Polymer Property : Thermal Conductivity = 1.50 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	1.50 - 2.00 W/m-K	10.4 - 13.9 BTU-in/hr-ft²-°F	ASTM E1461
PolyOne Trilliant™ HC HC6200-5002 XR Grey Polyamide 12 (Nylon 12) The Trilliant® specialty compounds offer a complete system of specialty engineered materials, certified processes, services and technical support that enable healthcare OEM's to get to market ahead..
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ft²-°F	through-plane, 10103mm sample; ASTM E 1461-07
SABIC Innovative Plastics LNP KONDUIT PX09322 PA 6 (Asia Pacific) White colored thermally conductive mineral filled PA6 FR compound
Thermal Conductivity	1.50 - 4.69 W/m-K @Temperature 50.0 - 50.0 °C	10.4 - 32.5 BTU-in/hr-ft²-°F @Temperature 122 - 122 °F	Average value: 1.94 W/m-K Grade Count:4
Overview of materials for Silicone, Molded, Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Silicone, Molded, Glass Fiber Filled". Each property range of values reported is minimum and maximum val..
Thermal Conductivity	1.50 - 4.69 W/m-K @Temperature 50.0 - 50.0 °C	10.4 - 32.5 BTU-in/hr-ft²-°F @Temperature 122 - 122 °F	Average value: 2.08 W/m-K Grade Count:4
Overview of materials for Silicone Rubber This property data is a summary of similar materials in the MatWeb database for the category "Silicone Rubber". Each property range of values reported is minimum and maximum values of appropriate Ma..
Thermal Conductivity	1.50 - 4.69 W/m-K @Pressure 30.0 - 30.0 MPa	10.4 - 32.5 BTU-in/hr-ft²-°F @Pressure 4350 - 4350 psi	Average value: 2.08 W/m-K Grade Count:4
Overview of materials for Silicone Rubber This property data is a summary of similar materials in the MatWeb database for the category "Silicone Rubber". Each property range of values reported is minimum and maximum values of appropriate Ma..
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ftÂ²-Â°F	HOT-DISK \|\| 60x60x3 mm
Lehmann & Voss LUVOCOMÂ® 1301/XCF/30 N PPS, linear, with carbon fiber Applications: Automotive industry, textile-and office machinery, medical- and precision engineering.High-strength and stiff parts with low creep.Electrically conductive, suitable for continuous disc..
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ftÂ²-Â°F	150Â°C for 1,000 hrs; JIS-R-2618
Fujipoly Industries SarconÂ® 25G-Td Thin-Film GR-TD Sarcon 25G-Td is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary.Information provided by Fujipoly Industries
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ftÂ²-Â°F	JIS-R-2618; ASTM D2326
Fujipoly Industries SarconÂ® GR-d Gap Filler Pad Sarcon GR-d is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary.Information provided by Fujipoly Industries
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ftÂ²-Â°F	70Â°C for 1,000 hrs; JIS-R-2618
Fujipoly Industries SarconÂ® GR-d Gap Filler Pad Sarcon GR-d is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary.Information provided by Fujipoly Industries
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ftÂ²-Â°F	JIS-R-2618; ASTM D2326
Fujipoly Industries SarconÂ® GR-Fd Gap Filler Pad Sarcon GR-d is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary. GR-Fd has a mesh embedded overall.Information provided b..
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ftÂ²-Â°F	60Â°C for 1,000 hrs with 90% RH; JIS-R-2618
Fujipoly Industries SarconÂ® GR-Fd Gap Filler Pad Sarcon GR-d is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary. GR-Fd has a mesh embedded overall.Information provided b..
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ftÂ²-Â°F	JIS-R-2618; ASTM D2326
Fujipoly Industries SarconÂ® GR-HFd Gap Filler Pad Sarcon GR-d is a highly conformable, thermally conductive material in areas where space between surfaces is uneven and surface textures vary. GR-HFd has a hardened top surface and mesh embedded over..
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ft²-°F
CeramTec ALUTIT® S Aluminum Titanate (Strength Optimized) ALUTIT®, which is produced in a special reaction-sintering process, consists of high-purity aluminum oxide and titanium oxide. It offers excellent resistance to sudden changes in temperature, good ..
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ft²-°F
Tra-Con Tra-Duct 2958 Snap Cure Conductive Silver Epoxy Adhesive TRA-DUCT 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications ..
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ft²-°F
Tra-Con Tra-Duct 2924 Conductive Silver Epoxy Adhesive TRA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage, low resistivity bonding applications where good electrical and physical properties over a wide temperatur..
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ft²-°F
Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el..
Thermal Conductivity	1.50 W/m-K @Pressure 30.0 MPa, Temperature 50.0 °C	10.4 BTU-in/hr-ft²-°F @Pressure 4350 psi, Temperature 122 °F	Product Property; Arlon SQA-TMS-054
Arlon Thermabond® 48A51X015 0.015" (0.381 mm) Uncured Silicone Rubber with Fiberglass Substrate Description: Primerless Thermabond® Electrically insulating, thermally conductive, electronic adhesive. Bonds without primer.Design/Construction: Liner 1: Polyethylene Side 1: Uncured Silicone Rubb..
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ft²-°F	Silicone Property; ASTM E 1530
Arlon Thermabond® R36300W008 0.008" (0.203 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier Description: Low Outgassing, Thermally Conductive, Electrically Insulating, Thermabond® Bonds without primerRecommended Primers: Dow Corning S2260Design/Construction: Liner: FEP Product: Uncured S..
Thermal Conductivity	>= 1.50 W/m-K	>= 10.4 BTU-in/hr-ft²-°F	COLORA
Aptek 2313-PMF Hybrid Epoxy Adhesive Snap-cure, silver-filled; long pot-life/stable viscosity-excellent for robotics. Thermal shock resistant.Production-oriented, snap-cure technology for surface mount applications-allows cure during s..
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ft²-°F
Atom Adhesives AA-DUCT 916 Epoxy Adhesive AA-DUCT 916 is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good elect..
Thermal Conductivity	1.50 - 3.00 W/m-K	10.4 - 20.8 BTU-in/hr-ft²-°F	in "c" direction
Momentive Performance Materials Pyrolytic Boron Nitride (PBN) Coating High temperature protective coating for graphite.PBN has become the material of choice for compound semiconductor crystal growth and wafer processing. PBN coatings also seal and protect graphite fr..
Thermal Conductivity	1.50 W/m-K	10.4 BTU-in/hr-ft²-°F	HOT-DISK \|\| 60x60x3 mm
Lehmann & Voss LUVOCOM® 1301-0824 PPS, linear, with carbon fiber Applications: Automotive industry, textile-and office machinery, medical- and precision engineering.High-strength and stiff parts with low creep.Electrically conductive, suitable for continuous disc..