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Polymer Property : Cure Time = 2.00 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 120 - 240 min @Temperature 65.0 °C |
2.00 - 4.00 hour @Temperature 149 °F |
|
| NextGen Adhesives P907-10 Optical Assembly Adhesive Description: NGAC P907-10 is a low viscosity and optically clear adhesive system that is specifically formulated for bonding and potting applications involving optical components and assemblies.Adva.. |
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| Cure Time | 120 min @Temperature 65.0 °C |
2.00 hour @Temperature 149 °F |
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| Resinlab® EP750 Clear Unfilled Epoxy Structural Adhesive Resinlab™ EP750 Clear is a two part unfilled epoxy structural adhesive which ingredients are listed in the Code of Federal Regulations Title 21 175.105 (Adhesives) and 175.300 (Resinous and polymer.. |
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| Cure Time | 120 - 240 min @Temperature 65.0 °C |
2.00 - 4.00 hour @Temperature 149 °F |
|
| NextGen Adhesives EC907-34 Epoxy Adhesive Description: NGAC EC907-34 is a two part, electrically conductive silver filled epoxy adhesive which can be cured at room temperature. It was designed for applications requiring excellent mechanical.. |
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| Cure Time | 120 min @Temperature >=65.0 °C |
2.00 hour @Temperature >=149 °F |
Handling strength |
| Lord Adhesives Fusor® 380NS / 383NS Epoxy Adhesive LORD Fusor® 380NS/383NS adhesive is a two-part, rapid-cure epoxy adhesive used to bond fiberglass reinforced plastics (FRP), sheet molded compounds (SMC) and metals.All information provided by Lo.. |
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| Cure Time | 120 min @Temperature 93.3 °C |
2.00 hour @Temperature 200 °F |
|
| Master Bond EP21TDC Toughened, Shock Resistant Two Component Epoxy System Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one .. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP76M Nickel Filled Electrically Conductive Epoxy System Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond Mastersil 151 Two Component Low Viscosity Silicone Compound Master Bond MasterSil 151 is a two component, low viscosity
silicone compound for high performance potting and
encapsulation. MasterSil 151 is an addition cured system and does not require exposure.. |
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| Cure Time | 120 min @Temperature 80.0 °C |
2.00 hour @Temperature 176 °F |
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| Tra-Con Supertherm 826M01 High Performance Diamond Epoxy Adhesive SUPERTHERM 826M01 is a one-part, smooth paste ULTRA HIGH THERMALLY CONDUCTIVE diamond filled epoxy adhesive recommended for semiconductor die-attach and other micro-electronic applications where the.. |
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| Cure Time | 120 min @Temperature 125 °C |
2.00 hour @Temperature 257 °F |
|
| Tra-Con Tra-Bond 933-1 Moisture Resistant Chip Encapsulant TRA-BOND 933-1 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical.. |
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| Cure Time | 120 min @Temperature 65.0 °C |
2.00 hour @Temperature 149 °F |
|
| Trelleborg Emerson & Cuming Eccobond® 286 Two-Component General Purpose Epoxy Adhesive Emerson & Cuming 286 Eccobond® Two-Component General Purpose Epoxy AdhesiveFilled, general purpose, thermally conductive, epoxy adhesive. Room temperature cure. Convenient mix ratio. Recommended fo.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP30MED USP Class VI Certified Two Component Epoxy System Master Bond EP30Med is a two component, optically clear, low viscosity epoxy resin system for high performance bonding, sealing, coating, and encapsulating. It features excellent physical and electr.. |
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| Cure Time | 120 min @Temperature 93.3 °C |
2.00 hour @Temperature 200 °F |
|
| Master Bond EP31 High Shear and Peel Strength Room Temperature Curing Epoxy Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4600 psi. In addition, u.. |
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| Cure Time | 120 min @Temperature 21.0 °C |
2.00 hour @Temperature 69.8 °F |
Full Load |
| Chesterton ARC NVE SYSTEM Vinyl Ester Lining Description: ARC NVE is a high performance, quartz reinforced, three-component, modified novolac vinyl ester lining capable of being applied to horizontal and vertical surfaces. The NVE system kit i.. |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
| Arlon 28941C015 0.015" (0.381 mm) Uncured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured Silicone RubberSide 2: Uncured Silicone Rubber This data represents typical values for the production material. The data should not be used to write, or in place .. |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
| Arlon 30300R062 0.062" (1.57 mm) Uncured Silicone Rubber on Kodacel Carrier Design/Construction: Interleave: Polyethylene Side 1: Uncured Silicone RubberCarrier: KodacelAppearance: Red silicone gum on polymer linersThis data represents typical values for the production mate.. |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Post Cure Cycle |
| Arlon 41300R062 0.062" Uncured Silicone Rubber on Holland Cloth Design/Construction:Interleave: 3.0 mil PolyethyleneSide 1: Uncured Silicone RubberCarrier: Holland ClothThis data represents typical values for the production material and should not be used as m.. |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
| Arlon CP-410XD Bulk Compound Design/Construction:Bulk Compound (packaged in polyethylene) This data Represents typical values for the production material. The data should not be used to write, or in place of, material specifica.. |
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| Cure Time | 120 min @Temperature 65.6 °C |
2.00 hour @Temperature 150 °F |
Recommended Cure |
| Aremco Aremco-Bond™ 2310 High Performance Epoxide Ceramic-Filled, 1:1, High Lap Shear and Peel Strength, Autoclavable. |
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| Cure Time | 120 min @Temperature 93.3 °C |
2.00 hour @Temperature 200 °F |
Step 1, preceeded by 1-4 hour air set |
| Aremco Ceramabond™ 552 High Temperature Ceramic Adhesive/Paste, Alumina Filled Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and.. |
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| Cure Time | 120 min @Temperature 125 °C |
2.00 hour @Temperature 257 °F |
|
| Atom Adhesives AA-DUCT N02 Epoxy Adhesive AA-DUCT N02 is a single component, heat curing, conductive epoxy polymer that was designed for ease in handling. This high performance conductive polymer cures quickly at elevated temperatures makin.. |
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| Cure Time | 120 - 180 min @Temperature 100 °C |
2.00 - 3.00 hour @Temperature 212 °F |
|
| Abatron AboCast 8103-23 High-Performance Dielectric Epoxy AboCast 8103-23 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has a comb.. |
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| Cure Time | 120 - 240 min @Temperature 120 - 160 °C |
2.00 - 4.00 hour @Temperature 248 - 320 °F |
optional |
| Abatron AboCast 8103-29 High-Performance Dielectric Epoxy AboCast 8103-29 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has high h.. |
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| Cure Time | 120 min @Temperature 25.0 °C |
2.00 hour @Temperature 77.0 °F |
tack free |
| Cytec Conathane® CE-1163 (Conap) Polyurethane Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i.. |
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| Cure Time | 120 min @Temperature 65.0 °C |
2.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Duct 2929 Room Temperature Conductive Flexible Silver Epoxy Adhesive TRA-DUCT 2929 is recommended for electronic bonding, coating and sealing applications that require high flexibility coupled with excellent electrical and mechanical properties. This two-part epoxy a.. |
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