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Rogers Corporation TMM® TMM3 Ceramic Thermoset Polymer Composite

Category Polymer , Thermoset
Manufacturer Rogers Corporation
Trade Name TMM®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Rogers Corporation TMM® TMM3 Ceramic Thermoset Polymer Composite.pdf
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Material Notes:
TMM® Thermoset microwave materials are ceramic thermoset polymer composites designed for high plate-thru-hole reliability stripline and microstrip applications. The electrical and mechanical properties of TMM laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialized production techniques common to these materials.Features:Wide range of dielectric constants. Ideal for single material systems on a wide variety of applications.Excellent mechanical properties. Resists creep and cold flow.Exceptionally low thermal coefficient of dielectric constant.Coefficient of thermal expansion matched to copper. High reliability of plated through holes.Resistant to process chemicals. No damage to material during fabrication and assembly processes.Thermoset resin for reliable wirebonding. No specialized production techniques required. TMM 10 and 10i laminates can replace alumina substrates.Lead-free process compatibleTypical Applications:RF and Microwave CircuitryGlobal Positioning Systems AntennasPower Amplifiers and CombinersPatch AntennasFilters and CouplerDielectric Polarizers and LensesSatellite Communication SystemsChip TestersInformation provided by Rogers Corporation.
Physical Properties Metric English Comments
Specific Gravity 1.78 g/cc
1.78 g/cc
ASTM D792
Water Absorption 0.060 %

@Thickness 1.27 mm
0.060 %

@Thickness 0.0500 in
D/48/50; ASTM D570
0.12 %

@Thickness 3.17 mm
0.12 %

@Thickness 0.125 in
D/48/50; ASTM D570
Thickness 381 - 12700 microns
15.0 - 500 mil
Range of Standard Thicknesses
Mechanical Properties Metric English Comments
Flexural Strength 114 MPa
16500 psi
X, Y direction; Condition A; ASTM D790
Flexural Modulus 11.9 GPa
1730 ksi
X, Y direction; Condition A; ASTM D790
Izod Impact, Notched 0.176 J/cm
0.330 ft-lb/in
X, Y direction; ASTM D256A
Peel Strength 0.999 kN/m
5.70 pli
X, Y direction; after solder float 1 oz. EDC; IPC-TM-650 2.4.8
Thermal Properties Metric English Comments
CTE, linear 15.0 µm/m-°C

@Temperature 0.000 - 140 °C
8.33 µin/in-°F

@Temperature 32.0 - 284 °F
X-, Y-Direction; ASTM D3386
23.0 µm/m-°C

@Temperature 0.000 - 140 °C
12.8 µin/in-°F

@Temperature 32.0 - 284 °F
Z-Direction; ASTM D3386
Specific Heat Capacity 0.870 J/g-°C
0.208 BTU/lb-°F
calculated
Thermal Conductivity 0.700 W/m-K

@Temperature 80.0 °C
4.86 BTU-in/hr-ft²-°F

@Temperature 176 °F
ASTM C518
Decomposition Temperature 425 °C
797 °F
TGA; ASTM D3850
Electrical Properties Metric English Comments
Volume Resistivity 3.00e+15 ohm-cm
3.00e+15 ohm-cm
ASTM D257
Surface Resistance >= 9.00e+15 ohm
>= 9.00e+15 ohm
ASTM D257
Insulation Resistance >= 2.00e+12 ohm
>= 2.00e+12 ohm
C/96/60/95; ASTM D257
Dielectric Constant 3.238 - 3.302

@Frequency 1.00e+10 Hz
3.238 - 3.302

@Frequency 1.00e+10 Hz
Z direction; IPC-TM-650 2.5.5.5
Dissipation Factor 0.0020

@Frequency 1.00e+10 Hz
0.0020

@Frequency 1.00e+10 Hz
Z direction; IPC-TM-650 2.5.5.5
Descriptive Properties Value Comments
Thermal Coefficient of Dielectric Constant 37 ppm/°C
IPC-TM-650 2.5.5.5; -55°C to 125°C
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