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Lord Adhesives Fusor® 309-1D / 309-2D Epoxy Adhesive
| Category | Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive |
| Manufacturer | Lord Adhesives |
| Trade Name | Fusor® |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Lord Adhesives Fusor® 309-1D / 309-2D Epoxy Adhesive.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Lord® 309 is a high performance, thixotropic, two-part epoxy adhesive that is used for applications that require gap filling or non-slumping characteristics on a vertical substrate. The cured adhesive offers strong, durable, chemically and environmentally resistant bonds. Lord 309 adhesive has demonstrated excellent adhesion to prepared metals, FRP, wood, prepared rubber, and other materials.All information provided by Lord.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 0.989 - 1.04 g/cc | 0.0357 - 0.0376 lb/in³ | 309-2D Hardener |
| 1.26 - 1.29 g/cc | 0.0455 - 0.0466 lb/in³ | 309-1D Resin | |
| Solids Content | 100 % | 100 % | 309-1D Resin |
| 100 % | 100 % | 309-2D Hardener | |
| 100 % | 100 % | Mixed | |
| Water Absorption | 0.21 % @Time 86400 sec |
0.21 % @Time 24.0 hour |
ASTM D570-81 |
| Brookfield Viscosity | 300000 - 1.00e+6 cP @Temperature 25.0 °C |
300000 - 1.00e+6 cP @Temperature 77.0 °F |
309-2D Hardener; HBF with Helipath and T-C @ 5rpm |
| 300000 - 1.00e+6 cP @Temperature 25.0 °C |
300000 - 1.00e+6 cP @Temperature 77.0 °F |
Mixed; HBF with Helipath and T-C @ 5rpm | |
| 300000 - 1.10e+6 cP @Temperature 25.0 °C |
300000 - 1.10e+6 cP @Temperature 77.0 °F |
309-1D Resin; HBF with Helipath and T-C @ 5rpm |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 74 | 74 | Lord TM 23B |
| Tensile Strength at Break | 37.9 MPa | 5500 psi | ASTM D882-83A (mod) |
| Elongation at Break | 6.0 % | 6.0 % | ASTM D882-83A (mod) |
| Modulus of Elasticity | 1.086 GPa | 157.5 ksi | ASTM D882-83A (mod) |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 268 µm/m-°C | 149 µin/in-°F | above Tg; Lord Internal Method (by DMA) |
| Glass Transition Temp, Tg | 70.0 °C | 158 °F | ASTM E1640-99 (by DMA) |
| Flash Point | >= 93.0 °C | >= 199 °F | 309-1D Resin; Closed Cup |
| >= 93.0 °C | >= 199 °F | 309-2D Hardener; Closed Cup | |
| >= 93.0 °C | >= 199 °F | Mixed; Closed Cup |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 1440 - 2880 min @Temperature >=18.0 °C |
24.0 - 48.0 hour @Temperature >=64.4 °F |
|
| Pot Life | 90 - 120 min @Temperature 25.0 °C |
90 - 120 min @Temperature 77.0 °F |
54g mass |
| Shelf Life | 12.0 Month @Temperature 25.0 °C |
12.0 Month @Temperature 77.0 °F |
309-1D Resin |
| 12.0 Month @Temperature 25.0 °C |
12.0 Month @Temperature 77.0 °F |
309-2D Hardener |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Appearance | Amber | 309-2D Hardener |
| Blue | 309-1D Resin | |
| Blue-green | Mixed | |
| Consistency | Paste | 309-1D Resin |
| Paste | 309-2D Hardener | |
| Paste | Mixed |
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