Processing Properties | Metric | English | Comments |
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Cure Time | 120 min @Temperature 65.0 °C |
2.00 hour @Temperature 149 °F |
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Resin Technology Group 1217 Oxy-Bond™ Two-Component Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma.. |
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Cure Time | 120 min @Temperature 150 °C |
2.00 hour @Temperature 302 °F |
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Resin Technology Group KONA 870FT-FR Fire Retardant Epoxy Casting System Mix ratio 100 to 4 by weight.KONA 870 FTFR with HARDENER #9 is a versatile epoxy casting system that exhibits unusually high thermal conductivity and low thermal expansion. It is recommended for ele.. |
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Cure Time | 120 - 240 min @Temperature 66.0 °C |
2.00 - 4.00 hour @Temperature 151 °F |
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Lord Adhesives Thermosetâ„¢ UR-340 Two Component Urethane Encapsulant Lord UR-340 is a two component, room temperature curing, urethane encapsulating compound. It is low in viscosity and has excellent flow characteristics. Its flexibility, low modulus characteristics,.. |
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Cure Time | 120 min @Temperature 100 °C |
2.00 hour @Temperature 212 °F |
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Momentive Performance Materials TSE326 High Temperature, Heat Cured One Component Silicone Adhesive TSE326 is a one-component, heat curing silicone adhesive which offers extended performance at temperatures exceeding 200C. A flowable material with primerless adhesion to many substrates, it is suit.. |
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Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
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Master Bond EP30HT-LO NASA Low Outgassing, Optically Clear Coating Description: Master Bond EP30HT-LO is a moderate viscosity, two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a four to one mix ratio.. |
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Cure Time | 120 - 180 min @Temperature 65.6 °C |
2.00 - 3.00 hour @Temperature 150 °F |
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Master Bond EP79FL Two Component Silver Nickel Conductive Epoxy Adhesive Master Bond Polymer System EP79FL is a two component, silver-coated nickel, electrically conductive system for high performance bonding and sealing. Its most salient features are its high flexibilit.. |
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Cure Time | 120 min @Temperature 65.0 °C |
2.00 hour @Temperature 149 °F |
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Tra-Con Tra-Bond FDA8T Food and Drug Application Thixotropic Flexible Epoxy Adhesive TRA-BOND FDA-8T EPOXY ADHESIVE is a thixotropic epoxy resin system specifically developed for bonding applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini.. |
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Cure Time | 120 min @Temperature 95.0 °C |
2.00 hour @Temperature 203 °F |
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Tra-Con Tra-Bond GA47-2LV Instrument Adhesive TRA-BOND GA47-2LV low viscosity adhesive is designed for guidance instrument applications. This adhesive exhibits excellent compatibility with conventional gyro flotation fluids. TRA-BOND GA47-2LV a.. |
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Cure Time | 120 - 240 min @Temperature 100 °C |
2.00 - 4.00 hour @Temperature 212 °F |
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Trelleborg Emerson & Cuming Eccobond® 11 Heat Cure Catalyst Emerson & Cuming 11 Eccobond® Heat Cure CatalystGeneral purpose, low viscosity, elevated temperature curing. Long working life. Yields cured coatings with excellent chemical resistance. Subject to .. |
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Cure Time | 120 - 240 min @Temperature 65.0 °C |
2.00 - 4.00 hour @Temperature 149 °F |
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Trelleborg Emerson & Cuming Eccobond® 15 LV Variable Hardness Low Viscosity Catalyst Emerson & Cuming 15 LV Eccobond® Variable Hardness Low Viscosity CatalystLow viscosity. Easy-to-use, simple mix ratios. Hardness of cured castings can be controlled by the amount of hardener used. .. |
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Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
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Master Bond EP21FL Flexibilized and Toughened Low Viscosity Epoxy Master Bond Polymer System EP21FL is a lower viscosity, two component, flexibilized epoxy resin system for high performance bonding, coating, sealing and encapsulating. It is formulated to cure at r.. |
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Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
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Master Bond EP30QF Quartz Filled, Two Component Epoxy System Master Bond Polymer System EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and casting that is formulated to cure at room temperature or more rapidly at.. |
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Cure Time | 120 min @Temperature 21.0 °C |
2.00 hour @Temperature 69.8 °F |
Overcoat Begin |
Chesterton ARC S7 High Temperature & Chemical Resistant Novolac Vinyl Ester Coating Description: ARC S7 is a low VOC, epoxy novolac vinyl ester based coating intended for high temperature exposures in chemically aggressive applications where the risk for thermal cycling may be pres.. |
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Cure Time | 120 min @Temperature 65.0 °C |
2.00 hour @Temperature 149 °F |
Minimum Bond Line |
Epoxy Technology EPO-TEK® OM125 Optical Epoxy Product Description: EPO-TEK® OM125 is two component, high Tg, optical epoxy designed for bonding multi-mode fiber optic connectors. Advantages & Application Notes: Color coded blue for easy operat.. |
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Cure Time | 120 min @Temperature 100 - 120 °C |
2.00 hour @Temperature 212 - 248 °F |
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Abatron AboCast 8103-28 High-Performance Dielectric Epoxy AboCast 8103-28 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has high h.. |
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Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Post Cure Cycle |
Arlon 41300R062 0.062" Uncured Silicone Rubber on Holland Cloth Design/Construction:Interleave: 3.0 mil PolyethyleneSide 1: Uncured Silicone RubberCarrier: Holland ClothThis data represents typical values for the production material and should not be used as m.. |
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Cure Time | 120 min @Temperature 232 °C |
2.00 hour @Temperature 450 °F |
Recommended Postcure Cycle |
Arlon 55580R030 0.030" (0.762 mm) Uncured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured Silicone RubberAppearance: Red silicone gum on fiberglass clothThis data Represents typical values for the production material. The data should not be used to wri.. |
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Cure Time | 120 min @Temperature 93.3 °C |
2.00 hour @Temperature 200 °F |
Step 1, preceeded by 1-4 hour air set |
Aremco Ceramabond™ 600-N High Temperature Ceramic Adhesive/Paste, Alumino-Silica Filled Aremco Ceramabond™ 600-N High Temperature Ceramic Adhesive/Paste, Alumino-Silica Filled |
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Cure Time | 120 min @Temperature 129 °C |
2.00 hour @Temperature 265 °F |
Step 1, preceeded by 1-4 hour air set |
Aremco Graphi-Bond™ 551-RN High Temperature Ceramic Adhesive/Paste, Graphite Filled Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and.. |
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Cure Time | 120 - 180 min @Temperature 100 °C |
2.00 - 3.00 hour @Temperature 212 °F |
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Abatron AboCast 8103-25 High-Performance Dielectric Epoxy AboCast 8103-25 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system combines o.. |
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Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
Arlon 51344R020 0.020" (0.508 mm) Semi-Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Semi-Cured Silicone Rubber Appearance: Red silicone gum on fiberglass clothThis data Represents typical values for the production material. The data should not be used to.. |
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Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
Arlon R33468A030 0.0305" (0.775 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Cured Silicone RubberSide 2: Cured/Uncured LayersAppearance: Semi-cured blue silicone gum on glass fabricThis data Represents typical values for the production material. .. |
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Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
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Master Bond EP21TDC-2LO Two component, highly flexibilized epoxy resin compound Product Description: Master Bond Polymer System EP21TDC-2LO is a two component, highly flexible epoxy resin compound for high performance bonding, sealing, coating, and encapsulation. It is formulat.. |
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Cure Time | 120 min @Temperature 60.0 °C |
2.00 hour @Temperature 140 °F |
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Resinlab® EP1240RC Flame Retardant Epoxy Casting Resin Resinlab™ EP1240RC is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034, Pro.. |
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Cure Time | 120 min @Temperature 177 °C |
2.00 hour @Temperature 351 °F |
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Henkel SynSpand 9835 Expanding Syntactic Film Expanding modified epoxy film, cures at 300°F / 149°C, used for jet engine abradable fan seals. |