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- Indium Corp. Indalloy® 158 Bi-Pb-Sn-Cd Solder Alloy
Indium Corp. Indalloy® 158 Bi-Pb-Sn-Cd Solder Alloy
| Category | Metal , Nonferrous Metal , Bismuth Alloy |
| Manufacturer | Indium Corporation of America |
| Trade Name | Indalloy® |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Indium Corp. Indalloy® 158 Bi-Pb-Sn-Cd Solder Alloy.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Lowest melting point solder. Good fusible alloy used for lens blocking.Information provided by the manufacturer, Indium Corporation.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 9.58 g/cc | 0.346 lb/in³ |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Brinell | 14.5 @Load 4.00 kg |
14.5 @Load 8.82 lb |
2mm ball |
| Tensile Strength, Ultimate | 41.3 MPa | 5990 psi | |
| Elongation at Break | 120 % | 120 % | % elongation on 5.65 (sq. root Area) gauge length |
| Shear Strength | 2.10 MPa | 305 psi | Shear Bond Holding Strength |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Heat of Fusion | 39.8 J/g | 17.1 BTU/lb | |
| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
|
| Specific Heat Capacity | 0.146 J/g-°C | 0.0349 BTU/lb-°F | Solid |
| 0.184 J/g-°C | 0.0440 BTU/lb-°F | Liquid | |
| Thermal Conductivity | 18.0 W/m-K @Temperature 85.0 °C |
125 BTU-in/hr-ft²-°F @Temperature 185 °F |
|
| Melting Point | 70.0 °C | 158 °F | Eutectic |
| Solidus | 70.0 °C | 158 °F | |
| Liquidus | 70.0 °C | 158 °F |
| Component Elements Properties | Metric | English | Comments |
|---|---|---|---|
| Bismuth, Bi | 50 % | 50 % | |
| Cadmium, Cd | 10 % | 10 % | |
| Lead, Pb | 26.7 % | 26.7 % | |
| Tin, Sn | 13.3 % | 13.3 % |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Electrical Resistivity | 0.0000430 ohm-cm | 0.0000430 ohm-cm |
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