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Parker Chomerics THERM-A-GAP™ GEL 8010 High Performance Fully Cured Dispensable Gel

Category Fluid
Manufacturer Parker Chomerics
Trade Name THERM-A-GAP™ GEL
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics THERM-A-GAP™ GEL 8010 High Performance Fully Cured Dispensable Gel.pdf
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Material Notes:
Description: Parker Chomerics fully cured dispensable GELs eliminate time consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) complexity. These products require no mixing or curing, providing superior design flexibility. Provides low thermal impedance at thin and thick gaps, allowing use of common heat spreaders; Lower temperature increases product life, typically a doubling of life based on every 10°C decrease in temperature; Deflects easily under very low compressive forces, decreasing stress on components thus decreasing component failures.Typical Applications: Automotive Electronic Control Units (ECU’s), Power Supplies & Semiconductors, Memory & Power Modules, Microprocessors/Graphics Processors, and Flat Panel Displays & Consumer Electronics.Features/Benefits: Easily dispensable, Fully-cured/No pump out, High bulk thermal conductivity, Low thermal impedance, Ultra low compression force, High tack surface & reworkable and Proven long-term reliability.Product Attributes: Thin bondline gel (approximately 2-10 mils), Low thermal impedance gel, Stencil printable with no pump out, Ideal for high-volume dispensing, and Proven long-term reliability.Information provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 2.70 g/cc
2.70 g/cc
ASTM D792
Thickness >= 50.0 microns
>= 1.97 mil
Bondline thickness
Deformation 27 %

@Pressure 0.00345 MPa
27 %

@Pressure 0.500 psi
Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min; Modified ASTM C165
45 %

@Pressure 0.00689 MPa
45 %

@Pressure 1.00 psi
Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min; Modified ASTM C165
52 %

@Pressure 0.0103 MPa
52 %

@Pressure 1.50 psi
Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min; Modified ASTM C165
57 %

@Pressure 0.0138 MPa
57 %

@Pressure 2.00 psi
Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min; Modified ASTM C165
60 %

@Pressure 0.0172 MPa
60 %

@Pressure 2.50 psi
Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min; Modified ASTM C165
63 %

@Pressure 0.0207 MPa
63 %

@Pressure 3.00 psi
Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min; Modified ASTM C165
65 %

@Pressure 0.0241 MPa
65 %

@Pressure 3.50 psi
Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min; Modified ASTM C165
Outgassing - Total Mass Loss 0.34 %
0.34 %
CVCM; ASTM E595
1.33 %
1.33 %
TML; ASTM E595
Thermal Properties Metric English Comments
CTE, linear 150 µm/m-°C
83.3 µin/in-°F
ASTM E831
Specific Heat Capacity 1.00 J/g-°C
0.239 BTU/lb-°F
ASTM E1269
Thermal Conductivity 3.00 W/m-K
20.8 BTU-in/hr-ft²-°F
ASTM D5470
Maximum Service Temperature, Air 200 °C
392 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Flammability, UL94 V-0
V-0
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+14 ohm-cm
1.00e+14 ohm-cm
ASTM D257
Dielectric Constant 6.3

@Frequency 1.00e+6 Hz
6.3

@Frequency 1.00e+6 Hz
ASTM D150
Dielectric Strength 8.00 kV/mm
203 kV/in
ASTM D149
Dissipation Factor 0.0020

@Frequency 100000 Hz
0.0020

@Frequency 100000 Hz
Chomerics
Processing Properties Metric English Comments
Shelf Life 18.0 Month
18.0 Month
From date of Manufacture
Descriptive Properties Value Comments
Color White
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