Polymer Property : Pot Life = 45 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Pot Life	45 - 60 min	45 - 60 min	Mass: 100g; TM R050-17
Resinlab® EP1285HD-9 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C..
Pot Life	45 min	45 min
NextGen Adhesives M907-19 Medical Grade Epoxy Adhesive Description: NGAC M907-19 is a medium viscosity and thixotropic adhesive system that is specifically formulated for medical device assembly applications.Advantages and Applications: Uses include lam..
Pot Life	45 min @Temperature 25.0 °C	45 min @Temperature 77.0 °F
Parker Chomerics Tecknit® 72-00008 Silver-Filled Epoxy System Description: This commercial grade, conductive epoxy is designed for use in bonding applications where good conductivity is required. When mixed in a ratio of 1:1.4 by volume or weight, the two comp..
Pot Life	45 min @Temperature 25.0 °C	45 min @Temperature 77.0 °F
Parker Chomerics Tecknit® 72-08116 Silver-Filled Epoxy System Description: This is a silver filled epoxy system designed for maximum performance and lowest volume resistivity. It is easily mixed 1:1 by volume or weight, from the two one-ounce jars. Its consist..
Pot Life	45 min	45 min	Ambient
Reltek BONDiT™ B-536 Adhesive System Key Properties: Very high strength bonding of dissimilar materials.High moisture and solvent resistance.Fast ambient cure with good pot life.Ease of use.Applications: Outstanding adhesive for very h..
Pot Life	45 min	45 min	Mass: 200g; TM R050-19
Resinlab® EP1390 Medium Viscosity, Self Extinguishing Flame Retardant Epoxy Casting Resin System Resinlab™ EP1390 is a RoHS compliant, medium viscosity, self extinguishing flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Labor..
Pot Life	>= 45 min	>= 45 min
Abatron 2231 A/B Filled Potting Compound (discontinued **) Lower viscosity filled potting, encapsulating, and casting system. Gray and most colors. 5/1 variable ratio.Information provided by Abatron.
Pot Life	>= 45 min	>= 45 min
Abatron 85071 A/B Filled Potting Compound (discontinued **) High grade self leveling buff coating resufacer casting and adhesive resin. 100/20 ratio.Information provided by Abatron.
Pot Life	45 - 60 min	45 - 60 min
Aremco Aremco-Bond™ 597 Conductive Epoxy Adhesive (discontinued **) Electrically and thermally conductive, silver-filled, one-part paste. Inorganic system for adhesive (597A) & coating (597C) applications to 1200 ºF (650 °C).
Pot Life	45 min	45 min
Huntsman HY 2963 Cycloaliphatic Amine Approx. H+ equivalent weight 85. Mix Ratio with GY 6010 is 45.Comments/Applications: Phenol-free version of HY 2964. Mortar and floor repair, sewage treatment plants, commercial and industrial fl..
Pot Life	45 - 65 min	45 - 65 min	Time before parts must be mated
Lord Adhesives 7545F Two-Component, Equal-Mix, Non-Sag Urethane Adhesive Lord Urethane AdhesivesLordÂ® one- and two-part urethane adhesives provide superior bonds with minimal surface preparation for today's high performance thermosets and thermoplastics. They offe..
Pot Life	45 - 60 min	45 - 60 min	100 gram batch
Master Bond EP77M-1 Fast Setting, Silver Conductive Epoxy Description: Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or..
Pot Life	45 min	45 min	25 grams
Tra-Con Tra-Bond 2119 Low Viscosity Glass Laminating Adhesive TRA-BOND 2119 is a crystal clear adhesive specifically designed for bonding glass to glass and glass to plastics. It also yields a high lap shear strength to metals and ceramics. This system cures t..
Pot Life	45 min	45 min	100 grams
Tra-Con Tra-Cast 3156 General Purpose Epoxy Casting System TRA-CAST 3156 is an easy-to-use, low cost, versatile epoxy resin and hardener system developed for general purpose casting applications. It develops excellent adhesion to most metals, plastics, and ..
Pot Life	45 - 60 min	45 - 60 min	200 gram batch
Master Bond EP30LV Optically Clear, Low Viscosity Epoxy Adhesive Description: Master Bond Polymer System EP30LV is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or mo..
Pot Life	45 - 75 min	45 - 75 min	100 gram mass
Master Bond EP30M4 Chemically Resistant Two Component Epoxy System Master Bond Polymer System EP30M4 is a two component epoxy system for high performance bonding, sealing and encapsulation. This system features a forgiving 100 to 60 mix ratio by weight. EP30M4 resi..
Pot Life	45 min	45 min
Tra-Con Tra-Bond 2125 Rigid Syntactic Repair Adhesive TRA-BOND 2125 is a medium viscosity, low density syntactic foam epoxy formulation developed for industrial, electronic and aerospace honeycomb, fillet, edge-fill, contour repair, bonding and casting..
Pot Life	<= 45 min	<= 45 min
Abatron AboTar 8607-1 Solventless Tar-Epoxy Compound AboTar 8607-1 is a 2-part tar-epoxy lower cost system for filling and leveling pot holes and grossly uneven flooring. It can be used neat or with sand or aggregates. Uses: Resurfacing concrete and ..
Pot Life	45 min	45 min
Abatron AboWeld 8505-1 A/B Silver-Filled Electrically Conductive Epoxy Compound AboWeld 8505-1 A/B is a solventless silver-epoxy adhesive and resurfacer. It has high rigidity, chemical and heat resistance. It also has good adhesion to most rigid materials.
Pot Life	45 - 60 min	45 - 60 min	Mass: 100g; TM R050-19
Resinlab® EP1300 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1300 Black (Formerly Lab Product W092602) is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It has a pot life of about one hour and ..
Pot Life	45 - 60 min	45 - 60 min	Mass: 50g; TM R050-19
Resinlab® EP965SC-7 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett..
Pot Life	45 - 60 min	45 - 60 min	Mass: 50g; TM R050-19
Resinlab® EP965SC-7 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett..
Pot Life	45 - 75 min	45 - 75 min	100 gram batch
Master Bond EP42HT-2LO Low Outgassing, Heat Resistant Two Component Epoxy Master Bond Polymer System EP42HT-2LO is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along with outstanding ..