Master Bond EP21TDCNFL Two Component Nickel Conductive Epoxy Adhesive

Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most noteworthy properties are its high flexibility and elongation. Its exceptional flexibility makes EP21TDCNFL particularly useful in bonding dissimilar substrates that are being thermally cycled and shocked. Additionally, its high flexibility combined with its inherently low shrinkage enables the cured system to exert very little mechanical stress on sensitive components and substrates.