Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Arlon 45NK Woven Kevlar® Reinforced Laminate and Prepreg

Category Polymer , Thermoset , Epoxy , Epoxy/Carbon Fiber Composite
Manufacturer Arlon
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Arlon 45NK Woven Kevlar® Reinforced Laminate and Prepreg.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
45NK is a woven Kevlar® aramid fiber reinforced multifunctional epoxy laminate system engineered to provide in-plane CTE values as low as 6 ppm/°C for compatibility with leadless alumina ceramic chip carriers (LCCCs) and other low expansion SMT devices where control of laminate expansion is critical for solder joint reliability. 45NK exceeds the requirements of IPC-4101/50 (Type AFG).High Tg (170°C) for improved reliability through process and in-useLow Dielectric Constant 3.9High modulus (19 Mpsi) p-aramid woven fiber reinforcement with CTE of -4 ppm/°C provides superior X-Y CTE of 5-7 ppm/°CProcess compatible with conventional high Tg multifunctional epoxy systems100% Organic resin/reinforcement system is suitable for laser drillingRoHS/WEEE compliantTypical Applications:SMT Board Designs using LCCCs or other low expansion chip carriersSMT Designs requiring both low in-plane CTE and laser drillingThis data represents typical values for the production material and should not be used as material specifications.Information provided by ARLON Silicone Technologies Division.
Physical Properties Metric English Comments
Density 1.50 g/cc
0.0542 lb/in³
ASTM D792 Method A
Water Absorption 0.80 %
0.80 %
IPC TM-650 2.6.2.1
Mechanical Properties Metric English Comments
Modulus of Elasticity 27.6 GPa
4000 ksi
IPC TM-650 2.4.18.3
Poissons Ratio 0.20
0.20
ASTM D3039
Peel Strength 1.05 kN/m
6.00 pli
To Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8
1.05 kN/m
6.00 pli
To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
1.05 kN/m
6.00 pli
To Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2
Thermal Properties Metric English Comments
CTE, linear 5.00 - 7.00 µm/m-°C
2.78 - 3.89 µin/in-°F
IPC TM-650 2.4.41
CTE, linear, Transverse to Flow 75.0 µm/m-°C
41.7 µin/in-°F
z, below Tg; IPC TM-650 2.4.24
225 µm/m-°C
125 µin/in-°F
z, above Tg; IPC TM-650 2.4.24
Thermal Conductivity 0.220 W/m-K
1.53 BTU-in/hr-ft²-°F
ASTM E1461
Glass Transition Temp, Tg 170 °C
338 °F
DSC; IPC TM-650 2.4.25
Flammability, UL94 V-0
V-0
Electrical Properties Metric English Comments
Volume Resistivity 1.30e+13 ohm-cm
1.30e+13 ohm-cm
C96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 3.20e+13 ohm
3.20e+13 ohm
C96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant 3.9

@Frequency 1.00e+6 Hz
3.9

@Frequency 1.00e+6 Hz
may vary with resin %; IPC TM-650 2.5.5.3
Dielectric Strength >= 29.5 kV/mm
>= 750 kV/in
IPC TM-650 2.5.6.2
Dissipation Factor 0.016

@Frequency 1.00e+6 Hz
0.016

@Frequency 1.00e+6 Hz
IPC TM-650 2.5.5.3
Descriptive Properties Value Comments
Z-Axis Expansion (%) 2.8
IPC TM-650 2.4.24 (50-260°C)
Users viewing this material also viewed the following:
Copyright © lookpolymers.com All Rights Reserved