
Thermal Conductivity	0.500 W/m-K @Temperature 100 °C	3.47 BTU-in/hr-ft²-°F @Temperature 212 °F	ASTM E1461
Plenco 4309 Phenolic, Nodular, Injection Molded PLENCO 04309 is a heat resistant, glass reinforced phenolic molding compound offering improved mechanical strength and electrical strength properties. UL recognized under component file E40654. 0430..
Thermal Conductivity	0.500 W/m-K @Temperature 100 °C	3.47 BTU-in/hr-ft²-°F @Temperature 212 °F	ASTM E1461
Plenco 4311 Phenolic, Granular, Compression Molded PLENCO 04311 is a heat resistant, mineral filled phenolic molding compound offering excellent processability, mechanical strength, and improved cold powder pourability characteristics. UL recognized..
Thermal Conductivity	0.500 W/m-K	3.47 BTU-in/hr-ft²-°F	MIL STD 883D
CoorsTek Epoxy Seal 923 (ES-923) B-staged epoxy lids ES-923 is designed for applications requiring a rapid epoxy cure cycle (10 minutes at 160° C). This accelerated seal cycle results in only a modest reduction in moisture resistance and seal strengt..
Thermal Conductivity	0.500 W/m-K	3.47 BTU-in/hr-ft²-°F	through plane; ASTM E1461
DSM Stanyl® TC154 PA46 FR(17) Thermal conductive material, Flame Retardant, Heat Stabilized
Thermal Conductivity	0.500 W/m-K	3.47 BTU-in/hr-ft²-°F	ASTM E1461
Arlon CLTE Microwave Printed Circuit Board Substrate CLTE is a ceramic powder-filled and woven micro fiberglass reinforced PTFE composite engineered to produce a stable, low water absorption laminate with a nominal Dielectric Constant of 2.98.Ceramic/..
Thermal Conductivity	0.500 W/m-K @Temperature 100 °C	3.47 BTU-in/hr-ft²-°F @Temperature 212 °F	ASTM E1225
Arlon CLTE-P Pre-Preg Bonding Layer Arlon's CLTE-P Prepreg Bonding Layer is a ceramic filled PTFE coated glass stock that is used as a bonding ply for CLTE, CLTE-X or CLTE-AT laminates. CLTE-P is a pre-preg material that consists of ..
Thermal Conductivity	0.500 - 0.600 W/m-K	3.47 - 4.16 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group MELOPLAS® 180 MF Wood flour-reinforced, phenol-modified MF molding compound (MPF) in dark colors. High surface hardness, good mechanical strength and electrical properties, good heat resistance. Self-extinguishing ..
Thermal Conductivity	0.500 W/m-K	3.47 BTU-in/hr-ft²-°F	ASTM C177
Solvay Specialty Polymers Ixef® 2010/X914 Polyarylamide, 40% Filler, DAM (discontinued **) The IXEF compounds are a family of semi-crystalline polyarylamide thermoplastics reinforced with glass fibers and/or mineral fillers for injection molding.Data provided by the manufacturer, Solvay A..
Thermal Conductivity	0.500 W/m-K	3.47 BTU-in/hr-ft²-°F
Resinlab® EP1190 Flame Retardant Epoxy Casting Resin Resinlab™ EP1190 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034, Proje..
Thermal Conductivity	0.500 W/m-K	3.47 BTU-in/hr-ft²-°F
Resinlab® EP1240RC Flame Retardant Epoxy Casting Resin Resinlab™ EP1240RC is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034, Pro..