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Polymer Property : Pot Life = 60 min Product List

Processing Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.
Processing Properties Metric English Comments
Pot Life 45 - 60 min
45 - 60 min
Mass: 100g; TM R050-17
Resinlab® EP1285HD-9 Highly Filled, Medium Viscosity Casting Resin
Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C..
Pot Life 45 - 60 min
45 - 60 min
Aremco Aremco-Bond™ 597 Conductive Epoxy Adhesive  (discontinued **)
Electrically and thermally conductive, silver-filled, one-part paste. Inorganic system for adhesive (597A) & coating (597C) applications to 1200 ºF (650 °C).
Pot Life 30 - 60 min
30 - 60 min
Time before parts must be mated
Lord Adhesives 310 High Strength SMC, FRP and General Purpose Epoxy Adhesive
Lord Epoxy AdhesivesLord® Epoxy Adhesives create superior bonds for rubber, SMC, plastics and metals. Our epoxy adhesives are widely used in the automotive industry, over 10 million cars and ligh..
Pot Life 30 - 60 min
30 - 60 min
Time before parts must be mated
Lord Adhesives 7542E Two-Component Urethane Adhesive
Lord Urethane AdhesivesLord® one- and two-part urethane adhesives provide superior bonds with minimal surface preparation for today's high performance thermosets and thermoplastics. They offe..
Pot Life 30 - 60 min

@Temperature 24.0 °C
30 - 60 min

@Temperature 75.2 °F
54g mass
Lord Adhesives Fusor® 310 A/B Epoxy Adhesive
Lord® 310 adhesive is a modified, thixotropic, two-part epoxy adhesive which bonds well to many types of prepared metals, prepared rubber, urethane, and plastics. Originally formulated for primer..
Pot Life 40 - 60 min
40 - 60 min
100 gram batch
Master Bond EP30ANHT Two Part, Electrically Isolating Epoxy Adhesive
Description: Master Bond Polymer System EP30ANHT is a two part epoxy system with terrific thermal conductivity, while maintaining electrical insulation. One noteworthy property is its wide service t..
Pot Life 45 - 60 min
45 - 60 min
100 gram batch
Master Bond EP77M-1 Fast Setting, Silver Conductive Epoxy
Description: Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or..
Pot Life 45 - 60 min
45 - 60 min
100 gm mass
Master Bond EP79 Two Component, Silver Coated, Nickel Filled Conductive Epoxy
Master Bond Polymer System EP79 is a two component, silver coated, nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or ..
Pot Life 40 - 60 min
40 - 60 min
200 gram mass
Master Bond EP30LTE-LO Dimensionally Stable Low Outgassing Two Part Epoxy
Master Bond Polymer System EP30LTE-LO is a thermal shock resistant epoxy resin system with low thermal expansion properties and dimensional stability for high performance bonding, sealing and castin..
Pot Life 45 - 60 min
45 - 60 min
200 gram batch
Master Bond EP30LV Optically Clear, Low Viscosity Epoxy Adhesive
Description: Master Bond Polymer System EP30LV is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or mo..
Pot Life 40 - 60 min
40 - 60 min
100 gram batch
Master Bond EP30LV-1 Ultra Low Viscosity, Two Part Epoxy System
Description: Master Bond Polymer System EP30LV-1 is an ultra low viscosity, two component epoxy system for high performance bonding, coating, sealing, potting and encapsulation. It readily cures at ..
Pot Life 50 - 60 min
50 - 60 min
100 gram batch
Master Bond EP34AO Epoxy Compound Withstands High Temperatures
Description: Master Bond Polymer System EP34AO is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where thermal conductivity ..
Pot Life 55 - 60 min

@Temperature 24.0 °C
55 - 60 min

@Temperature 75.2 °F
1 lb. mass
BCC Products BC 7053 Epoxy Casting
BC 7053 is an iron filled epoxy casting system. This system is a high iron content material that provides unsurpassed wear resistance. BC7053 was designed for use in constructing core boxes, holding..
Pot Life 50 - 60 min

@Temperature 24.0 °C
50 - 60 min

@Temperature 75.2 °F
2 lb. mass
BCC Products BC 7062H Epoxy Casting
BC 7062 are aluminum filled, low viscosity epoxy mass casting resins. These room temperature cure systems allow the user choice thicknesses of 1/8 inch to a maximum of 6 inches without foaming or yi..
Pot Life 45 - 60 min
45 - 60 min
Mass: 100g; TM R050-19
Resinlab® EP1300 Black Unfilled Electronic Grade Epoxy Encapsulant
Resinlab™ EP1300 Black (Formerly Lab Product W092602) is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It has a pot life of about one hour and ..
Pot Life 45 - 60 min
45 - 60 min
Mass: 100g; TM R050-19
Resinlab® EP1300 Clear Unfilled Electronic Grade Epoxy Encapsulant
Resinlab™ EP1300 Clear (Formerly Lab Product W092602) is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It has a pot life of about one hour and ..
Pot Life 45 - 60 min
45 - 60 min
Mass: 50g; TM R050-19
Resinlab® EP965SC-7 Black Unfilled Electronic Grade Epoxy Encapsulant
Resinlab™ EP965SC-7 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett..
Pot Life 45 - 60 min
45 - 60 min
Mass: 50g; TM R050-19
Resinlab® EP965SC-7 Clear Unfilled Electronic Grade Epoxy Encapsulant
Resinlab™ EP965SC-7 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett..
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