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3M Scotch-Weld™ DP100 Plus Clear Epoxy Adhesive

Category Polymer , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer 3M
Trade Name Scotch-Weld™
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF 3M Scotch-Weld™ DP100 Plus Clear Epoxy Adhesive.pdf
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Material Notes:
3M™ Scotch-Weld™ Epoxy Adhesive DP100 Plus Clear is a fast setting, two-part, 1:1 mix ratio mercaptan-cured epoxy adhesive. It is a unique among fast setting mercaptan cure epoxies in that it combines high shear strength with good peel performance properties. It is transparent and slightly flexible when cured.Information provided by 3M
Physical Properties Metric English Comments
Brookfield Viscosity 4000 - 11000 cP
4000 - 11000 cP
Base, RVF #7 spindle, 20 rpm @ 27°C
7000 - 13000 cP
7000 - 13000 cP
Accelerator, RVF #7 spindle, 20 rpm @ 27°C
Mechanical Properties Metric English Comments
Hardness, Shore D 83
83
ASTM D2240
Tensile Strength at Break 12.8 MPa
1860 psi
ASTM D882
Elongation at Break 75 %
75 %
ASTM D882
Shear Strength 0.552 MPa
80.0 psi
Overlap, Polypropylene
1.72 MPa
250 psi
Overlap, Glass, Borosilicate
1.93 MPa
280 psi
Overlap, ABS
2.07 MPa
300 psi
Overlap, +3M Scotch-Weld Primer EC3901
2.07 MPa
300 psi
Overlap, Acrylic
3.10 MPa
450 psi
Overlap, PVC
4.14 MPa
600 psi
Overlap, Polycarbonate
4.83 MPa
700 psi
Overlap, Wood, Fir
10.3 MPa
1500 psi
Overlap, Fiberglass
11.7 MPa
1700 psi
Overlap, Cold Rolled Steel
12.4 MPa
1800 psi
Overlap, Sanded Aluminum
24.1 MPa
3500 psi
Overlap, Etched Aluminum
1.38 MPa

@Temperature 82.0 °C
200 psi

@Temperature 180 °F
Overlap
2.76 MPa

@Temperature 66.0 °C
400 psi

@Temperature 151 °F
Overlap
5.17 MPa

@Temperature 49.0 °C
750 psi

@Temperature 120 °F
Overlap
20.7 MPa

@Temperature -55.0 °C
3000 psi

@Temperature -67.0 °F
Overlap
24.1 MPa

@Temperature 21.0 °C
3500 psi

@Temperature 69.8 °F
Overlap
Peel Strength 0.175 kN/m
1.00 pli
0.351 kN/m
2.00 pli
180°
0.351 kN/m
2.00 pli
180°
2.28 kN/m
13.0 pli
180°
2.63 kN/m
15.0 pli
180°
Thermal Properties Metric English Comments
CTE, linear 93.0 µm/m-°C

@Temperature 5.00 - 20.0 °C
51.7 µin/in-°F

@Temperature 41.0 - 68.0 °F
Below Tg
182 µm/m-°C

@Temperature 40.0 - 140 °C
101 µin/in-°F

@Temperature 104 - 284 °F
Above Tg
Thermal Conductivity 0.133 W/m-K

@Thickness 6.35 mm,
Temperature 44.3 °C
0.923 BTU-in/hr-ft²-°F

@Thickness 0.250 in,
Temperature 112 °F
Glass Transition Temp, Tg 23.0 °C
73.4 °F
Onset
29.0 °C
84.2 °F
Mid-point
Electrical Properties Metric English Comments
Volume Resistivity 6.70e+11 ohm-cm
6.70e+11 ohm-cm
ASTM D257
Dielectric Constant 6.6

@Frequency 1000 Hz
6.6

@Frequency 1000 Hz
ASTM D150
Dielectric Strength 28.0 kV/mm

@Thickness 0.762 mm
710 kV/in

@Thickness 0.0300 in
ASTM D150
Dissipation Factor 0.060

@Frequency 1000 Hz
0.060

@Frequency 1000 Hz
ASTM D150
Processing Properties Metric English Comments
Cure Time 9.00 - 10.0 min
0.150 - 0.167 hour
Tack-Free
2880 min
48.0 hour
Descriptive Properties Value Comments
Appearance Clear
Clear
Base
Clear
Accelerator
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