Polymer Property : Shear Strength = 23.4 MPa Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 302-3M Optically Transparent Epoxy Product Description: EPO-TEK® 302-3M is a two component epoxy used for optical, medical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 320-3 Optically Opaque Epoxy Material Description: A two component, black-colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modific..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 337H Graphite-Filled, High Temperature Epoxy Product Description: EPO-TEK® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic ind..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 354 High Temperature Epoxy Product Description: EPO-TEK® 354 is a two component, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally i..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 375 High Temperature Epoxy Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 509FM-1 General Purpose Epoxy Product Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic indust..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 730 General Purpose Epoxy Product Description: EPO-TEK® 730 is a two component, thixotropic, room temperature-curing epoxy adhesive. Advantages & Application Notes: Excellent all purpose adhesive. Many uses in job shop and ..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 730 Unfilled Black General and Structural Grade Epoxy Material Description: A two component, room temperature curing, general and structural grade epoxy. It can be used for adhesive, sealing, and encapsulating applications in medical, xray device, fil..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or f..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® E3037 Epoxy Material Description: A single component, electrically conductive, thixotropic silver-filled epoxy for die-attach and SMD-attach inside hybrid microelectronics.Information Provided by Epoxy Technolo..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die Initial
Epoxy Technology EPO-TEK® EK1000-MP Epoxy Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding ..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die Initial
Epoxy Technology EPO-TEK® EK2000 Epoxy Preliminary Product Information SheetMaterial Description: A two component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance ..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® H20-FC Electrically Conductive Epoxy Product Description: EPO-TEK®H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly.Adv..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® M10-D Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® OE100-T High Temperature Epoxy Material Description: A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy ca..
Shear Strength	23.4 MPa	3400 psi	Die
Epoxy Technology EPO-TEK® OG116-31 UV Cure Optical Epoxy Product Description: EPO-TEK® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® T7139 Glob Top Epoxy Product Description: EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.Advantages & Application N..
Shear Strength	23.4 MPa	3400 psi	Overlap, Etched Aluminum
3M Scotch-Weld™ DP125 Gray Epoxy Adhesive Scotch-Weld epoxy adhesive DP125 Gray is a filled, pigmented version of the Scotch-Weld epoxy adhesive DP125 Translucent and has similar performance and flexibility properties.Information provided b..
Shear Strength	23.4 MPa	3400 psi	Overlap, Stainless Steel, Cohesive Failure
3M Scotch-Weld™ DP810NS Structural Adhesive 3M™ Scotch-Weld™ Low-Odor Acrylic Adhesives are two-part, 1:1 mix ratio, toughened structural adhesives with less odor than most acrylic adhesives. The adhesives have excellent shear and peel stre..
Shear Strength	23.4 MPa	3400 psi	Overlap, FRP (Green) (IPA/abrade/IPA), Adhesive Failure/Cohesive Failure; ASTM D1002
3M Scotch-Weld™ DP920 Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP920 is a two-part, 2:1 mix ratio, toughened epoxy structural adhesive with a 20 minute work life. It exhibits excellent shear and peel strengths along with good i..
Shear Strength	23.4 MPa	3400 psi	Overlap, Stainless Steel, Cohesive Failure
3M Scotch-Weld™ DP810 Tan Structural Adhesive 3M™ Scotch-Weld™ Low-Odor Acrylic Adhesives are two-part, 1:1 mix ratio, toughened structural adhesives with less odor than most acrylic adhesives. The adhesives have excellent shear and peel stre..
Shear Strength	23.4 MPa	3400 psi	Overlap, Etched Al, 100% RH at 49°C for 14 days
3M Scotch-Weld™ 2216 B/A Tan NS Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive 2216 B/A is a flexible, two-part, room temperature curing epoxy with high peel and shear strength. Scotch-Weld epoxy adhesive 2216 B/A is identical to 3M Scotch-Wel..