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Polymer Property : Cure Time = 2.00 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 120 - 240 min @Temperature 100 °C |
2.00 - 4.00 hour @Temperature 212 °F |
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| Resinlab® EP1285HD-12 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C.. |
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| Cure Time | 120 min @Temperature 23.0 °C |
2.00 hour @Temperature 73.4 °F |
M10 steel, handling strength |
| Permabond LH050 Anaerobic Threadsealant Permabond® LH050 pipe sealant with PTFE is a general purpose pipe sealant that provides instant air pressure seal up to 1000 psi with limited hand tightening. After cure, the sealing capability is .. |
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| Cure Time | 120 min @Temperature 65.0 °C |
2.00 hour @Temperature 149 °F |
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| Resin Technology Group TIGA 291-EX Grey Medium Viscosity Polyamide Epoxy Adhesive Mix ratio 1 to 1 by weight.Tiga 291 EX Grey is a medium viscosity polyamide/ epoxy adhesive recommended for bonding applications where high shock impact resistance and peel resistance are desired. T.. |
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| Cure Time | 120 min @Temperature 65.0 °C |
2.00 hour @Temperature 149 °F |
|
| Resin Technology Group UV MX-2231 Hybrid, UV Curing, Thermal-Cure, Micro-Electronic Encapsulant Mix ratio 2 to 1 by volume.UV-MX 2231 is a low viscosity, Photo/thermal curing, bonding/encapsulant for micro-electronic applications. This two-part hybrid UV-epoxy based polymer is designed to bond.. |
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| Cure Time | 120 min @Temperature 146 °C |
2.00 hour @Temperature 295 °F |
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| Henkel Hysol PL 737 Film Adhesive Nonmetallic, modified epoxy film specifically designed for use in structural aircraft components. Low flow characteristics.Application: Metal and Honeycomb Bonding |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP21ARHTND Two component epoxy adhesive, sealant, coating and encapsulating system Product Description: Master Bond EP21ARHTND is a two component epoxy resin system for high performance bonding, sealing and coating. It has a convenient 100 to 50 mix ratio by weight and is formulat.. |
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| Cure Time | 120 min @Temperature 93.3 °C |
2.00 hour @Temperature 200 °F |
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| Master Bond EP21ND Non Drip Room Temperature Curing Epoxy System Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties. EP21ND can be mixed by weight or volume and is available in a .. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP42HT-2AN Thermally Conductive Potting Compound Description: Master Bond Polymer System EP42HT-2AN is a room temperature curable two component epoxy adhesive, sealant, coating and casting material featuring high temperature resistance and outstan.. |
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| Cure Time | 120 min @Temperature 65.0 °C |
2.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Cast FS245 Thermally Conductive Electrically Insulating Compound TRA-CAST FS245 is a medium viscosity, electrically insulating epoxy casting compound that is used for staking and setting transistors, diodes, resistors, integrated circuits and other heat-sensitive.. |
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| Cure Time | 120 min @Temperature 65.0 °C |
2.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Duct 2907 Silver-Filled Epoxy Adhesive TRA-DUCT 2907 is an electrically conducting silver-filled medium viscosity epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical an.. |
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| Cure Time | 120 - 240 min @Temperature 65.0 °C |
2.00 - 4.00 hour @Temperature 149 °F |
|
| Trelleborg Emerson & Cuming Eccobond® 23 LV General Purpose Catalyst Emerson & Cuming 23 LV Eccobond® General Purpose CatalystExcellent low temperature performance properties, excellent thermal shock/cycle and impact resistance. Good hardener for cryogenic applicati.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond Supreme 33CLV Two Component, Room Temperature Curing Toughened Epoxy Master Bond Polymer System Supreme 33CLV is a special, room temperature curing, toughened epoxy adhesive/sealant, featuring exceptionally high temperature resistance. This innovative system has outs.. |
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| Cure Time | 120 min @Temperature 70.0 °C |
2.00 hour @Temperature 158 °F |
|
| Tra-Con Tra-Bond 970-3 Room Temperature Cure General Purpose Adhesive TRA-BOND 970-3 general purpose adhesive is a non-flowing blue paste. This adhesive cures at room temperature. This adhesive is available in kits with a mix ratio of 100 parts A to 74 parts B or prem.. |
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| Cure Time | 120 min @Temperature 100 °C |
2.00 hour @Temperature 212 °F |
|
| Tra-Con Tra-Duct 2924 Conductive Silver Epoxy Adhesive TRA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage, low resistivity bonding applications where good electrical and physical properties over a wide temperatur.. |
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| Cure Time | 120 min @Temperature 32.0 °C |
2.00 hour @Temperature 89.6 °F |
Tack Free |
| Chesterton ARC BX1 Sliding Wear Compound Description: An advanced contractor grade ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at.. |
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| Cure Time | 120 min @Temperature 125 °C |
2.00 hour @Temperature 257 °F |
Minimum |
| Epoxy Technology EPO-TEK® T6067-T Thermally Conductive, Electrically Insulating Epoxy Material Description: A single component, thermally conductive, electrically insulating epoxy designed for hybrid microelectronic packaging and assemblies. It may be used for bonding SMDs, die-atta.. |
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| Cure Time | 120 min @Temperature 100 °C |
2.00 hour @Temperature 212 °F |
|
| Epoxyset Epoxibond EB-301 Low Expansion Epoxy Adhesive EB-301 is a highly filled, low expansion, epoxy adhesive. This low out-gassing adhesive exhibits excellent wettability without preheating metal bonding surfaces and has a good dimensional stability .. |
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| Cure Time | 120 min @Temperature 125 °C |
2.00 hour @Temperature 257 °F |
|
| Epoxyset Epoxiohm EO-98HT Electrically Conductive Epoxy Adhesive EO-98HT is a one component, electrically and thermally conductive, snap cure, die attach epoxy. It was designed for IC plastic packaging of semiconductors, hybrid micro-electronics, and photonic dev.. |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
| Arlon 55978X030 0.0305" (0.775 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Cured Silicone Rubber LayerSide 2: Cured/Uncured Layers Appearance: Gray silicone gum on glass fiber fabricThis data Represents typical values for the production material.. |
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| Cure Time | 120 min @Temperature 218 °C |
2.00 hour @Temperature 425 °F |
|
| Arlon CP-375CR Silicone Rubber bulk compound |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
| Arlon CP-494 Bulk Compound This data represents typical values for the production material. The data should not be used to write, or in place of, material specifications.Information provided by Arlon, Silicone Technologies Di.. |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
| Arlon R35948R015 0.0155" (0.394 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Interleave: Polyethylene Side 1, Layer 2: Uncured Silicone RubberSide 1, Layer 1: Cured Silicone Rubber Substrate: Style 7628 Fiberglass Side 2: Cured Silicone RubberThis data re.. |
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| Cure Time | 120 min @Temperature 260 °C |
2.00 hour @Temperature 500 °F |
Step 3 |
| Aremco Ceramabond™ 835-MB High Temperature Ceramic Adhesive/Paste, Alumina Filled Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and.. |
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| Cure Time | 120 - 180 min @Temperature 100 °C |
2.00 - 3.00 hour @Temperature 212 °F |
|
| Abatron AboCast 8103-20 High-Performance Dielectric Epoxy AboCast 8103-20 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system is unique .. |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
| Arlon 47576R007 0.0075" (0.190 mm) Cured/Uncured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Cured Silicone RubberSide 2: Uncured Silicone RubberAppearance: Red silicone gum and rubber on fiberglass clothThis data represents typical values for the production mate.. |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Post Cure Cycle |
| Arlon 51224R015P 0.015" Semi-cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Semi-cured Silicone RubberSubstrate: Prime Coated 7628 FiberglassInterleave: 3 mil PolyethyleneThis data represents typical values for the production material and shou.. |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
| Arlon 55578XA030M 0.0305" (0.775 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Cured Silicone RubberSide 2: Cured/Uncured Layers This data Represents typical values for the production material. The data should not be used to write, or in place of, m.. |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
| Arlon R34880T020 0.020" (0.508 mm) Uncatalyzed, Unsupported rubber on a Mylar Carrier Design/Construction:Side 1: Uncatalyzed, Unsupported rubber on a Mylar Carrier This data Represents typical values for the production material. The data should not be used to write, or in place of, .. |
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| Cure Time | 120 min @Temperature 93.3 °C |
2.00 hour @Temperature 200 °F |
alternate cure |
| Aremco Aremco-Bond™ 2320 High Performance Epoxide Toughened, Unfilled, Fast-Setting, BPA Free, 2:1, High Peel & Shear Strength |
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