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Parker Chomerics CHO-BOND 4669 Conductive Caulk/Sealant

Category Polymer , Adhesive , Thermoset
Manufacturer Parker Chomerics
Trade Name CHO-BOND
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics CHO-BOND 4669 Conductive Caulk/Sealant.pdf
Price EMAIL US    sales@lookpolymers.com
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Material Notes:
Chomerics two-component conductive epoxy caulks provide excellent adhesion to dissimilar substrates and can be used in lap or butt joint applications. They feature large silver-plated-copper particles that make them well suited for sealing poorly toleranced surfaces.Information provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 1.70 - 2.30 g/cc
1.70 - 2.30 g/cc
Volatile Organic Compounds (VOC) Content 361 g/l
361 g/l
Volatiles 10 - 20 %
10 - 20 %
Thickness >= 381 microns
>= 15.0 mil
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 100 °C
212 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Flash Point >= 28.9 °C
>= 84.0 °F
Component Elements Properties Metric English Comments
Copper, Cu <= 60 %
<= 60 %
Silver, Ag <= 10 %
<= 10 %
Electrical Properties Metric English Comments
Volume Resistivity <= 0.080 ohm-cm
<= 0.080 ohm-cm
Processing Properties Metric English Comments
Cure Time 10100 min

@Temperature 23.0 °C
168 hour

@Temperature 73.4 °F
Shelf Life 6.00 Month
6.00 Month
Descriptive Properties Value Comments
Amorphous fumed silica wt. % Max 5
Binder Polyisobutylene
Color Gray/silver
Consistency Gritty Paste
Coverage (cm^2 / g) 12.8
Ethyl Benzene wt. % 4
Filler Ag/Cu
Mix Ratio 1-part
Physical Form Gray/silver liquid with a solvent odor
Polyisobutylene wt. % Max 20
Working Life hr. 2.5
Xylene wt. % 10-20
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