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Polymer Property : Cure Time = 3.00 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 120 - 180 min @Temperature 65.0 °C |
2.00 - 3.00 hour @Temperature 149 °F |
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| Resinlab® EP1287 Filled, Flame Retardant Epoxy Syntactic Foam Resinlab™ EP1287 is a two part filled, flame retardant epoxy syntactic foam. It utilizes glass microspheres to reduce cured density and improve machinability. This product will be self-extinguishin.. |
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| Cure Time | 120 - 180 min @Temperature 60.0 °C |
2.00 - 3.00 hour @Temperature 140 °F |
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| Resin Technology Group 404 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma.. |
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| Cure Time | 60.0 - 180 min @Temperature 23.0 °C |
1.00 - 3.00 hour @Temperature 73.4 °F |
M10 steel, working strength |
| Permabond HL126 Anaerobic Threadlocker PERMABOND® HL126 Threadlocker is a water thin product for locking pre-assembled parts through wicking action. PERMABOND® HL126 Threadlocker prevents vibration loosening. Because of the low viscosi.. |
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| Cure Time | 60.0 - 180 min @Temperature 23.0 °C |
1.00 - 3.00 hour @Temperature 73.4 °F |
M10 steel, working strength |
| Permabond HM128 Anaerobic Threadlocker Permabond® HM128 Threadlocker is a high strength adhesive for permanent assembly. It is typically used for preventing vibration loosening of bolts, studs and cap screws. Full cure to a cross-linked.. |
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| Cure Time | 60.0 - 180 min @Temperature 23.0 °C |
1.00 - 3.00 hour @Temperature 73.4 °F |
M10 steel, working strength |
| Permabond MH196 Anaerobic Gasketmaker Permabond® MH196 is an anaerobic material designed for making “formed in situ” gaskets between metal surfaces. It is capable of replacing a wide range of conventional gaskets, thereby offering po.. |
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| Cure Time | 120 - 180 min @Temperature 25.0 °C |
2.00 - 3.00 hour @Temperature 77.0 °F |
Tack Free; 50% relative humidity |
| Lord Adhesives Aeroglaze® Z302 Absorptive Polyurethane Aeroglaze® Z302 absorptive polyurethane is primarily for application to substrates used in space operations. These operations include those where coatings must exhibit low outgassing characterist.. |
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| Cure Time | 120 - 180 min @Temperature 104 - 121 °C |
2.00 - 3.00 hour @Temperature 220 - 250 °F |
first |
| Master Bond EP112M Two Component, Medium Viscosity Heat Curing Cycloaliphatic Epoxy Resin Product Description: Master Bond Polymer System EP112M is a solventless, medium viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor .. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
Overnight at 75°F followed by |
| Master Bond EP21ARHT Two component epoxy adhesive, sealant, coating and encapsulating system Product Description: Master Bond EP21ARHT is a two component epoxy resin system for high performance bonding, sealing, coating and encapsulating. It has a convenient 100 to 50 mix ratio by weight an.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP21LV-LO Two Component, Lower Viscosity, Room Temperature Curing Epoxy System Product Description: Master Bond EP21LV-LO is a two component, lower viscosity, room temperature curing epoxy system for high performance bonding, sealing, coating and encapsulation. This user frien.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP21NDLO Low Outgassing, Room Temperature Curing Two Component Epoxy Master Bond EP21ND-LO is a two component, room temperature curing epoxy system for bonding, sealing and coating featuring outstanding physical properties. EP21ND-LO has a convenient one to one mix r.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP30AN-1 Low Viscosity, NASA Low Outgassing Epoxy Description: Master Bond EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring high thermal conductivity, excellent electrical insulation properties and N.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP30P Epoxy Bonds Glass, Polycarbonates and Acrylics Description: Master Bond Polymer Adhesive EP30P is a two component, transparent, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is for.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP37-3FLFAN Electrically Isolating, Flexible Epoxy Description: Master Bond Polymer System EP37-3FLFAN is a two component system for high performance potting, bonding, sealing and coating that is formulated to cure at room temperature or more rapidl.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP42HT-2Med Epoxy Meets USP Class VI Requirements Description: Master Bond Polymer System EP42HT-2Med is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along wit.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
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| Master Bond MasterSil 156 Two Part, Low Viscosity Silicone Description: Master Bond MasterSil 156 is a two component, lower viscosity silicone system for high performance potting, encapsulation and sealing. MasterSil 156 combines high temperature resistance.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
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| Master Bond EP21TPFL-1AO Two Part, Flexible, Lower Viscosity Epoxy Polysulfide System Product Description: Master Bond EP21TPFL-1AO is a two component, low viscosity epoxy polysulfide for high performance bonding, sealing, coating and casting offering thermal conductivity, electrical.. |
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| Cure Time | 120 - 180 min @Temperature 100 °C |
2.00 - 3.00 hour @Temperature 212 °F |
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| Master Bond EP30LV Optically Clear, Low Viscosity Epoxy Adhesive Description: Master Bond Polymer System EP30LV is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or mo.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
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| Master Bond EP30LV-1 Ultra Low Viscosity, Two Part Epoxy System Description: Master Bond Polymer System EP30LV-1 is an ultra low viscosity, two component epoxy system for high performance bonding, coating, sealing, potting and encapsulation. It readily cures at .. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP30M4 Chemically Resistant Two Component Epoxy System Master Bond Polymer System EP30M4 is a two component epoxy system for high performance bonding, sealing and encapsulation. This system features a forgiving 100 to 60 mix ratio by weight. EP30M4 resi.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
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| Master Bond EP30MED USP Class VI Certified Two Component Epoxy System Master Bond EP30Med is a two component, optically clear, low viscosity epoxy resin system for high performance bonding, sealing, coating, and encapsulating. It features excellent physical and electr.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
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| Master Bond EP30QF Quartz Filled, Two Component Epoxy System Master Bond Polymer System EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and casting that is formulated to cure at room temperature or more rapidly at.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond Supreme 33CLV Two Component, Room Temperature Curing Toughened Epoxy Master Bond Polymer System Supreme 33CLV is a special, room temperature curing, toughened epoxy adhesive/sealant, featuring exceptionally high temperature resistance. This innovative system has outs.. |
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| Cure Time | 120 - 180 min @Temperature 100 °C |
2.00 - 3.00 hour @Temperature 212 °F |
|
| Abatron AboCast 8103-24 High-Performance Dielectric Epoxy AboCast 8103-24 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has an exc.. |
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| Cure Time | 120 - 180 min @Temperature 150 - 160 °C |
2.00 - 3.00 hour @Temperature 302 - 320 °F |
|
| Abatron AboCast/AboCure 8502-1 Epoxy AboCast/AboCure 8502-1 is a solventless clear Epoxy System, used as a casting, adhesive, and impregnating resin for transformers, capacitors, coils, and other electronic components requiring a low-v.. |
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| Cure Time | 30.0 - 180 min @Temperature 50.0 - 100 °C |
0.500 - 3.00 hour @Temperature 122 - 212 °F |
Optional |
| Abatron AboCoat 8709-12/AboCure 50-12 Silver-Filled Electrically Conductive Epoxy Compound AboCoat 8709-12/AboCure 50-12 is a versatile silver-epoxy high-solids coating with good conductive and adhesive properties. It is successful as a conductive compound for most electronic uses. |
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| Cure Time | 30.0 - 180 min @Temperature 50.0 - 100 °C |
0.500 - 3.00 hour @Temperature 122 - 212 °F |
Optional |
| Abatron AboWeld 8201-14/AboCure 8201-14 Carbon-Filled Electrically Conductive Epoxy Compound AboWeld 8201-14/AboCure 8201-14 is an easy-to-use and very conductive carbon-epoxy paste. As the size of the conductive particles is relatively coarse, this product is used primarily as a thick adhe.. |
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| Cure Time | 30.0 - 180 min @Temperature 50.0 - 100 °C |
0.500 - 3.00 hour @Temperature 122 - 212 °F |
Optional |
| Abatron 8509-4 A/B Carbon-Filled Electrically Conductive Epoxy Compound 8509-4 A/B is a solventless carbon-epoxy system used as an adhesive and silk-screening material with anti-static and other lower-conductivity requirements. |
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| Cure Time | 120 - 180 min @Temperature 121 °C |
2.00 - 3.00 hour @Temperature 250 °F |
|
| Abatron AboCast 8708-10 One-Component Structural/Dielectric Epoxy AboCast 8708-10 is a highly filled, class H (180°C) structural, castable adhesive compound for FAST high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating; Em.. |
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| Cure Time | 60.0 - 180 min @Temperature 23.0 °C |
1.00 - 3.00 hour @Temperature 73.4 °F |
M10 steel, working strength |
| Permabond MH052 Anaerobic Threadsealant Permabond® MH052 is ideal for the sealing of threaded joints. It is approved for use with natural gas and LPG for working pressure up to 20 bar (290 psi) and also for gaseous oxygen up to 10 bar (1.. |
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