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Polymer Property : Cure Time = 0.500 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 30.0 min @Temperature 140 °C |
0.500 hour @Temperature 284 °F |
Handling Time |
| Parker Chomerics CHOFORM® 5513 Conductive Form-in-Place Gasket Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material.. |
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| Cure Time | 30.0 - 60.0 min @Temperature 23.0 °C |
0.500 - 1.00 hour @Temperature 73.4 °F |
brass, fixture time |
| Permabond LH056 Anaerobic Threadsealant Permabond LH056 is a thread sealant designed for use in sealing metal pipes and fittings in sprinkler systems which may also contain CPVC piping. Permabond LH056 prevents leaks even on pipes that ar.. |
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| Cure Time | 30.0 min @Temperature 93.3 °C |
0.500 hour @Temperature 200 °F |
De-mold Time |
| Northstar Polymers MGG-A70DQ High Performance Polyurethane Cast Elastomer System 70A This is a PTMEG/MDI base high-performance polyurethane casting system. This system is recommended to applications in which the part requires high rebound, slide abrasion, constant water contact and.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond MM115P Pure Anaerobic Threadlocker Permabond® MM115 PURE Threadlocker is an excellent general purpose threadlocker and sealant. It is used for locking metal bolts, nuts and screws that may require disassembly for service and mainten.. |
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| Cure Time | 30.0 min @Temperature 60.0 °C |
0.500 hour @Temperature 140 °F |
|
| Gwent Electronic Materials C2070424P2 Carbon Graphite Ink This Carbon Graphite Ink is designed to be used for screen printing working electrodes. These electrodes when used in conjunction with specific oxidase type enzymes, enable the detection of many ana.. |
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| Cure Time | 30.0 min @Temperature 60.0 °C |
0.500 hour @Temperature 140 °F |
|
| Gwent Electronic Materials C2090225D7 Silver/Silver Chloride Paste Silver/Silver Chloride Paste has a ratio of Silver to Silver Chloride of 70/30. The paste is in a ready to use form at a viscosity suitable for automatic or semi-automatic screen printing. The paste.. |
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| Cure Time | 30.0 min @Temperature 200 °C |
0.500 hour @Temperature 392 °F |
second step |
| Gwent Electronic Materials C2100211D1 Silicone Based Silver Paste This ink can be used in a wide range of applications, as conductive adhesive, it has excellent chemical resistance, with good adhesion. This product has been tested at 250°C and it showed good s.. |
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| Cure Time | 30.0 min @Temperature 79.4 °C |
0.500 hour @Temperature 175 °F |
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| Master Bond Supreme 3HT-80 One Component, Toughened, Heat Curing Epoxy Master Bond Polymer System Supreme 3HT-80 is a one component, heat curing epoxy adhesive/sealant featuring excellent physical and chemical resistance properties and a minimal curing temperature of 1.. |
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| Cure Time | 30.0 min @Temperature 100 °C |
0.500 hour @Temperature 212 °F |
|
| Tra-Con Tra-Bond 400-5 Low Temperature Cure Epoxy Adhesive TRA-BOND 400-5 adhesive is a general purpose non-conductive epoxy. It combines the properties of a moderate work life with the ability to cure rapidly at temperatures as low as 60°C. Having a relat.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| Tra-Con Tra-Duct 921U02 Long Pot Life Silver-Filled Epoxy TRA-DUCT 921U02 long room temperature pot life, silver-filled epoxy. Information provided by Tra-Con Inc. |
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| Cure Time | 30.0 min @Temperature 120 °C |
0.500 hour @Temperature 248 °F |
|
| Trelleborg Emerson & Cuming Eccobond® G 909 One-Component Fast Cure Epoxy Adhesive Emerson & Cuming G 909 Eccobond® One-Component Fast Cure Epoxy AdhesiveHigh strength, thixotropic, flexible, epoxy adhesive. High peel strength (30 pli). Recommended for bonding copper, aluminum an.. |
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| Cure Time | 30.0 min @Temperature 75.0 °C |
0.500 hour @Temperature 167 °F |
|
| Tra-Con Tra-Bond 868-3N1 Room Temperature Cure Adhesive TRA-BOND 868-3N1 room temperature cure adhesive provides strong bonds to difficult-to-bond metals, such as gold, silver, copper, brass, and solder.Information provided by Tra-Con Inc. |
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| Cure Time | 30.0 min @Temperature 120 °C |
0.500 hour @Temperature 248 °F |
|
| Trelleborg Emerson & Cuming Eccobond® A316-48 One-Component Fast Cure Epoxy Adhesive Emerson & Cuming A316-48 Eccobond® One-Component Fast Cure Epoxy AdhesivePourable, fast heat curing, epoxy adhesive and insulation compound. Excellent chemical and heat resistance. Cure Type: Heat .. |
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| Cure Time | 30.0 min @Temperature 80.0 °C |
0.500 hour @Temperature 176 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 353ND-T4 Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T4 is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. This is a higher viscosity version of EPO-TEK® 353.. |
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| Cure Time | 30.0 min @Temperature 4.00 °C |
0.500 hour @Temperature 39.2 °F |
Tack Free |
| Chesterton MRS 5 Metal Rebuilding System MRS 5 is an advanced composite formulated for emergency repair and patching of metal components subject to light abrasive and corrosive conditions. It can be used to seal leaks and patch holes as we.. |
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| Cure Time | 30.0 - 180 min @Temperature 50.0 - 100 °C |
0.500 - 3.00 hour @Temperature 122 - 212 °F |
Optional |
| Abatron AboCoat 8709-3 A/B Carbon-Filled Electrically Conductive Epoxy Compound AboCoat 8709-3 A/B is a high-solid carbon-epoxy coating with various conductivity ranges widely used in silk-screening. |
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| Cure Time | 30.0 - 180 min @Temperature 50.0 - 100 °C |
0.500 - 3.00 hour @Temperature 122 - 212 °F |
|
| Abatron AboCoat 8709-8/AboCure 50-12 Nickel-Filled Electrically Conductive Epoxy Compound AboCoat 8709-8/AboCure 50-12 is a versatile nickel-epoxy conductive coating. |
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| Cure Time | 30.0 min @Temperature 177 °C |
0.500 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 30400R060 0.06" Uncured, Unsupported Silicone Rubber on Release Carrier Design/Construction:Side 1: Uncured, Unsupported Silicone RubberSubstrate: Kodacel CarrierInterleave: 0.003" PolyethyleneThis data represents typical values for the production material and should.. |
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| Cure Time | 30.0 - 180 min @Temperature 50.0 - 100 °C |
0.500 - 3.00 hour @Temperature 122 - 212 °F |
Optional |
| Abatron 8509-3 A/B Carbon-Filled Electrically Conductive Epoxy Compound 8509-3 A/B is a solventless carbon-epoxy system used as an adhesive and silk-screening material with anti-static and other lower-conductivity requirements. |
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| Cure Time | 30.0 min @Temperature 125 °C |
0.500 hour @Temperature 257 °F |
|
| ACC QSil 550SB QSI Quantum Silicones Self-Priming Silicone Potting Material QSil 550SB is a 100% silicone solids elastomer designed for electronic potting applications. The two-component system offers a hard, thermally conductive, low modulus material that is readily repair.. |
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| Cure Time | 30.0 min @Temperature 60.0 °C |
0.500 hour @Temperature 140 °F |
|
| Atom Adhesives AA-DUCT 906 Epoxy Adhesive AA-DUCT 906 represents the newest technology since the introduction of electrically conductive silver compounds. This unique formulation is based on a silver coated ceramic that results in lower mat.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
Full Cure |
| Parker Chomerics CHO-FORM 5541 Conductive Form-In-Place Gaskets Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material.. |
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| Cure Time | 30.0 min @Temperature 88.0 °C |
0.500 hour @Temperature 190 °F |
|
| Parker Chomerics CHO-SHIELD® 1091 PRIMER CHO-SHIELD 1091 is an air-drying liquid coating for enhancing the adhesion of CHO-SHIELD 2001 and 2003 corrosion resistant, electrically conductive coatings to chemically treated aluminum. CHO-SHIEL.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond A1044 Anaerobic Threadsealant Permabond® A1044 is a rapid curing sealant designed to lock and seal metal pipe connections, offering very good resistance to even the most aggressive chemicals. Permabond A1044 can be used to seal.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond A126 Anaerobic Retainer Permabond® A126 is a high-strength anaerobic adhesive for permanent assembly of coaxial assemblies or threaded metal components. The exceptionally low viscosity of this product makes it ideal for u.. |
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