Polymer Property : UL RTI, Electrical = 150 °C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
UL RTI, Electrical	150 °C	302 °F	UL 746B
SABIC Innovative Plastics Lexan® XHT2141 PC Copolymer XHT2141 is a high flow, high heat polycarbonate copolymer. It is available in a range of opaque and limited transparent colors.
UL RTI, Electrical	150 °C	302 °F
Resinoid 1340 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance
UL RTI, Electrical	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	UL746B
Covestro Apec® DP9-9351 High-Heat Polycarbonate, General Purpose (discontinued **) Information provided by Bayer Corporation, Plastics DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer AG and has officially adopted its new name – Covestro. This produ..
UL RTI, Electrical	150 - 220 °C	302 - 428 °F	Average value: 211 °C Grade Count:127
Overview of materials for Silicone, Molded, Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Silicone, Molded, Glass Fiber Filled". Each property range of values reported is minimum and maximum val..
UL RTI, Electrical	150 °C @Thickness 0.750 mm	302 °F @Thickness 0.0295 in	NC
Hexion Bakelite™ PF 13 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, inorganically mica filled, heat resistance, good electrical properties, UL listed molding compound 0.75 mm/V-1 (NC), 3 mm/V-0, standardized molding compound.Application ar..
UL RTI, Electrical	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(ALL)
Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed (disc Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area..
UL RTI, Electrical	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	ALL
Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U..
UL RTI, Electrical	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	BK
Hexion Bakelite™ PF 13591 Phenolic Formaldehyde Resin, High Surface Quality, UL Listed (discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds, UL listed molding compound 1.5 mm/V-1 (BK), 3.0 mm/V-0 (BK).Application areas: Pan handles, various applications..
UL RTI, Electrical	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plenco 201 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound (discontinued **) Plaslok 201 is a two-stage, woodflour and mineral-filled phenolic molding compound formulated to have an excellent balance of molded properties. The material provides good electrical insulation val..
UL RTI, Electrical	150 °C @Thickness 1.63 mm	302 °F @Thickness 0.0642 in
Plenco 202 Black General Purpose Woodflour Filled Phenolic Molding Compound (discontinued **) Plaslok 202 is a two-stage, woodflour-filled phenolic molding compound formulated to provide improved impact and fatigue strength, good dimensional stability and excellent molded finish for automoti..
UL RTI, Electrical	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 204 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound (discontinued **) Plaslok 204 is a two-stage, woodflour and mineral-filled phenolic molding compound formulated to accommodate a wide range of molding situations. In addition, it is recommended for use in thin wall ..
UL RTI, Electrical	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plenco 5440 Black General Purpose Phenolic Molding Compound (discontinued **) Plaslok 5440 is the replacement material for the former Union Carbide BMRS-5440. It is a two-stage, phenolic molding compound that has been successfully formulated to accommodate a very wide range ..
UL RTI, Electrical	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 501 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound (discontinued **) Plaslok 501 is a two-stage, mineral and flock-filled phenolic molding compound designed for use in heat resistant and electrical applications. It is designed for elevated temperature exposure for e..
UL RTI, Electrical	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plenco 5314 Black (INJ) Impact Grade Phenolic Molding Compound (discontinued **) Plaslok 5314 is the replacement material for the former Union Carbide BMMA-5314. It is a two-stage, impact grade phenolic molding compound suitable for compression, transfer or injection molding of..
UL RTI, Electrical	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 7021 Black Impact Grade Phenolic Molding Compound (discontinued **) Plaslok 7021 is the replacement material for the former Union Carbide BMRS-7021. It is a two-stage, impact grade phenolic molding compound suitable for compression, transfer or injection molding of..
UL RTI, Electrical	150 °C @Thickness 1.60 mm	302 °F @Thickness 0.0630 in
Plenco 309 Black (COM) Mineral/Fiber Filled Phenolic Molding Compound (discontinued **) Plaslok 309 is a two-stage, mineral and fiber-filled phenolic molding compound having excellent impact strength; and as such, is considered a good candidate for replacing chopped-fiber filled compou..
UL RTI, Electrical	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plaslok 506 Black Heat Resistant Mineral Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 506 is a two-stage, mineral-filled ph..
UL RTI, Electrical	150 Â°C	302 Â°F	UL 746B
SABIC Innovative Plastics ValoxÂ® ENH3500 PBT (Europe-Africa-Middle East) Unfilled PBT, Non-Brominated & Non-Chlorinated Flame Retardant
UL RTI, Electrical	150 °C	302 °F	E54153
Arlon 32980R015 0.015" (0.381 mm) Uncured Silicon Rubber on Polyester Film Carrier Design/Construction: Interleave: PolyethyleneSide 1: Uncured Silicone RubberCarrier: Polyester FilmProduct Use: Flexible heater substrateAppearance: Red colored, high viscosity gum on polymer liners..
UL RTI, Electrical	150 °C	302 °F
Resinoid 1322 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance
UL RTI, Electrical	150 °C	302 °F
Resinoid 2010 Phenolic Molding, Fabric Reinforced Data provided by the manufacturer.The Resinoid 2000 organic fiber reinforced series compounds feature mechanical strength, dimensional stability, and shock resistance
UL RTI, Electrical	150 °C	302 °F
Resinoid 2016 Phenolic Molding, Fabric Reinforced Data provided by the manufacturer.The Resinoid 2000 organic fiber reinforced series compounds feature mechanical strength, dimensional stability, and shock resistance
UL RTI, Electrical	150 °C	302 °F	1.47 mm
Plaslok 5440 Black General Purpose Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5440 is the replacement material for ..
UL RTI, Electrical	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plaslok 302 Black Impact Grade Woodflour/Flock Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 302 is a two-stage, woodflour and flo..
UL RTI, Electrical	150 °C	302 °F
Resinoid 7201 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance
UL RTI, Electrical	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(BK)
Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed &nbs Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol..
UL RTI, Electrical	150 °C	302 °F	1.57 mm
Plaslok 204 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use. Plaslok 204 is a two-stage, woodflour and min..
UL RTI, Electrical	150 °C	302 °F	1.57 mm
Plaslok 7021 Black Impact Grade Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 7021 is the replacement material for ..