Polymer Property : Adhesive Bond Strength = 6.89 MPa Product List

Mechanical Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.

Mechanical Properties	Metric	English	Comments
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1121 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I..
Adhesive Bond Strength	6.89 - 19.3 MPa	1000 - 2800 psi	Average value: 13.1 MPa Grade Count:6
Overview of materials for Epoxy, Cast, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Cast, Unreinforced". Each property range of values reported is minimum and maximum values of appr..
Adhesive Bond Strength	6.89 MPa @Temperature 23.0 °C	1000 psi @Temperature 73.4 °F
Master Bond EP21TPND Two Component Polysulfide Epoxy Adhesive Master Bond Polymer Adhesive EP21TPND is a two component polysulfide epoxy based adhesive / sealant formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Pol..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear, alum to alum
Tra-Con Tra-Bond 575T01 Anaerobic Adhesive TRA-BOND 575T01 is a high strength, very fast cure, single component anaerobic retaining adhesive for fiber optic terminations. This product cures when confined in the absence of air between close f..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear, alum to alum
Tra-Con Tra-Bond 832-5 Flexible Epoxy TRA-BOND 832-5 is a flexible two component epoxy which is intended for bonding materials with mis-matched coefficients of expansion. It exhibits flexibility associated with polyurethanes but does no..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear, alum to alum, 1 hr @ 70°C
Tra-Con Tra-Duct 2705 Room Temperature Conductive Nickel Epoxy Adhesive TRA-DUCT 2705 is an electrically conductive nickel filled epoxy adhesive recommended for electronic bonding, sealing, and EMI-RFI shielding applications. This two-part smooth paste formulation is fr..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear, alum to alum, 2 min @ 150°C
Tra-Con Tra-Duct 2958 Snap Cure Conductive Silver Epoxy Adhesive TRA-DUCT 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications ..
Adhesive Bond Strength	6.89 MPa	1000 psi
Trelleborg Emerson & Cuming Eccobond® 83C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming 83C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy AdhesiveTwo component, silver filled, electrically conductive, epoxy adhesive. Smooth, creamy consistency. G..
Adhesive Bond Strength	>= 6.89 MPa	>= 1000 psi	Shear Al/Al
Master Bond EP30LTE-LO Dimensionally Stable Low Outgassing Two Part Epoxy Master Bond Polymer System EP30LTE-LO is a thermal shock resistant epoxy resin system with low thermal expansion properties and dimensional stability for high performance bonding, sealing and castin..
Adhesive Bond Strength	>= 6.89 MPa	>= 1000 psi	Shear Al/Al
Master Bond EP30QF Quartz Filled, Two Component Epoxy System Master Bond Polymer System EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and casting that is formulated to cure at room temperature or more rapidly at..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear, alum to alum
Tra-Con Tra-Bond 2129 Clear Low Viscosity Epoxy Adhesive TRA-BOND 2129 is a low viscosity epoxy adhesive recommended for industrial and electronic production, repair, small casting, coating, tooling, and rigid laminating applications where a clear system ..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear, adhesion to glass, minimum
Tra-Con Tra-Bond 546S05 Dual-Cure Acrylate TRA-BOND 546S05 is a dual cure (UV/heat) acrylate featuring excellent adhesion to glass. Ultimate Tg attained and shadowed areas cured with 15 minute exposure to 100-120°C.Information provided by T..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear, alum to alum, 2 hrs @ 65°C
Tra-Con Tra-Duct 2902 Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2902 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical prop..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear, alum to alum, 5 min @ 100°C
Tra-Con Tra-Duct 2956 Low Ion Snap Cure Silver Epoxy Adhesive TRA-DUCT 2956 is recommended for the bonding and sealing of electronic components where a combination of electrical and mechanical properties are required. This two-part, smooth, paste system of sil..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear, alum to alum, 72 hrs @ 25°C
Tra-Con Tra-Duct 2956 Low Ion Snap Cure Silver Epoxy Adhesive TRA-DUCT 2956 is recommended for the bonding and sealing of electronic components where a combination of electrical and mechanical properties are required. This two-part, smooth, paste system of sil..
Adhesive Bond Strength	6.89 - 20.7 MPa	1000 - 3000 psi	Varies with substrates
Loctite® Durabond® E-40FL Epoxy Adhesive Epoxy AdhesivesLoctite offers a complete line of one-part and two-part epoxy and urethane adhesives for structural bonding, potting and encapsulating. The Loctite® Durabond® line contains 14 appli..
Adhesive Bond Strength	6.89 - 20.7 MPa	1000 - 3000 psi	Varies with substrates
Loctite® Durabond® U-05FL Urethane Adhesive Urethane AdhesivesLoctite offers a complete line of one-part and two-part epoxy and urethane adhesives for structural bonding, potting and encapsulating. The Loctite® Durabond® line contains 14 ap..
Adhesive Bond Strength	6.89 MPa @Temperature 82.2 °C	1000 psi @Temperature 180 °F	Aluminum-Aluminum tensile shear
Armstrong A-2/H20 Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac..
Adhesive Bond Strength	6.89 MPa	1000 psi	Al-to-Al Lap Shear; Cured 30 min. at 125ºC, 3-5 mil bond line, Al to Al; ASTM D1002
Aptek 6512-PMF Electronic grade, conductive epoxy adhesive APTEK 6512-PMF is a one component, 100% solid, silver-filled, electrically conductive epoxy adhesive specifically designed for the attachment of electronic components to printed circuit boards. APT..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1026R Rubber Modified Epoxy Adhesive Resinlab™ EP1026R is a two part unfilled rubber modified epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free ..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe
Resinlab® EP1285HD-10 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1300 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1300 Black (Formerly Lab Product W092602) is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It has a pot life of about one hour and ..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1300 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1300 Clear (Formerly Lab Product W092602) is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It has a pot life of about one hour and ..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP965LVLX Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..
Adhesive Bond Strength	>= 6.89 MPa	>= 1000 psi	Aluminum to Aluminum
Loctite® 3883 Stencil Print Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..
Adhesive Bond Strength	>= 6.89 MPa	>= 1000 psi	Aluminum to Aluminum
Loctite® 3887 High Adhesion Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..
Adhesive Bond Strength	6.89 - 20.7 MPa	1000 - 3000 psi	Varies with substrates
Loctite® Durabond® E-90FL Epoxy Adhesive Epoxy AdhesivesLoctite offers a complete line of one-part and two-part epoxy and urethane adhesives for structural bonding, potting and encapsulating. The Loctite® Durabond® line contains 14 appli..
Adhesive Bond Strength	6.89 - 42.1 MPa	1000 - 6100 psi	Average value: 19.1 MPa Grade Count:7
Overview of materials for Epoxy, Cast, Metal Filled This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Cast, Aluminum Filled". Each property range of values reported is minimum and maximum values of a..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1305 Black Highly Toughened Urethane Modified Epoxy Resinlab™ EP1305 Black is a highly toughened urethane modified epoxy designed for bonding PVC, metals, ceramics and other difficult to bond substrates. The system has a thixotropic non-sag viscosi..
Adhesive Bond Strength	6.89 - 20.7 MPa	1000 - 3000 psi	Varies with substrates
Loctite® Durabond® E-60NC Epoxy Adhesive Epoxy AdhesivesLoctite offers a complete line of one-part and two-part epoxy and urethane adhesives for structural bonding, potting and encapsulating. The Loctite® Durabond® line contains 14 appli..