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AIM 58Bi/42Sn Solder for Photonic Packaging

Category Metal , Nonferrous Metal , Bismuth Alloy , Solder/Braze Alloy
Manufacturer AIM Specialty Materials
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF AIM 58Bi/42Sn Solder for Photonic Packaging.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials.
Physical Properties Metric English Comments
Density 8.56 g/cc
0.309 lb/in³
Mechanical Properties Metric English Comments
Tensile Strength, Ultimate 379 MPa
55000 psi
Thermal Properties Metric English Comments
CTE, linear 14.0 µm/m-°C

@Temperature 20.0 °C
7.78 µin/in-°F

@Temperature 68.0 °F
Melting Point 138 °C
280 °F
Solidus 138 °C
280 °F
Liquidus 138 °C
280 °F
Component Elements Properties Metric English Comments
Bismuth, Bi 58 %
58 %
Tin, Sn 42 %
42 %
Descriptive Properties Value Comments
Creep Resistance Moderate
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