| Category | Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive |
| Manufacturer | Devcon |
| Trade Name | |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Devcon Wear Guard (High Load) Epoxy.pdf |
| Price | EMAIL US sales@lookpolymers.com |
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 2.15 g/cc | 0.0775 lb/in³ |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 87 | 87 | ASTM D2240 |
| Tensile Strength, Ultimate | 29.0 MPa | 4210 psi | ASTM D638 |
| Modulus of Elasticity | 5.86 GPa | 850 ksi | In Tension; ASTM D638 |
| Flexural Yield Strength | 49.2 MPa | 7140 psi | ASTM D790 |
| Compressive Yield Strength | 75.8 MPa | 11000 psi | ASTM D695 |
| Adhesive Bond Strength | 16.38 MPa | 2375 psi | Adhesive tensile shear strength; ASTM D1002 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 58.0 µm/m-°C @Temperature 20.0 °C |
32.2 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Thermal Conductivity | 0.732 W/m-K | 5.07 BTU-in/hr-ft²-°F | ASTM C177 |
| Maximum Service Temperature, Air | 149 °C | 300 °F | Operating Temperature |
| Shrinkage | 0.060 % | 0.060 % | During Cure; ASTM D2566 |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Dielectric Constant | 41 | 41 | ASTM D150 |
| Dielectric Strength | 13.4 kV/mm | 340 kV/in | ASTM D149 |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Processing Temperature | 21.1 °C | 70.0 °F | |
| Pot Life | 45.0 min @Temperature 23.9 °C |
45.0 min @Temperature 75.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Coverage per lb. | 50 in² | at 1/4 inch thick |
| Mix Ratio by Volume | 2 to 1 | resin:hardener |
| Mix Ratio By Weight | 2 to 1 | resin:hardener |