Parker Chomerics THERM-A-GAP™ GEL 30 High Performance Fully Cured Dispensable Gel

Category	Fluid
Manufacturer	Parker Chomerics
Trade Name	THERM-A-GAP™ GEL
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Parker Chomerics THERM-A-GAP™ GEL 30 High Performance Fully Cured Dispensable Gel.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Description: Parker Chomerics fully cured dispensable GELs eliminate time consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) complexity. These products require no mixing or curing, providing superior design flexibility. Provides low thermal impedance at thin and thick gaps, allowing use of common heat spreaders: Lower temperature increases product life, typically a doubling of life based on every 10°C decrease in temperature; Deflects easily under very low compressive forces, decreasing stress on components thus decreasing component failures.Typical Applications: Automotive Electronic Control Units (ECU’s), Power Supplies & Semiconductors, Memory & Power Modules, Microprocessors/Graphics Processors, and Flat Panel Displays & Consumer Electronics.Features/Benefits: Easily dispensable, Fully-cured/No pump out, High bulk thermal conductivity, Low thermal impedance, Ultra low compression force, High tack surface & reworkable and Proven long-term reliability.Product Attributes: Accommodates a variety of bond line thicknesses for application to multiple devices, Moderate bondline gel (approximately 4-40+ mils), High bulk thermal conductivity, Excellent performance-to-price, Compatible with high volume, automated dispense processes, and Meets Telcordia (Bellcore) silicone specifications.Information provided by Chomerics

Physical Properties	Metric	English	Comments
Specific Gravity	3.20 g/cc	3.20 g/cc	ASTM D792
Thickness	>= 100 microns	>= 3.94 mil	Bondline thickness
Deformation	22 % @Pressure 0.00345 MPa	22 % @Pressure 0.500 psi	Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min; Modified ASTM C165
	41 % @Pressure 0.00689 MPa	41 % @Pressure 1.00 psi	Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min; Modified ASTM C165
	47 % @Pressure 0.0103 MPa	47 % @Pressure 1.50 psi	Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min; Modified ASTM C165
	52 % @Pressure 0.0138 MPa	52 % @Pressure 2.00 psi	Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min; Modified ASTM C165
	54 % @Pressure 0.0172 MPa	54 % @Pressure 2.50 psi	Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min; Modified ASTM C165
	56 % @Pressure 0.0207 MPa	56 % @Pressure 3.00 psi	Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min; Modified ASTM C165
	59 % @Pressure 0.0241 MPa	59 % @Pressure 3.50 psi	Dispensed 1.0 cc of material, Brought 1" x 1" probe down to 0.1"; Test rate 0.025 in/min; Modified ASTM C165
Outgassing - Total Mass Loss	0.050 %	0.050 %	CVCM; ASTM E595
	0.15 %	0.15 %	TML; ASTM E595

Thermal Properties	Metric	English	Comments
CTE, linear	150 µm/m-°C	83.3 µin/in-°F	ASTM E831
Specific Heat Capacity	1.00 J/g-°C	0.239 BTU/lb-°F	ASTM E1269
Thermal Conductivity	3.50 W/m-K	24.3 BTU-in/hr-ft²-°F	ASTM D5470
Maximum Service Temperature, Air	200 °C	392 °F
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F
Flammability, UL94	V-0	V-0

Electrical Properties	Metric	English	Comments
Volume Resistivity	1.00e+14 ohm-cm	1.00e+14 ohm-cm	ASTM D257
Dielectric Constant	7.0 @Frequency 1.00e+6 Hz	7.0 @Frequency 1.00e+6 Hz	ASTM D150
Dielectric Strength	8.00 kV/mm	203 kV/in	ASTM D149
Dissipation Factor	0.0020 @Frequency 100000 Hz	0.0020 @Frequency 100000 Hz	Chomerics

Processing Properties	Metric	English	Comments
Shelf Life	18.0 Month	18.0 Month	From date of Manufacture

Descriptive Properties	Value	Comments
Color	Light Pink

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