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Master Bond EP112LS Two part, heat curing epoxy for potting, encapsulation, coating, sealing and impregnation

Category Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Master Bond Inc.
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP112LS Two part, heat curing epoxy for potting, encapsulation, coating, sealing and impregnation.pdf
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Material Notes:
Master Bond EP112LS is a low viscosity two component epoxy resin system for potting, encapsulation, sealing, coating and impregnation. The mix ratio is an easy to use 100:80 by weight. EP112LS offers an long open time of 2-3 days or longer. It does require oven curing for a number of hours. A typical cure schedule would be 1-2 hours at 200-210°F followed by 3-4 hours at 250°F and then 4-6 hours at 300°F. Post curing at 350°F will further enhance product properties. Some of the more noteworthy attributes of EP112LS are good electrical insulation properties, physical strength values as well as optical clarity. It bonds very well to a wide variety of substrates, including glass fibers and ceramics, along with metals, composites, glass and many rubbers and plastics. It features good resistance to a variety of chemicals, including water, oils, fuels, acids and bases. EP112LS is serviceable over the wide temperature range of -60°F to +450°F. It is used for potting, sealing, coating and encapsulation applications as well as for impregnating especially when non-yellowing is an important consideration. This is a common issue in electronic, aerospace and opto-electronic environments. Another feature is its ability to retain its electrical insulation profile over a wide temperature range. Even though the cure schedule is somewhat long, EP112LS is a “go to” material for epoxy applications where superior non-yellowing properties are needed.Product Advantages: Low viscosity, long working life at ambient temperatures; very low exothermGood physical strength properties. Solid dimensional stabilityGood electrical insulation characteristicsGreat adhesion to similar and dissimilar substratesThermal stability, service temperature range -60°F to +450°FIdeal for impregnation applicationsExcellent optical clarity and non-yellowing propertiesInformation provided by MasterBond®
Physical Properties Metric English Comments
Viscosity 20 - 80 cP

@Temperature 23.9 °C
20 - 80 cP

@Temperature 75.0 °F
Part B
50 - 200 cP

@Temperature 23.9 °C
50 - 200 cP

@Temperature 75.0 °F
mixed compound
100 - 500 cP

@Temperature 23.9 °C
100 - 500 cP

@Temperature 75.0 °F
Part A
Mechanical Properties Metric English Comments
Hardness, Shore D >= 85
>= 85
Tensile Strength at Break >= 75.8 MPa
>= 11000 psi
Elongation at Break <= 3 %
<= 3 %
Tensile Modulus >= 2.07 GPa

@Temperature 149 °C
>= 300 ksi

@Temperature 300 °F
>= 2.76 GPa

@Temperature 23.9 °C
>= 400 ksi

@Temperature 75.0 °F
Compressive Strength >= 138 MPa
>= 20000 psi
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 232 °C
450 °F
Minimum Service Temperature, Air -51.1 °C
-60.0 °F
Optical Properties Metric English Comments
Refractive Index 1.55
1.55
Electrical Properties Metric English Comments
Volume Resistivity >= 1.00e+10 ohm-cm

@Temperature 150 °C
>= 1.00e+10 ohm-cm

@Temperature 302 °F
>= 1.00e+12 ohm-cm

@Temperature 100 °C
>= 1.00e+12 ohm-cm

@Temperature 212 °F
>= 1.00e+14 ohm-cm

@Temperature 25.0 °C
>= 1.00e+14 ohm-cm

@Temperature 77.0 °F
Dielectric Constant 3.1

@Frequency 60.0 Hz,
Temperature 25.0 °C
3.1

@Frequency 60.0 Hz,
Temperature 77.0 °F
3.2

@Frequency 60.0 Hz,
Temperature 100 °C
3.2

@Frequency 60.0 Hz,
Temperature 212 °F
3.2

@Frequency 1.00e+6 Hz,
Temperature 25.0 °C
3.2

@Frequency 1.00e+6 Hz,
Temperature 77.0 °F
3.3

@Frequency 1000 Hz,
Temperature 25.0 °C
3.3

@Frequency 1000 Hz,
Temperature 77.0 °F
3.4

@Frequency 1000 Hz,
Temperature 100 °C
3.4

@Frequency 1000 Hz,
Temperature 212 °F
3.4

@Frequency 1.00e+6 Hz,
Temperature 100 °C
3.4

@Frequency 1.00e+6 Hz,
Temperature 212 °F
3.6

@Frequency 1.00e+6 Hz,
Temperature 150 °C
3.6

@Frequency 1.00e+6 Hz,
Temperature 302 °F
3.7

@Frequency 60.0 Hz,
Temperature 150 °C
3.7

@Frequency 60.0 Hz,
Temperature 302 °F
4.0

@Frequency 1000 Hz,
Temperature 150 °C
4.0

@Frequency 1000 Hz,
Temperature 302 °F
Dissipation Factor 0.0030

@Frequency 60.0 Hz,
Temperature 100 °C
0.0030

@Frequency 60.0 Hz,
Temperature 212 °F
0.0030

@Frequency 60.0 Hz,
Temperature 150 °C
0.0030

@Frequency 60.0 Hz,
Temperature 302 °F
0.0040

@Frequency 1000 Hz,
Temperature 100 °C
0.0040

@Frequency 1000 Hz,
Temperature 212 °F
0.0050

@Frequency 60.0 Hz,
Temperature 25.0 °C
0.0050

@Frequency 60.0 Hz,
Temperature 77.0 °F
0.0070

@Frequency 1000 Hz,
Temperature 25.0 °C
0.0070

@Frequency 1000 Hz,
Temperature 77.0 °F
0.013

@Frequency 1.00e+6 Hz,
Temperature 25.0 °C
0.013

@Frequency 1.00e+6 Hz,
Temperature 77.0 °F
0.015

@Frequency 1.00e+6 Hz,
Temperature 100 °C
0.015

@Frequency 1.00e+6 Hz,
Temperature 212 °F
0.020

@Frequency 1.00e+6 Hz,
Temperature 150 °C
0.020

@Frequency 1.00e+6 Hz,
Temperature 302 °F
0.070

@Frequency 1000 Hz,
Temperature 150 °C
0.070

@Frequency 1000 Hz,
Temperature 302 °F
Processing Properties Metric English Comments
Cure Time 60.0 - 120 min

@Temperature 93.3 - 98.9 °C
1.00 - 2.00 hour

@Temperature 200 - 210 °F
first
180 - 240 min

@Temperature 121 °C
3.00 - 4.00 hour

@Temperature 250 °F
second, Post Curing 350°F
Pot Life 2880 - 4320 min

@Temperature 23.9 °C
2880 - 4320 min

@Temperature 75.0 °F
100 gram batch
Shelf Life 12.0 Month

@Temperature 23.9 °C
12.0 Month

@Temperature 75.0 °F
in original unopened containers
Descriptive Properties Value Comments
Mixing Ratio (A to B) 100:80
by weight
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