Polymer Property : UL RTI, Mechanical without Impact = 150 °C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
UL RTI, Mechanical without Impact	150 °C	302 °F	UL 746B
SABIC Innovative Plastics Lexan® XHT2141 PC Copolymer (Europe-Africa-Middle East) XHT2141 is a high flow, high heat polycarbonate copolymer. It is available in a range of opaque and limited transparent colors.
UL RTI, Mechanical without Impact	150 °C	302 °F	UL 746B
SABIC Innovative Plastics Lexan® XHT3141 PC Copolymer (Asia Pacific) XHT3141 is a high flow, high heat polycarbonate copolymer. It is available in a range of opaque and limited transparent colors.
UL RTI, Mechanical without Impact	150 °C	302 °F	UL 746B
SABIC Innovative Plastics Lexan® XHT4141 PC Copolymer XHT4141 is a high flow, high heat polycarbonate copolymer. It is available in a range of opaque and limited transparent colors.
UL RTI, Mechanical without Impact	150 °C	302 °F
Covestro Petlon® 4630 Semi-Crystalline PET, 30% Glass Fiber (discontinued **) Characteristics: Flame Retardant: Electrical Properties, High Heat and Chemical ResistanceApplications: Connectors, Relays, Switches, Automotive (Under Hood), AppliancesProcessing: Injection Molding..
UL RTI, Mechanical without Impact	150 °C	302 °F	Average value: 150 °C Grade Count:6
Overview of materials for Phenolic, Novolac, Heat Resistant Grade, Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Heat Resistant Grade, Filled". Each property range of values reported is minimum and ..
UL RTI, Mechanical without Impact	150 °C	302 °F	Average value: 150 °C Grade Count:8
Overview of materials for Phenolic, Novolac, Impact Grade, Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Impact Grade, Filled". Each property range of values reported is minimum and maximum ..
UL RTI, Mechanical without Impact	150 °C	302 °F	Average value: 150 °C Grade Count:4
Overview of materials for Phenolic, Novolac, Mineral/Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Mineral/Fiber Filled". Each property range of values reported is minimum and maximum ..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	ALL
Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U..
UL RTI, Mechanical without Impact	150 °C @Thickness 0.840 mm	302 °F @Thickness 0.0331 in	BK
Hexion Bakelite™ PF 4109 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, low shrinkage, high mechanical strength, U..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(BN, BK)
Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	BN, BK
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.63 mm	302 °F @Thickness 0.0642 in
Plenco 202 Black General Purpose Woodflour Filled Phenolic Molding Compound (discontinued **) Plaslok 202 is a two-stage, woodflour-filled phenolic molding compound formulated to provide improved impact and fatigue strength, good dimensional stability and excellent molded finish for automoti..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 501 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound (discontinued **) Plaslok 501 is a two-stage, mineral and flock-filled phenolic molding compound designed for use in heat resistant and electrical applications. It is designed for elevated temperature exposure for e..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plenco 504 Black (INJ) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound (discontinued **)< Plaslok 504 is a two-stage, mineral and cellulose-filled phenolic molding compound having better impact and heat resistance than general purpose molding compounds. Since it also has good electrical..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.60 mm	302 °F @Thickness 0.0630 in
Plenco 309 Black (COM) Mineral/Fiber Filled Phenolic Molding Compound (discontinued **) Plaslok 309 is a two-stage, mineral and fiber-filled phenolic molding compound having excellent impact strength; and as such, is considered a good candidate for replacing chopped-fiber filled compou..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.63 mm	302 °F @Thickness 0.0642 in
Plaslok 202 Black General Purpose Woodflour Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 202 is a two-stage, woodflour-filled ..
UL RTI, Mechanical without Impact	150 °C	302 °F	1.60 mm
Plaslok 309 Black (COM) Mineral/Fiber Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 309 is a two-stage, mineral and fiber..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.60 mm	302 °F @Thickness 0.0630 in
Plaslok 309 Black (INJ) Mineral/Fiber Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 309 is a two-stage, mineral and fiber..
UL RTI, Mechanical without Impact	150 °C	302 °F
Arlon 44981R015 0.015" (0.381 mm) Uncured Silicone Rubber with Fiberglass Substrate Design/Construction: Interleave 1: Polyethylene Side 1: Uncured Silicone Rubber Substrate: Style 1165 FiberglassSide 2: Uncured Silicone Rubber Interleave 2: Polyethylene UL Recognition File: E54153..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	UL746B
Covestro Apec® DP9-9353 High-Heat Polycarbonate, UV Stabilized (discontinued **) Information provided by Bayer Corporation, Plastics DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer AG and has officially adopted its new name – Covestro. This produ..
UL RTI, Mechanical without Impact	150 °C	302 °F
Resinoid 2010 Phenolic Molding, Fabric Reinforced Data provided by the manufacturer.The Resinoid 2000 organic fiber reinforced series compounds feature mechanical strength, dimensional stability, and shock resistance
UL RTI, Mechanical without Impact	150 °C @Thickness 0.750 mm	302 °F @Thickness 0.0295 in	BK
Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 302 Black Impact Grade Woodflour/Flock Filled Phenolic Molding Compound (discontinued **) Plaslok 302 is a two-stage, woodflour and flock-filled phenolic molding compound. It has low specific gravity, broad molding latitude and an excellent balance of electrical and physical properties...
UL RTI, Mechanical without Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plaslok 5000 Black General Purpose Woodflour Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use. Plaslok 5000 is the replacement material for ..
UL RTI, Mechanical without Impact	150 °C	302 °F	1.47 mm
Plaslok 7000 Black General Purpose Woodflour Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 7000 is the replacement material for ..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plaslok 504 Black (INJ) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound (discontinued **)&l Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 504 is a two-stage, mineral and cellu..
UL RTI, Mechanical without Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plaslok 5303 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5303 is a two-stage, mineral and floc..
UL RTI, Mechanical without Impact	150 °C @Thickness 3.00 mm	302 °F @Thickness 0.118 in	ALL
Hexion Bakelite™ PF 2855 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage, For Electrostatic Coating, Dishwasher Proof, UL Listed Phenolic molding compound, inorganically/organically filled, heat resistant up to 250°C, hot steam and hot water resistant, high surface quality, for electrostatic coating, UL listed molding compou..