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- Polymer Property : Deflection Temperature at 1.8 MPa (264 psi) = 345 °F
Polymer Property : Deflection Temperature at 1.8 MPa (264 psi) = 345 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Deflection Temperature at 1.8 MPa (264 psi) | 174 °C | 345 °F | ISO.75 DIN.53461 |
| Omnia Plastica PSU Polysulphone It is a non-reinforced amorphous polymer whose main features are its high thermal, electrical and mechanical properties which are typical of a crystalline polymer. Compared to its "brother" PES it h.. |
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| Deflection Temperature at 1.8 MPa (264 psi) | 174 °C | 345 °F | ASTM D648 |
| Niche Polymer PPHT40BK Homopolymer PP, 40% Talc Fiber Filled Information provided by Niche Polymer |
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| Deflection Temperature at 1.8 MPa (264 psi) | 174 °C | 345 °F | Flatw 80*10*4 sp=64mm; ISO 75/Af |
| SABIC Innovative Plastics LNP KONDUIT PTF2BXXX PA 6 LNP KONDUIT* PTF2BXXX is a compound based on Nylon 6 resin containing 10% Glass Fiber, 55% Proprietary Thermal Filler. Added features of this material include: Thermally Conductive. |
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| Deflection Temperature at 1.8 MPa (264 psi) | 174 °C @Thickness 3.20 mm |
345 °F @Thickness 0.126 in |
unannealed; ASTM D648 |
| SABIC Innovative Plastics LNP KONDUIT PTF2BXXX PA 6 (Asia Pacific) LNP KONDUIT* PTF2BXXX is a compound based on Nylon 6 resin containing Glass Fiber, Proprietary Thermal Filler. Added features of this material include: Thermally Conductive. |
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| Deflection Temperature at 1.8 MPa (264 psi) | 174 - 183 °C | 345 - 362 °F | Average value: 178 °C Grade Count:13 |
| Overview of materials for Polysulfone, 10% Glass Fiber Reinforced This property data is a summary of similar materials in the MatWeb database for the category "Polysulfone, 10% Glass Fiber Reinforced". Specific grades with glass content between 5% and 14% are incl.. |
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| Deflection Temperature at 1.8 MPa (264 psi) | 174 °C | 345 °F | ASTM D648 |
| Ensinger ENSIFONE® PSU (Polysulfone) - Extruded Products
(discontinued **) ENSIFONE is a transparent engineering plastic known for its chemical resistance, rigidity, high-temperature performance, and its ability to operate in an autoclave environment. ENSIFONE is FDA and .. |
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| Deflection Temperature at 1.8 MPa (264 psi) | 174 °C | 345 °F | Unannealed; ASTM D648 |
| Solvay Specialty Polymers Udel® P-1720 Polysulfone (PSU)
(discontinued **) Udel P-1720 is a flame-retardant grade of polysulfone (PSU) that has a UL94 rating of V-0 at a thickness of 1 mm (0.039"). In general, polysulfone is a tough, rigid, high-strength thermoplastic that.. |
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| Deflection Temperature at 1.8 MPa (264 psi) | 174 °C | 345 °F | Unannealed; ASTM D648 |
| Solvay Specialty Polymers Udel® P-1750 MR Polysulfone (PSU)
(Unverified Data**) Udel P-1750 MR is a lower color grade of polysulfone that contains a mold release which aids part ejection when parts with low draft are injection molded. Polysulfones have long been known for trans.. |
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| Deflection Temperature at 1.8 MPa (264 psi) | 174 °C | 345 °F | Unannealed; ASTM D648 |
| Solvay Specialty Polymers Udel® P-1835 Polysulfone (PSU)
(discontinued **) Udel P-1835 polysulfone is a powdered grade well suited for the fabrication of porous membranes. The membranes can be made into hollow fibers, tubes, plates, or spiral wound elements. They are used .. |
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| Deflection Temperature at 1.8 MPa (264 psi) | 174 °C | 345 °F | ASTM D648 |
| Plenco 504 Black (COM) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound
(discontinued **)< Plaslok 504 is a two-stage, mineral and cellulose-filled phenolic molding compound having better impact and heat resistance than general purpose molding compounds. Since it also has good electrical.. |
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| Deflection Temperature at 1.8 MPa (264 psi) | 174 °C | 345 °F | ISO 75 |
| GEHR Plastics PSU Polysulfone Polysulfone shows great thermal stability. It possesses a high mechanical strength, very good dielectric properties and hydrolysis resistance and a high radiation resistance. PSU has a low notch imp.. |
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| Deflection Temperature at 1.8 MPa (264 psi) | 174 °C @Thickness 3.20 mm |
345 °F @Thickness 0.126 in |
unannealed; ASTM D648 |
| SABIC Innovative Plastics LNP LUBRICOMP SFL2A PA12 LNP* LUBRICOMP* SFL2A is a compound based on Nylon 12 resin containing 50% Glass Fiber, 10% PTFE. Added feature of this material is: Wear Resistant. |
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| Deflection Temperature at 1.8 MPa (264 psi) | 174 °C | 345 °F | Unannealed; ASTM D648 |
| Solvay Specialty Polymers Udel® P-1750 MR Polysulfone (PSU) Udel® P-1750 MR is a lower color grade of polysulfone that contains a mold release which aids part ejection when parts with low draft are injection molded.Polysulfones have long been known for tr.. |
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| Deflection Temperature at 1.8 MPa (264 psi) | 174 °C | 345 °F | Unannealed; ASTM D648 |
| Techmer ES HiFill® PA4/6 GF5 HS BK002 5% Glass Filled Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber Reinforcement, 5% Filler by WeightAdditive: Heat StabilizerFeatures: Heat StabilizedAppearance: BlackInformation provided b.. |
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| Deflection Temperature at 1.8 MPa (264 psi) | 174 °C | 345 °F | Unannealed; ASTM D648 |
| Solvay Specialty Polymers Udel® P-1700 Polysulfone (PSU) Udel® P-1700 polysulfone (PSU) is a tough, rigid, high-strength thermoplastics suitable for continuous use up to 300°F (149°C). It is resistant to oxidation and hydrolysis and withstand pro.. |
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| Deflection Temperature at 1.8 MPa (264 psi) | 174 °C | 345 °F | ASTM D648 |
| Plenco 00757 Melamine-Phenolic, Granular, Injection Molded PLENCO 00757 is a melamine-phenolic, copolymer molding compound, offering excellent arc resistance and comparative track index values. It is formulated to provide improved mechanical strength proper.. |
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| Deflection Temperature at 1.8 MPa (264 psi) | 174 °C | 345 °F | ASTM D648 |
| Plenco 1500 Polyester, Granular, Transfer Molded PLENCO 01500 is a general purpose, mineral filled granular polyester molding compound, offering excellent arc and track resistance, and low post shrinkage characteristics. UL recognized under compon.. |
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| Deflection Temperature at 1.8 MPa (264 psi) | 174 °C | 345 °F | ASTM D648 |
| Westlake Plastics Ardel® Polyarylate Stock shapes extruded from Ardel resin are specifically formulated to endure the damaging effects of UV light. When exposed to UV light, this unique material undergoes a molecular rearrangement res.. |
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| Deflection Temperature at 1.8 MPa (264 psi) | 174 °C | 345 °F | ISO R75 |
| Arkema Group Orgalloy® RS 6015 ES T6L Polyamide Alloy Polyamide Alloy, Blow Molding of Technical PartsInformation provided by Arkema Group |
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| Deflection Temperature at 1.8 MPa (264 psi) | 174 °C | 345 °F | ASTM D648 |
| Plaslok 504 Black (COM) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound
(discontinued **)&l Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 504 is a two-stage, mineral and cellu.. |
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