Mechanical Properties | Metric | English | Comments |
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Shear Strength | 13.8 MPa | 2000 psi | |
NextGen Adhesives M907-19 Medical Grade Epoxy Adhesive Description: NGAC M907-19 is a medium viscosity and thixotropic adhesive system that is specifically formulated for medical device assembly applications.Advantages and Applications: Uses include lam.. |
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Shear Strength | 13.8 - 17.2 MPa | 2000 - 2500 psi | |
ITW Plexus Plexusâ„¢ MA350 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Low viscosity adhesive, high strength, especially suitable for battery case applications.Informati.. |
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Shear Strength | >= 13.8 MPa | >= 2000 psi | Tensile lap, Al/Al |
Master Bond EP42HT-2ND-2Med Heat Resistant, Medical Grade Non-Drip Epoxy Master Bond Polymer System EP42HT-2ND2MED (Black) is a room temperature curable two component epoxy adhesive and sealant featuring high temperature resistance along with outstanding chemical resista.. |
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Shear Strength | >= 13.8 MPa | >= 2000 psi | Bond, Al to Al |
Master Bond EP77M-1 Fast Setting, Silver Conductive Epoxy Description: Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or.. |
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Shear Strength | >= 13.8 MPa | >= 2000 psi | Tensile lap, Al to Al |
Master Bond EP42-2LV Epoxy Resists Heat and Chemicals Description: Master Bond Polymer System EP42-2LV is a low viscosity room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring outstanding chemical resis.. |
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Shear Strength | >= 13.8 MPa | >= 2000 psi | Tensile lap, Al to Al |
Master Bond EP42HT-2 Epoxy Adhesive Resists Sterilization Description: Master Bond Polymer System EP42HT-2 is a room temperature curable, two component epoxy adhesive, sealant, coating and casting material featuring high temperature resistance along with o.. |
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Shear Strength | >= 13.8 MPa | >= 2000 psi | Tensile lap, Al/Al |
Master Bond EP42HT-2FG Two Component Epoxy Adhesive for Food Applications Master Bond Polymer System EP42HT-2FG is a room temperature setting, two component epoxy adhesive, sealant and coating specially formulated for food applications. It has been independently tested an.. |
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Shear Strength | >= 13.8 MPa | >= 2000 psi | Lap |
Epoxy Technology EPO-TEK® 301-2 Optically Transparent Epoxy Product Description: EPO-TEK® 301-2 is a two component optical, medical, and semiconductor grade epoxy resin, with low viscosity, long pot-life, and good handling characteristics.Advantages & Appli.. |
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Shear Strength | >= 13.8 MPa | >= 2000 psi | Lap |
Epoxy Technology EPO-TEK® 301-2FL Low Stress, Optical Epoxy Product Description: EPO-TEK® 301-2FL is a two component optical, medical, and semiconductor grade epoxy resin. It is a more flexible version of EPO-TEK® 301-2.Advantages & Application Notes: Sug.. |
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Shear Strength | >= 13.8 MPa | >= 2000 psi | Lap |
Epoxy Technology EPO-TEK® 302-3M Optically Transparent Epoxy Product Description: EPO-TEK® 302-3M is a two component epoxy used for optical, medical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as.. |
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Shear Strength | >= 13.8 MPa | >= 2000 psi | Lap |
Epoxy Technology EPO-TEK® 320NC Optically Opaque Epoxy Material Description: A two component, black-colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modific.. |
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Shear Strength | >= 13.8 MPa | >= 2000 psi | Lap |
Epoxy Technology EPO-TEK® 353ND Black High Temperature Epoxy Product Description: EPO TEK® 353ND Black is a a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applicationsAdvantages & Application Notes: EPO T.. |
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Shear Strength | >= 13.8 MPa | >= 2000 psi | Lap |
Epoxy Technology EPO-TEK® 375 High Temperature Epoxy Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy.. |
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Shear Strength | >= 13.8 MPa | >= 2000 psi | Lap |
Epoxy Technology EPO-TEK® 383ND High Temperature Epoxy Material Description: A slightly longer pot life version of EPO-TEK®353ND designed for high temperature, optical and structural applications inside the semiconductor, hybrid, electronic, fiber opti.. |
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Shear Strength | >= 13.8 MPa | >= 2000 psi | Lap |
Epoxy Technology EPO-TEK® 730 Unfilled Black General and Structural Grade Epoxy Material Description: A two component, room temperature curing, general and structural grade epoxy. It can be used for adhesive, sealing, and encapsulating applications in medical, xray device, fil.. |
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Shear Strength | >= 13.8 MPa | >= 2000 psi | Lap |
Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & A.. |
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Shear Strength | >= 13.8 MPa | >= 2000 psi | Lap |
Epoxy Technology EPO-TEK® OE138 Two Component Epoxy Material Description: A two component epoxy with intermediate viscosity range between EPO-TEK® 353ND and EPO-TEK® 353ND-T. It is designed for semiconductor glob top applications, as well as use in.. |
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Shear Strength | 13.8 MPa @Temperature 24.0 °C |
2000 psi @Temperature 75.2 °F |
Overlap, Aluminum FPL Etch; ASTM D1002-72 |
3M Scotch-Weld™ 1751 B/A Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive 1751 B/A is a gray, aluminum filled, two-part, room temperature curing structural adhesive.Information provided by 3M |
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Shear Strength | 13.8 MPa @Temperature 24.0 °C |
2000 psi @Temperature 75.2 °F |
Aluminum Overlap; ASTM D1002 |
3M Scotch-Weld™ 183 B/A Tan Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive 1838 B/A is a controlled flow product. This epoxy adhesives are two-part, room temperature curing structural adhesives with high shear strengths and excellent envir.. |
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Shear Strength | 13.8 MPa @Temperature -55.0 °C |
2000 psi @Temperature -67.0 °F |
Aluminum Overlap; ASTM D1002 |
3M Scotch-Weld™ 183 B/A Translucent Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive 1838 B/A is a controlled flowable product. This epoxy adhesives are two-part, room temperature curing structural adhesives with high shear strengths and excellent e.. |
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Shear Strength | 13.8 MPa | 2000 psi | |
3M Scotch-Weld™ DP608 Structural Adhesive Flexible and Non-sagInformation provided by 3M |
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Shear Strength | 13.8 MPa @Temperature -29.0 °C |
2000 psi @Temperature -20.2 °F |
Overlap, Adhesion Failure |
3M Scotch-Weld™ DP810 Black Structural Adhesive 3M™ Scotch-Weld™ Low-Odor Acrylic Adhesives are two-part, 1:1 mix ratio, toughened structural adhesives with less odor than most acrylic adhesives. The adhesives have excellent shear and peel stre.. |
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Shear Strength | 13.8 MPa @Temperature 33.0 - 36.0 °C |
2000 psi @Temperature 91.4 - 96.8 °F |
Etched Aluminum Overlap, Salt Spray Immersion for 250 hrs, Minimum MIL-A-8623 Type III Requirement |
3M Scotch-Weld™ EC-1386 Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive EC-1386 is a one-part, 100% solids, thermosetting liquid adhesive.Information provided by 3M |
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Shear Strength | 13.8 MPa | 2000 psi | |
Aremco Aremco-Bond™ 2335 Ultra High Temperature Epoxy Ceramic-Filled, Low Expansion, High Lap-Shear Strength & Chemical Resistance, Low Outgassing. |
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Shear Strength | 13.8 MPa | 2000 psi | |
Dymax Magnet Bonder™ 2000 Adhesive DYMAX® Magnet Bonder™ Adhesives for Higher Performance and Lower CostDymax 2000 Magnet Bonder™ AdhesiveFastest cure; bond ferrite to steel. Typical Use: Loudspeaker magnet to pole piece. |
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Shear Strength | >= 13.8 MPa | >= 2000 psi | Bond, Al to Al |
Master Bond EP30M4LV Chemically Resistant, Low Viscosity Adhesive Description: Master Bond EP30M4LV is a two component, low viscosity epoxy system for high performance bonding, sealing and encapsulation. This system features a forgiving 100 to 60 mix ratio by weig.. |