Processing Properties | Metric | English | Comments |
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Cure Time | 480 - 960 min @Temperature 25.0 °C |
8.00 - 16.0 hour @Temperature 77.0 °F |
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Resinlab® EP1285HD-16 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C.. |
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Cure Time | 480 - 960 min @Temperature 71.1 - 82.2 °C |
8.00 - 16.0 hour @Temperature 160 - 180 °F |
Complete Cure Cycle |
Northstar Polymers MSN-V40A Polyester Base Low-Rebound Impact/Vibration Dampening Gel This polyurethane casting material is developed for applications that require Shore OO 40 range casting material with vibration dampening property and higher strength than standard polyurethane gel .. |
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Cure Time | 720 - 960 min @Temperature 80.0 - 90.0 °C |
12.0 - 16.0 hour @Temperature 176 - 194 °F |
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Lord Adhesives Thermosetâ„¢ EP-809 Ignition Coil Impregnating and Encapsulation Epoxy Lord EP-809 is a long working life, heat curing, two component epoxy formulation. It was designed especially for potting high voltage automotive ignition coils. The combination of low viscosity, exc.. |
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Cure Time | 240 - 960 min @Temperature 150 °C |
4.00 - 16.0 hour @Temperature 302 °F |
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Trelleborg Emerson & Cuming Eccobond® 11 Heat Cure Catalyst Emerson & Cuming 11 Eccobond® Heat Cure CatalystGeneral purpose, low viscosity, elevated temperature curing. Long working life. Yields cured coatings with excellent chemical resistance. Subject to .. |
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Cure Time | 480 - 960 min @Temperature 25.0 °C |
8.00 - 16.0 hour @Temperature 77.0 °F |
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Trelleborg Emerson & Cuming Eccobond® 1309 General Purpose Catalyst Emerson & Cuming 1309 Eccobond® General Purpose CatalystFaster curing version of 9. Very fast room temperature curing, low viscosity, general purpose. Short working life. Imparts excellent chemical.. |
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Cure Time | 480 - 960 min @Temperature 25.0 °C |
8.00 - 16.0 hour @Temperature 77.0 °F |
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Trelleborg Emerson & Cuming Eccobond® 24 LV General Purpose Catalyst Emerson & Cuming 24 LV Eccobond® General Purpose CatalystFaster curing, shorter working life version of 23 LV. Recommended for small mass castings due to higher exotherm. Cure Type: Room Temp or He.. |
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Cure Time | 240 - 960 min @Temperature 120 °C |
4.00 - 16.0 hour @Temperature 248 °F |
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Cytec (Conap) FR-1080 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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Cure Time | 720 - 960 min @Temperature 60.0 °C |
12.0 - 16.0 hour @Temperature 140 °F |
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Cytec EN-2550 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s.. |
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Cure Time | 720 - 960 min @Temperature 24.0 °C |
12.0 - 16.0 hour @Temperature 75.2 °F |
demold time |
BCC Products DP-11-83 Urethane Adhesive-Slo DP-11-83 is a low viscosity, quick setting, easy to use adhesive and/or casting material. This product was designed to bond together the MB1200 foam board to create desired dimensions in length, wid.. |
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Cure Time | 480 - 960 min @Temperature 25.0 °C |
8.00 - 16.0 hour @Temperature 77.0 °F |
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Resinlab® EP1285HD-14 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C.. |
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Cure Time | 720 - 960 min @Temperature 22.0 °C |
12.0 - 16.0 hour @Temperature 71.6 °F |
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Aremco Ceramacast™ 905 Silicon-Ceramic Potting Compound Ceramacast™ 905 is a silicone-bonded, ceramic filled high temperature adhesive and potting compound. |