Polymer Property : Viscosity = 14000 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	14000 cP	14000 cP	Part B, RVT, #6, 20 rpm; TM R050-12
Resinlab® EP1340 Medium Viscosity, Flame Retardant Epoxy Casting Resin System Resinlab™ EP1340 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034) for U..
Viscosity	14000 cP	14000 cP	Part A, RVT, #5, 2.5 rpm; TM R050-12
Resinlab® EP1385 Black Epoxy Formulation Resinlab™ EP1385 Black is an epoxy formulation designed for applications requiring resistance to E-85 type fuels. It has good wetting and adhesion to most surfaces. It has very good resistance to w..
Viscosity	14000 cP	14000 cP	Part A, RVT, #5, 2.5 rpm; TM R050-12
Resinlab® EP1385 Clear Epoxy Formulation Resinlab™ EP1385 Clear is an epoxy formulation designed for applications requiring resistance to E-85 type fuels. It has good wetting and adhesion to most surfaces. It has very good resistance to w..
Viscosity	14000 - 17000 cP @Temperature 25.0 °C	14000 - 17000 cP @Temperature 77.0 °F	Mixed
Resin Technology Group TIGA 101-EX Five-Minute Epoxy Adhesive 1 part resin to 1 part hardener.TIGA 101-EX is an exceptional epoxy formulation, recommended for lower temperature or wet industrial bonding applications where fast curing is required. This clear, t..
Viscosity	14000 cP @Temperature 175 °C	14000 cP @Temperature 347 °F	Automatic orifice Viscosity
Cookson Group Plaskon® 3400FP Epoxy Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs ..
Viscosity	14000 - 16000 cP @Shear Rate 230 1/s, Temperature 25.0 Â°C	14000 - 16000 cP @Shear Rate 230 1/s, Temperature 77.0 Â°F	Haake VT 550 PK1.1Â°
Gwent Electronic Materials C2050303D1 Fine Line Printing Ink Silver Ink has been designed for fine line printing. It is capable of printing down to 50 micron line and spaces within a production environment. Under laboratory conditions, finer lines and spaces ..
Viscosity	14000 - 22000 cP @Shear Rate 230 1/s, Temperature 25.0 Â°C	14000 - 22000 cP @Shear Rate 230 1/s, Temperature 77.0 Â°F	Haake VT 550 PK1.1Â°
Gwent Electronic Materials C2050804D9 Platinum Polymer Ink Platinum Ink is a screen printable ink designed for printing working electrodes in electrochemical sensor applications. The ink is designed for curing on polymer substrates. Screen Printing Equipme..
Viscosity	14000 - 16000 cP @Shear Rate 230 1/s, Temperature 25.0 Â°C	14000 - 16000 cP @Shear Rate 230 1/s, Temperature 77.0 Â°F	Haake VT 550 PK1.1Â°
Gwent Electronic Materials D2070423D5 Polymer Dielectric Grey colored screen printable polymer dielectric, suitable for defining electrode areas and forms a protective layer over the electrode tracking during immersion of the electrode. The formulation i..
Viscosity	14000 cP @Temperature 25.0 Â°C	14000 cP @Temperature 77.0 Â°F
Lord Adhesives Circalokâ„¢ 6715 Silicone Encapsulant Circalokâ„¢ 6715 is a two component, medium viscosity, solvent-free silicone which cures at room temperature to an elastomeric, stress-free rubber of outstanding electrical and high temperature p..
Viscosity	14000 cP @Shear Rate 10994 1/s, Temperature 210 Â°C	14000 cP @Shear Rate 10994 1/s, Temperature 410 Â°F	ASTM D3835
STAR Thermoplastic Alloys & Rubbers StarMediflex P 7035-1000 TPE Product Description: StarMediflex P 7035-1000 is an easy processing TPE designed for injection molding. This particular class of TPE material for medical products and tubing applications. Features:S..
Viscosity	14000 - 18000 cP	14000 - 18000 cP	Mixed system
Master Bond EP46HT-2Med Two Component Heat Resistant Biocompatible Epoxy System Master Bond Polymer System EP46HT-2MED is a two component medical grade epoxy system for high performance structural bonding and casting suitable for applications where resistance to temperatures fr..
Viscosity	14000 cP	14000 cP	Hardener
Tra-Con Tra-Bond F125 Fast Gel Clear Epoxy Adhesive TRA-BOND F125 is a 10 minute gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications. This clear, two part system is easily mixed and used at room te..
Viscosity	14000 cP @Temperature 25.0 °C	14000 cP @Temperature 77.0 °F	After mixing
Tra-Con Tra-Bond FDA2 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-2 is a medium viscosity epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and rec..
Viscosity	14000 - 28000 cP	14000 - 28000 cP	Part B
Master Bond EP21TPFL-1AO Two Part, Flexible, Lower Viscosity Epoxy Polysulfide System Product Description: Master Bond EP21TPFL-1AO is a two component, low viscosity epoxy polysulfide for high performance bonding, sealing, coating and casting offering thermal conductivity, electrical..
Viscosity	14000 cP	14000 cP	Resin
Tra-Con Tra-Bond F120 Fast Cure Epoxy Adhesive TRA-BOND F120 is a two-part, medium viscosity adhesive developed for high performance fiber optic and optical bonding applications. It is easily mixed and gels within minutes at room temperature for..
Viscosity	14000 cP	14000 cP	dynamic, mixing
Dow Corning HV 1540/20P BASE AND CLEAR CURING AGENT 32 Shore, very low viscosity, castable hydrophobic silicone rubber with high tear strength and low temperature cure.Information provided by Dow Corning
Viscosity	14000 cP	14000 cP	dynamic
Dow Corning SE 4445 CV KIT Two-part, grey, 1:1, addition cure gel, good thermal conductivity, controlled volatility, UL V-0.Information provided by Dow Corning
Viscosity	14000 cP	14000 cP	Mixed
Armstrong A-271 Epoxy Adhesive A clear amber adhesive system. A-271 is a medium viscosity liquid with excellent wetting ability. It is ideal for bonding glass or similar smooth surfaces. It features very low shrinkage coupled ..
Viscosity	14000 cP	14000 cP
ACC MM830 Low Tear Condensation Cure 2-Part Molding Rubber Part of the Amber Chemical Group. Data provided by manufacturer.Characteristics: low viscosity, good resistance to styrene attack, easy degassing, low shrinkage, range of catalysts. Applications: sh..
Viscosity	14000 cP @Temperature 177 °C	14000 cP @Temperature 350 °F	Typical
Bostik 6323 High Performance, Long Open Time EVA Glue Stick Bostik 6323 High Performance, Long Open Time EVA Glue StickLong open time. Good adhesion to metal and plastics. High performance.
Viscosity	14000 cP	14000 cP	Hardener, uncured
Atom Adhesives AA-BOND F125 Epoxy Adhesive AA-BOND F125 is a 8 minutes gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications. AA-BOND F125 is clear, two part system is easily mixed and used ..
Viscosity	14000 cP	14000 cP	Hardener
Tra-Con Tra-Bond FS411 Fast Cure Epoxy Adhesive System TRA-BOND FS-411 is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where FAST CURING is required. It was designed to have low outgassing in ..
Viscosity	14000 - 20000 cP	14000 - 20000 cP	50-1
Abatron AboCast 50-6/AboCure 50-1 Epoxy Data provided by the manufacturer, Abatron, Inc. Motor oil viscosity, light amber color. Peak exothermic temperature is 160°C (320°F). Shelf life is 12+ months.
Viscosity	14000 cP	14000 cP
Loctite® 545 Hydraulic/Pneumatic Sealant Thread Sealant Thread SealersLoctite® Liquid Thread Sealants seal and secure metal pipes and fittings, filling the space between threaded metal parts, and hardening to prevent leakage. Designed for low and high p..
Viscosity	14000 - 18000 cP	14000 - 18000 cP	mixed compound
Master Bond EP33LV Epoxy Has Dimensional Stability and Machinability Description: Master Bond EP33LV is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and very g..