Mechanical Properties | Metric | English | Comments |
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Flexural Modulus | 12.0 GPa | 1740 ksi | ISO 178 |
PolyOne OnForce™ LFT AM-40LGF/001 Natural Polyphthalamide (PPA) PolyOne's Long Fiber Thermoplastic (LFT) compounds are formulated for demanding applications which require high stiffness and good impact such as metal replacement or other structural applications. .. |
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Flexural Modulus | 12.0 GPa | 1740 ksi | ISO 178 |
PolyOne OnForce™ LFT NN-50LGF/000 HS Black Polyamide 66 (Nylon 66) PolyOne's Long Fiber Thermoplastic (LFT) compounds are formulated for demanding applications which require high stiffness and good impact such as metal replacement or other structural applications. .. |
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Flexural Modulus | 12.0 GPa | 1740 ksi | ISO 178 |
Polyplastic Armamid® PA GF50-1 Nylon 6, 50% Glass Fiber High stiffnessInformation provided by PolyPlastic Group. |
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Flexural Modulus | 12.0 GPa | 1740 ksi | ASTM D790 |
Premix Premi-Glas® 2207-22 CR-SX Fiberglass Reinforced Thermoset SMC Premi-Glas® 2207-22 CR-SX is a fiberglass reinforced thermoset sheet molding compound for electrical, flame retardant and HVAC applications.Key features and benefits are:Non-Halogen FR technology f.. |
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Flexural Modulus | 12.0 - 15.0 GPa | 1740 - 2180 ksi | Injection and Compression; ISO 178 |
Raschig Group EPOXIDUR® 3581 S ZC EP Epoxy Molding Compound Inorganically filled epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures. Very good sealing connection on .. |
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Flexural Modulus | 12.0 GPa | 1740 ksi | ASTM D790 |
Chevron Phillips Ryton® A-200 PPS Polyphenylene Sulfide
(discontinued **) Ryton® PPS is used in many electronic and automotive applications because of its high strength, favorable electrical properties, and high temperature stability.Data provided by the manufacturer.Sol.. |
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Flexural Modulus | 12.0 GPa @Temperature 23.0 °C |
1740 ksi @Temperature 73.4 °F |
ISO 178 |
Polykemi AB POLYshine PBT D201 FB60 PBT, Reinforced Information provided by Polykemi AB |
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Flexural Modulus | 12.0 GPa | 1740 ksi | |
Cookson Group Plaskon® LS-16S Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress molding compound specifically formulated for use with conventional molding equipment to increase semiconductor manuf.. |
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Flexural Modulus | 12.0 GPa | 1740 ksi | DIN 53 457 |
Albis Plastics Tedur® L V 9107-1 PPS, 40% Glass Fiber
(discontinued **) Low Flash, Improved Impact and Burst Strength. Incandescent wire resistance (2 mm) is 960°C per VDE 0471 T1.2.Applications: Pump Housings, Hollow Articles Under PressureProcessing: Injection Moldi.. |
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Flexural Modulus | 12.0 GPa | 1740 ksi | |
Lehmann & Voss LUVOCOM® 1700-7910 PPO, with carbon fiber Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.Strong, stiff parts; low thermal coefficient of expansion.Electrically conductive, suitable for.. |
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Flexural Modulus | 12.0 GPa | 1740 ksi | |
Lehmann & Voss LUVOCOM® 80-7917 Polyacetal-copolymer, with carbon fiber Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.Strong, stiff parts; low thermal coefficient of expansion.Electrically conductive, suitable for.. |
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Flexural Modulus | 12.0 GPa | 1740 ksi | 2mm/min; ASTM D790 |
Kingfa JH720 G50 50% Glass Fiber Reinforced PC Features:Excellent balance propertiesSuper high stiffnessHigh hardnessGood size stabilitySuper high mechanical strengthApplications:Imaging equipment shellOA body frameElectrical equipmentComputer p.. |
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Flexural Modulus | 12.0 GPa | 1740 ksi | |
Haysite H258 Polyester Laminate Solder Pallet and Work Holder Sheet A high temperature polyester laminate that exhibits excellent retention of mechanical properties and dimensional stability at elevated temperatures. Applications.. |
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Flexural Modulus | 12.0 GPa | 1740 ksi | |
Lehmann & Voss LUVOCOM® 1/CF/20/HS Polyamide 66, with carbon fiber, heat stabilized Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Reduced moment of inertia comp.. |
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Flexural Modulus | 12.0 GPa | 1740 ksi | |
Lehmann & Voss LUVOCOM® 1104-7598 Polyether ketone, with carbon fiber, PTFE, lubricant modified Applications: Automotive industry, mechanical- and precision engineering.Improved strength and stiffnes at elevated temperatures.Improved fatigue properties.Thermic, mechanic and chemical highly str.. |
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Flexural Modulus | 12.0 GPa | 1740 ksi | |
Lehmann & Voss LUVOTECH® GS 58 Polyamide 66, with glass fiber, lubricant modified Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.Improved friction and wear behaviour. Emergency running property.High dimensionally stable prec.. |
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Flexural Modulus | 12.0 GPa | 1740 ksi | ISO 178 |
SABIC Innovative Plastics LNP THERMOCOMP AH0400A ABS LNP* THERMOCOMP* AH0400A is a compound based on ABS resin. Added feature of this material is: High Specific Gravity. |
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Flexural Modulus | 12.0 GPa | 1740 ksi | ISO 178 |
Unitika RUN35-C25 PA6, Conditioned High modulus and low warpage nylonInformation provided by Unitika Ltd. |
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Flexural Modulus | 12.0 - 14.0 GPa | 1740 - 2030 ksi | ISO 178 |
Vyncolit G885 Novolac Phenolic Glass fiber and mineral filled phenolic molding compound with excellent mechanical and thermal properties. Information provided by Vyncolit, a Sumitomo Bak Group |
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Flexural Modulus | 12.0 GPa | 1740 ksi | |
Elisto THERMOSTAR® MD 150 Pattern material Industrial laminateInformation provided by elisto |
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Flexural Modulus | 12.0 GPa | 1740 ksi | 2 [mm/min]; ISO 178 |
Akro-Plastic Akromid® A3 GF 40 (1258) PA 6.6 Dry, 40% Glass Filled AKROMID® A (Polyamide 6.6) is an engineering compound, characterized by high mechanical strength, stiffness and thermal resistance. Furthermore, this polyamide offers high toughness at low temperat.. |
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Flexural Modulus | 12.0 GPa | 1740 ksi | ISO 178 |
Hexion Bakelite™ PF 4010 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage
(disconti Glass fiber reinforced and inorganically filled molding compound. High heat resistance, reduced molding shrinkage, good chemical resistance and mechanical properties.Application areas: Switch housi.. |
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Flexural Modulus | 12.0 GPa | 1740 ksi | ISO 178 |
Hexion Bakelite™ PF 4260 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistantApplication areas: Commutators (starte.. |
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Flexural Modulus | 12.0 - 16.0 GPa | 1740 - 2320 ksi | ISO 178 |
Bulk Molding Compounds tetra-DUR N 4203 Bulk Molding Compound Highest dimensional stability under temp. Low profile.Typical Applications - Requiring mechanical strength, abrasion resistance, dimensional stability, electrical insulation, electrostatic dissipat.. |