Loctite® 3565 High performance epoxy, high Tg and low CTE High Tg Underfill

COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants improve assembly operations by providing superior reliability and faster throughput. Improved reliability is achieved through products that have a high Tg, low CTE, high throughput and excellent adhesion. Faster throughput and higher yields are achieved through faster flow characteristics and increased cure speeds.Loctite® 3565 High performance epoxy, high Tg and low CTE High Tg UnderfillA high performance underfill for flip chip devices. Specifically formatted for high reliability, hybrid and MCM applications. Designed for gaps down to 1 mil.