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Polymer Property : Cure Time = 2.00 hour Product List

Processing Properties

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Processing Properties Metric English Comments
Cure Time 120 min

@Temperature 60.0 °C
2.00 hour

@Temperature 140 °F
Resinlab® EP1295 Black Medium Viscosity, Halogen Free, Flame Retardant Epoxy Casting Resin
Resinlab™ EP1295 Black is a medium viscosity, halogen free, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (..
Cure Time 120 min

@Temperature 65.0 °C
2.00 hour

@Temperature 149 °F
Resin Technology Group H420 Oxy-Bond™ Electrically Conductive Epoxy Adhesive
Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Cure Time 120 min

@Temperature 150 °C
2.00 hour

@Temperature 302 °F
Resin Technology Group KONA 870FT-FR Fire Retardant Epoxy Casting System
Mix ratio 100 to 4 by weight.KONA 870 FTFR with HARDENER #9 is a versatile epoxy casting system that exhibits unusually high thermal conductivity and low thermal expansion. It is recommended for ele..
Cure Time 120 min

@Temperature 93.3 °C
2.00 hour

@Temperature 200 °F
Master Bond EP21HT High Temperature Resistant Two Component Epoxy
Master Bond Polymer System EP21HT is a two component, room temperature curing epoxy adhesive, sealant and coating with high temperature resistance up to 400°F. EP21HT produces high strength, durabl..
Cure Time 120 - 180 min

@Temperature 93.3 °C
2.00 - 3.00 hour

@Temperature 200 °F
Master Bond EP62-1 High Glass Transition Temperature Epoxy System
Master Bond EP62-1 is a two component epoxy system that has an exceptionally long working life at ambient temperatures and cures rapidly at moderately elevated temperatures. The cured epoxy resin ex..
Cure Time 120 min

@Temperature 65.0 °C
2.00 hour

@Temperature 149 °F
Tra-Con Tra-Bond 2125NB Repair Epoxy Adhesive
TRA-BOND 2125NB is a high performance epoxy version of TRA-BOND 2125 formulated without micron-sized glass spheres. Information provided by Tra-Con Inc.
Cure Time 120 min

@Temperature 120 °C
2.00 hour

@Temperature 248 °F
Tra-Con Tra-Bond 221U01 Electrically Insulating Epoxy Encapsulant
TRA-BOND 221U01 is an electrically insulating, non-sagging epoxy encapsulant formulated to provide a smooth crown over the device of wire bonds. This encapsulant provides protection from thermal and..
Cure Time 120 min

@Temperature 121.1 °C
2.00 hour

@Temperature 250.0 °F
Zyvex Performance Materials Arovex™ 250 Carbon Nanotube Strengthened Prepreg
Arovex® 250 Prepreg is a 180°F (82°C) to 280°F (138°C) curing carbon nanotube strengthened epoxy prepreg suitable for numerous composites applications. Normal curing takes place at 250°F (121°..
Cure Time 120 min

@Temperature 32.0 °C
2.00 hour

@Temperature 89.6 °F
Tack Free
Chesterton ARC BX1 Sliding Wear Compound
Description: An advanced contractor grade ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at..
Cure Time 120 min

@Temperature 25.0 °C
2.00 hour

@Temperature 77.0 °F
Tack Free
Chesterton ARC MX1 Vertical Build Extreme Wear Compound
Description: An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, abrasion and chemical attack. It is applied at a thickness of 6 mm (1/4”)..
Cure Time 120 min

@Temperature 60.0 °C
2.00 hour

@Temperature 140 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® 509FM-1 General Purpose Epoxy
Product Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic indust..
Cure Time 120 min

@Temperature 100 °C
2.00 hour

@Temperature 212 °F
Epoxyset Epoxibond EB-301 Low Expansion Epoxy Adhesive
EB-301 is a highly filled, low expansion, epoxy adhesive. This low out-gassing adhesive exhibits excellent wettability without preheating metal bonding surfaces and has a good dimensional stability ..
Cure Time 120 min

@Temperature 100 - 120 °C
2.00 hour

@Temperature 212 - 248 °F
Abatron AboCast 8103-28 High-Performance Dielectric Epoxy
AboCast 8103-28 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has high h..
Cure Time 120 min

@Temperature 25.0 °C
2.00 hour

@Temperature 77.0 °F
3M AC-250 A-1/6 Aerospace Sealant
3M Aerospace Sealant AC-250 A-1/6 is a two-part, low temperature curing polysulfide, quick repair sealant for integral fuel tank and fuselage sealing applications. The mixed compound is a pourable l..
Cure Time 120 min

@Temperature 232 °C
2.00 hour

@Temperature 450 °F
Recommended Postcure Cycle
Arlon R34696R026 0.026" (0.660 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate
Design/Construction:Side 1: Cured Silicone Rubber Side 2: Uncured Silicone Rubber This data Represents typical values for the production material. The data should not be used to write, or in place o..
Cure Time 120 min

@Temperature 93.3 °C
2.00 hour

@Temperature 200 °F
Step 1, preceeded by 1-4 hour air set
Aremco Ceramabond™ 835-MB High Temperature Ceramic Adhesive/Paste, Alumina Filled
Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and..
Cure Time 120 min

@Temperature 204 °C
2.00 hour

@Temperature 400 °F
Recommended Postcure Cycle
Arlon 51946C015A 0.015" (0.381 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate
Design/Construction:Side 1: Cured Silicone RubberSide 2: Uncured Silicone Rubber This data Represents typical values for the production material. The data should not be used to write, or in place of..
Cure Time 120 min

@Temperature 260 °C
2.00 hour

@Temperature 500 °F
Step 2
Aremco Ceramabond™ 503 High Temperature Ceramic Adhesive/Paste, Alumina Filled
Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and..
Cure Time 120 min

@Temperature 65.0 °C
2.00 hour

@Temperature 149 °F
Tra-Con Tra-Bond FS411 Fast Cure Epoxy Adhesive System
TRA-BOND FS-411 is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where FAST CURING is required. It was designed to have low outgassing in ..
Cure Time 120 - 180 min

@Temperature 100 °C
2.00 - 3.00 hour

@Temperature 212 °F
Abatron AboCast 8103-22 High-Performance Dielectric Epoxy
AboCast 8103-22 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system is used in..
Cure Time 120 min

@Temperature 232 °C
2.00 hour

@Temperature 450 °F
Recommended Postcure Cycle
Arlon 55090R028 0.028 (0.711 mm) Uncured Silicone Rubber with Fiberglass Substrate
Design/Construction:Side 1: Uncured Silicone RubberAppearance: Red silicone gum on fiberglass fabricThis data Represents typical values for the production material. The data should not be used to wr..
Cure Time 120 min

@Temperature 177 °C
2.00 hour

@Temperature 351 °F
Henkel SynSpand 9835 Expanding Syntactic Film
Expanding modified epoxy film, cures at 300°F / 149°C, used for jet engine abradable fan seals.
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