Polymer Property : Pot Life = 1440 min Product List

Processing Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.

Processing Properties	Metric	English	Comments
Pot Life	1440 min	1440 min
Resin Technology Group 405 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Pot Life	1440 min	1440 min
Resin Technology Group TIGA 905 One-Part Silver Conductive Epoxy System Cure 6 minutes at 130°C or 3 minutes at 150°C.TIGA 905 is a stress-absorbing and electrically conductive, silver-filled epoxy adhesive recommended for solder replacement in microelectronic interco..
Pot Life	1440 min @Temperature 25.0 Â°C	1440 min @Temperature 77.0 Â°F
Lord Adhesives Thermosetâ„¢ ME-430 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ ME-430 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of Chip-on-Board (COB) devices. It is composed of 100% solids and formulated with ..
Pot Life	1440 min @Temperature 25.0 Â°C	1440 min @Temperature 77.0 Â°F
Lord Adhesives Thermosetâ„¢ ME-541 Underfill Encapsulant LORD Thermosetâ„¢ ME-541 encapsulant is an anhydride free, high purity, semi-conductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devi..
Pot Life	>= 1440 min	>= 1440 min	100 gram batch
Master Bond EP45HTMED Epoxy Resists Radiation and Steam Sterilization Description: Master Bond Polymer System EP45HTMED is a two component heat cured epoxy system for high performance structural bonding, sealing, coating and casting. It is especially designed for the ..
Pot Life	>= 1440 min	>= 1440 min	100 gram batch
Master Bond Ep46HT-2 Two Component, Heat Resistant Epoxy System Master Bond Polymer System EP46HT-2 is a two component epoxy system for bonding, sealing and casting applications where resistance to temperatures from -100°F to +500°F is required. It is 100% rea..
Pot Life	>= 1440 min	>= 1440 min	100 gram batch
Master Bond EP46HT-2Med Two Component Heat Resistant Biocompatible Epoxy System Master Bond Polymer System EP46HT-2MED is a two component medical grade epoxy system for high performance structural bonding and casting suitable for applications where resistance to temperatures fr..
Pot Life	1440 min @Temperature 25.0 °C	1440 min @Temperature 77.0 °F	(1 day)
Tra-Con Supertherm 826M01 High Performance Diamond Epoxy Adhesive SUPERTHERM 826M01 is a one-part, smooth paste ULTRA HIGH THERMALLY CONDUCTIVE diamond filled epoxy adhesive recommended for semiconductor die-attach and other micro-electronic applications where the..
Pot Life	1440 min	1440 min	(1 day)
Tra-Con Tra-Bond 2212 High Temperature Epoxy Adhesive TRA-BOND 2212 was developed for high temperature bonding, laminating, filament winding and potting applications where the combination of good physical and mechanical properties plus superior wetting..
Pot Life	1440 min @Temperature 25.0 °C	1440 min @Temperature 77.0 °F	(1 day), 0.6 grams
Tra-Con Tra-Bond 526W01 Microelectronics Grade Encapsulant TRA-BOND 526W01 is a one component micro-electronics grade controlled flow encapsulant designed to protect wire bonds and bare die. TRA-BOND 526W01 has a low coefficient of thermal expansion and low..
Pot Life	1440 min	1440 min	(1 day)
Tra-Con Tra-Duct 29121 Snap Cure Conductive Silver Epoxy Adhesive TRA-DUCT 29121 is 100% solids, two component silver filled epoxy designed for chip bonding in microelectronic and optoelectronic applications. TRA-DUCT 29121 is a soft, smooth paste. This two-part f..
Pot Life	>= 1440 min @Temperature 25.0 °C	>= 1440 min @Temperature 77.0 °F	100 grams
Trelleborg Emerson & Cuming Eccobond® 17 M 1 Heat Cure Catalyst Emerson & Cuming 17 M 1 Eccobond® Heat Cure CatalystVery high temperature resistance, highest temperature strength, lowest shrink. Non-crystallizing. Long working life. Imparts excellent chemical r..
Pot Life	>= 1440 min @Temperature 25.0 °C	>= 1440 min @Temperature 77.0 °F	100 grams
Trelleborg Emerson & Cuming Eccobond® B 97 Heat Cure Catalyst Emerson & Cuming B 97 Eccobond® Heat Cure CatalystVery high temperature resistance, not as brittle as 17 M 1. Cures from 80°C to 200°C. Excellent chemical resistance. May also be used as an accel..
Pot Life	1440 min	1440 min
Dow Corning SILASTIC® 591 LSR PART A&B 50 Durometer, 2-part, 1 to 1 mix, off-white, Liquid Silicone Rubber, for insulating sleeve and printing roller appliacations.Information provided by Dow Corning
Pot Life	1440 min	1440 min
Dow Corning SILASTIC® 94-599-HC SILICONE RUBBER PART A&B 47 Durometer, 2-part, 1 to 1 mix, translucent, molding grade, Liquid Silicone Rubber.Information provided by Dow Corning
Pot Life	1440 min	1440 min
Dow Corning SILASTIC® LSR 9451-1000P 30 Durometer, 2-part, 10 to 1 mix, translucent, Fabric Coating grade, Liquid Silicone RubberInformation provided by Dow Corning
Pot Life	1440 min	1440 min
Dow Corning SILASTIC® LSR 9682-50 PARTS A&B 50 Durometer, 2-part, 1 to 1 mix, clear Liquid Silicone RubberInformation provided by Dow Corning
Pot Life	1440 min	1440 min
Dow Corning SILASTIC® LSR 9791-70 A&B KIT 70 Durometer, 2-part, 1 to 1 mix, translucent, molding grade, Liquid Silicone Rubber.Information provided by Dow Corning
Pot Life	1440 min	1440 min
Epoxy Technology EPO-TEK® 323LP Epoxy Material Description: Longer pot life version of EPO-TEK® 353ND designed for semiconductor, hybrid, fiber-optic, hard-disk drive and medical applications.Information Provided by Epoxy Technology
Pot Life	1440 min	1440 min
Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. Advantages & Appl..
Pot Life	1440 min	1440 min
Epoxy Technology EPO-TEK® E3001 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Pot Life	1440 min	1440 min
Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Pot Life	1440 min	1440 min
Epoxy Technology EPO-TEK® T7139 Glob Top Epoxy Product Description: EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.Advantages & Application N..
Pot Life	1440 min	1440 min
Dow Corning 3625 A&B KIT A 2 part solventless liquid silicone rubber that is both hard and heat stable. Shows particularly good adhesion to polyamide as well as glass and has a flexible low friction and non-blocking surface..
Pot Life	1440 min	1440 min
Dow Corning 3730 A&B KIT A 2 part solventless and colourless liquid silicone rubber with particularly good adhesion to polyamide as well as glass fabric. Cured rubber coating is high strength and has high elongationInformat..
Pot Life	1440 min @Temperature 23.0 °C	1440 min @Temperature 73.4 °F
Loctite® 3889 Rapid Cure Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..