Polymer Property : Viscosity = 24000 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	24000 cP	24000 cP	Mixed 1:2; TM R050-12
Resinlab® EP1215 Clear Unfilled Epoxy Structural Adhesive Resinlab™ EP1215 Clear is a two part unfilled epoxy structural adhesive designed for bonding applications requiring high strength and good impact resistance. It cures completely at room temperature..
Viscosity	24000 cP @Temperature 25.0 °C	24000 cP @Temperature 77.0 °F	After mixing
Tra-Con Tra-Bond 2143G Medium Viscosity Polyamide Epoxy Adhesive TRA-BOND 2143G is a medium viscosity adhesive recommended for industrial bonding and sealing applications where toughness, impact resistance, and superior mechanical properties are required. This tw..
Viscosity	>= 24000 cP	>= 24000 cP
Master Bond UV15X-6MED-2 UV Curable Compound for Medical Applications Description: Master Bond Polymer System UV15X-6MED-2 is a newly developed one component clear, non-yellowing, UV curable urethane elastomer system possessing high flexibility and outstanding abrasio..
Viscosity	24000 cP	24000 cP	Mixed
Tra-Con Tra-Bond Ablebond 744-2NTN1 Electrically Insulating Polyimide Adhesive Ablebond 744-2NTN1 structural epoxy adhesive is a nonsag version of 744-2 adhesive. Information provided by Tra-Con Inc.
Viscosity	24000 cP @Temperature 25.0 °C	24000 cP @Temperature 77.0 °F	Mixed
Trelleborg Emerson & Cuming Stycast® 2754 Two-Component Epoxy Flexible Low-Stress Encapsulant Emerson & Cuming 2754 Stycast® Two-Component Epoxy Flexible Low-Stress EncapsulantDescriptionElectronic embedment and sealing of metals, ceramics, and plastics. Protection of stress sensitive compo..
Viscosity	24000 cP	24000 cP	Dynamic
Dow Corning SYL-OFF® PMCPSB 7458 Coating Base polymer component for Syl-Off® brand solvent-based, platinum-catalyzed silicone release coatings.Information provided by Dow Corning
Viscosity	24000 cP	24000 cP
Dow Corning SYL-OFF® SB 7458 COATING Base polymer component for Syl-Off® brand solvent-based, platinum-catalyzed silicone release coatingsInformation provided by Dow Corning
Viscosity	24000 - 46000 cP @Temperature 23.0 °C	24000 - 46000 cP @Temperature 73.4 °F	5 rpm
Epoxy Technology EPO-TEK® EV2002 Silver-filled, electrically conductive, flexible epoxy Material Description: Silver-filled, electrically conductive, flexible epoxyInformation Provided by Epoxy Technology
Viscosity	24000 - 42000 cP @Temperature 23.0 °C	24000 - 42000 cP @Temperature 73.4 °F	2.5 rpm
Epoxy Technology EPO-TEK® OD2002 High Temperature Epoxy Material Description: High Tg version of EPO-TEK®353ND with low modulus and good toughness. Replacement for EPO-TEK® 364. Complies with USP Class VI biocompatibility standards.Information Provid..
Viscosity	24000 cP	24000 cP	Thixotropic Gel
Dymax EMAX 10006 Voil Coil Assembly Disk Drive Adhesive Disk Drive AdhesivesLow Outgassing Multi-Cure® Memory Saver Disk Drive AdhesivesDescriptionDymax offers a range of advanced formula epoxy and acrylic adhesives for disk drive assembly. UV cures in ..
Viscosity	24000 cP	24000 cP	Mixed
Armstrong C-7/H20 Epoxy Adhesive A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may ..
Viscosity	24000 - 26000 cP	24000 - 26000 cP	uncured
Atom Adhesives AA-BOND FDA2T Epoxy Adhesive AA-BOND FDA2T is a thixotropic epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and received ..
Viscosity	24000 - 80000 cP	24000 - 80000 cP	Thixotropic
Loctite® 577 Coarse Threads Thread Sealant Thread SealersLoctite® Liquid Thread Sealants seal and secure metal pipes and fittings, filling the space between threaded metal parts, and hardening to prevent leakage. Designed for low and high p..