| Category | Polymer , Adhesive , Thermoset , Silicone |
| Manufacturer | Parker Chomerics |
| Trade Name | CHO-BOND |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Parker Chomerics CHO-BOND 1035 Electrically Conductive Sealant.pdf |
| Price | EMAIL US sales@lookpolymers.com |
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 1.80 - 2.00 g/cc | 1.80 - 2.00 g/cc | |
| Volatile Organic Compounds (VOC) Content | 151 g/l | 151 g/l | |
| Thickness | 178 microns | 7.00 mil | Recommended |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Shear Strength | >= 0.689 MPa | >= 100 psi | Lap |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Maximum Service Temperature, Air | 200 °C | 392 °F | |
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | <= 0.050 ohm-cm | <= 0.050 ohm-cm | DC |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 10100 min @Temperature 23.0 °C |
168 hour @Temperature 73.4 °F |
|
| Shelf Life | 6.00 Month | 6.00 Month |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Binder | Silicone | |
| Consistency | Thin paste | |
| Coverage | 21.3 cm2 / g | |
| Filler | Ag/glass | |
| Mix Ratio | 1-part | |
| Working Life | 0.5 hrs |