Polymer Property : Cure Time = 30.0 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	30.0 min @Temperature 23.0 °C	0.500 hour @Temperature 73.4 °F	Zinc, handling strength
Permabond HH131 High Temperature Threadlocker Permabond® HH131 is a very high temperature resistant, high strength anaerobic threadlocker and sealant. This material cures in the absence of air between tight fitting metal parts. It is used for ..
Cure Time	30.0 min @Temperature 23.0 °C	0.500 hour @Temperature 73.4 °F	Brass, working strength
Permabond HL126 Anaerobic Threadlocker PERMABOND® HL126 Threadlocker is a water thin product for locking pre-assembled parts through wicking action. PERMABOND® HL126 Threadlocker prevents vibration loosening. Because of the low viscosi..
Cure Time	30.0 min @Temperature 23.0 °C	0.500 hour @Temperature 73.4 °F	Zinc, handling strength
Permabond MH196 Anaerobic Gasketmaker Permabond® MH196 is an anaerobic material designed for making “formed in situ” gaskets between metal surfaces. It is capable of replacing a wide range of conventional gaskets, thereby offering po..
Cure Time	30.0 min @Temperature 121 °C	0.500 hour @Temperature 250 °F
Parker Chomerics CHO-BOND 1029 Conductive Adhesive CHO-BOND® 1029 is a highly conductive silicone adhesive, intended for bonding Chomerics’ conductive silicone EMI gaskets to electrically conductive substrates. It is a two-component, siliver-plate..
Cure Time	30.0 min @Temperature 125 °C	0.500 hour @Temperature 257 °F	after 4 hrs at RT
Parker Chomerics CHO-BOND 2165 Polyurethane Sealant Conductive sealant is a stabilized copper filled, two component polyurethane. It has excellent electrical and physical properties for aerospace and military applications. CHO-BOND® 2165 sealant is ..
Cure Time	30.0 min @Temperature 23.0 °C	0.500 hour @Temperature 73.4 °F	Brass, working strength
Permabond MM115P Pure Anaerobic Threadlocker Permabond® MM115 PURE Threadlocker is an excellent general purpose threadlocker and sealant. It is used for locking metal bolts, nuts and screws that may require disassembly for service and mainten..
Cure Time	30.0 min @Temperature 250 °C	0.500 hour @Temperature 482 °F
Resin Technology Group TIGA 901 Room Temperature Curing Silver Conductive Epoxy 100 parts resin to 6 parts hardener. Cure 24 hours at 25°C, 1-4 hours at 65°C, 30-60 minutes at 125°C, or 30 minutes at 150°C.TIGA 901 is an electrically conductive, silver filled epoxy adhesiv..
Cure Time	30.0 - 60.0 min @Temperature 125 °C	0.500 - 1.00 hour @Temperature 257 °F
Resin Technology Group TIGA 901 Room Temperature Curing Silver Conductive Epoxy 100 parts resin to 6 parts hardener. Cure 24 hours at 25°C, 1-4 hours at 65°C, 30-60 minutes at 125°C, or 30 minutes at 150°C.TIGA 901 is an electrically conductive, silver filled epoxy adhesiv..
Cure Time	30.0 min @Temperature 130 Â°C	0.500 hour @Temperature 266 Â°F	box oven
Gwent Electronic Materials C2090819P2 Silver Ink This product is part of a range of Heat Curable Inks designed specifically for use in Photovoltaic panels. These products are based on a unique curing process that results in the low temperature fo..
Cure Time	30.0 min @Temperature 60.0 Â°C	0.500 hour @Temperature 140 Â°F
Gwent Electronic Materials C60531D1 Silver / Silver Chloride Paste C60531D1 has a ratio of Silver to Silver Chloride of 90/10. This is used for reference electrodes in Medical Diagnostics, Environmental Sensor and the "Agri-Food" Industries. It forms part of a fa..
Cure Time	30.0 min @Temperature 200 Â°C	0.500 hour @Temperature 392 Â°F	second step
Gwent Electronic Materials D2090126D2 Black Solder mask Dielectric This product has been designed as a solder mask dielectric for use at high temperatures. It has been tested at 250Â°C and was proved to be stable for 4 weeks. Screen Printing Equipment: semi-autom..
Cure Time	30.0 min @Temperature 130 °C	0.500 hour @Temperature 266 °F
Uniseal BETABRACE™ 85001 Epoxy BETABRACE™ 85001 is a composite used for reinforcing sheet metal. It is composed of a moderate temperature curing tacky polymer, woven glass fabric, and release paper. BETABRACE™ 85001 provides ..
Cure Time	30.0 min @Temperature 120 °C	0.500 hour @Temperature 248 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® 354 High Temperature Epoxy Product Description: EPO-TEK® 354 is a two component, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally i..
Cure Time	30.0 min @Temperature 100 °C	0.500 hour @Temperature 212 °F	minimum
Epoxy Technology EPO-TEK® OD2002 High Temperature Epoxy Material Description: High Tg version of EPO-TEK®353ND with low modulus and good toughness. Replacement for EPO-TEK® 364. Complies with USP Class VI biocompatibility standards.Information Provid..
Cure Time	30.0 min @Temperature 80.0 °C	0.500 hour @Temperature 176 °F	Pre-Bake, Minimum Bond Line
Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-a..
Cure Time	30.0 min @Temperature 177 °C	0.500 hour @Temperature 350 °F	Recommended Cure Cycle
Arlon 32400R060 0.060" (1.52 mm) Uncured Silicone Rubber on PET Carrier Design/Construction:Side 1: Uncured Silicone RubberCarrier: PETInterleave: PolyethyleneAppearance: Red silicone rubber on polymer linerThis data represents typical values for the production material..
Cure Time	30.0 min @Temperature 93.3 °C	0.500 hour @Temperature 200 °F	Step 1, preceeded by >30 min. air set
Aremco Aremco-Seal™ 617 High Temperature Glass Coating Glass-filled adhesive/sealer for use with porous ceramics and refractories to 1500 ºF (816 ºC).
Cure Time	30.0 min @Temperature 177 °C	0.500 hour @Temperature 350 °F	Recommended Cure Cycle
Arlon 32400R040 0.040" (1.02 mm) Uncured Silicone Rubber on PET Carrier Design/Construction:Side 1: Uncured Silicone RubberCarrier: PETInterleave: PolyethyleneAppearance: Red silicone rubber on polymer linerThis data represents typical values for the production material..
Cure Time	30.0 min @Temperature 204 °C	0.500 hour @Temperature 400 °F	alternate cure
Aremco Aremco-Bond™ 2330 High Performance Epoxide Single-Part, Heat Curable, Silicone Elastomer Adhesive
Cure Time	30.0 min @Temperature 75.0 °C	0.500 hour @Temperature 167 °F	Dry to handle, at 50% humidity and 75°C
Blue River Coatings Primer Sealer-PSWP BLUE RIVER COATINGS PRIMER SEALER-PSWP is a high quality, single component primer formulated specifically for priming wood, vinyl, and most plastic substrates. Performance obtained is equal or super..
Cure Time	30.0 min @Temperature 150 °C	0.500 hour @Temperature 302 °F	Full Cure
Parker Chomerics CHO-FORM 5541 Conductive Form-In-Place Gaskets Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..
Cure Time	30.0 min @Temperature 23.0 °C	0.500 hour @Temperature 73.4 °F	Stainless steel, handling strength
Permabond MH052 Anaerobic Threadsealant Permabond® MH052 is ideal for the sealing of threaded joints. It is approved for use with natural gas and LPG for working pressure up to 20 bar (290 psi) and also for gaseous oxygen up to 10 bar (1..
Cure Time	30.0 min @Temperature 25.0 °C	0.500 hour @Temperature 77.0 °F
Henkel Frekote 55-NC Mold Release Agent A non-CFC release agent designed to provide multiple releases with no contaminating transfer. This semi permanent release system chemically bonds to the mold surface to form a microthin film that is..
Cure Time	30.0 min @Temperature 23.0 °C	0.500 hour @Temperature 73.4 °F	Stainless steel, handling strength
Permabond A1046 Anaerobic Retainer Permabond® A1046 is a rapid curing adhesive designed to provide permanent locking and sealing of metal parts such as bearings, gears, pulleys and threaded components. It exhibits high strength and ..