Processing Properties | Metric | English | Comments |
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Cure Time | 30.0 - 60.0 min @Temperature 120 °C |
0.500 - 1.00 hour @Temperature 248 °F |
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Resinlab® EP1285HD-12 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C.. |
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Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
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Parker Chomerics CHO-BOND SV712 Conductive Epoxy CHO-BOND® 700 Series Adhesives for Microelectronics Packaging; these pure silver-filled epoxy pastes are designed to meet the demanding requirements of semiconductor and microelectronic packaging. .. |
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Cure Time | 30.0 min @Temperature 140 °C |
0.500 hour @Temperature 284 °F |
Handling Time |
Parker Chomerics CHOFORM® 5513 Conductive Form-in-Place Gasket Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material.. |
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Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
Handling Time |
Parker Chomerics CHOFORM® 5550 Conductive Form-in-Place Gasket Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material.. |
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Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
Full Cure |
Parker Chomerics CHOFORM® 5550 Conductive Form-in-Place Gasket Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material.. |
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Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Zinc, handling strength |
Permabond HH120 Anaerobic Threadlocker Permabond® HH120 Threadlocker is an excellent general purpose threadlocker and sealant. It is used for locking bolts, nuts and screws that require permanent assembly. Its high viscosity allows for .. |
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Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Stainless steel, handling strength |
Permabond HM162 Anaerobic Retainer Permabond® HM162 is a medium viscosity retaining compound that cures when confined between metal parts to form an extremely tough bond. It is best suited for cylindrical parts and where high temper.. |
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Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
M10 steel, handling strength |
Permabond MH199 Anaerobic Gasketmaker Permabond® MH199 is an anaerobic material designed for making “formed in situ” gaskets between metal surfaces. It is capable of replacing a wide range of conventional gaskets, thereby offering po.. |
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Cure Time | 30.0 min @Temperature 65.0 °C |
0.500 hour @Temperature 149 °F |
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Resin Technology Group TIGA 110-EXDP Low Viscosity, Optically Clear Glass Bonder Mix ratio 100/50 by volume.TIGA 110EX-DP is a transparent, low viscosity epoxy resin formulation recommended for industrial adhesive, small potting and laminating applications where sparkling clarit.. |
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Cure Time | 30.0 min @Temperature 60.0 °C |
0.500 hour @Temperature 140 °F |
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Gwent Electronic Materials C2050106D7 Carbon Graphite Ink This Carbon Graphite Ink is designed to be used for screen printing working electrodes. This is an ink which has been optimized to give superior electrochemical performance. It gives excellent elec.. |
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Cure Time | 30.0 min @Temperature 60.0 °C |
0.500 hour @Temperature 140 °F |
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Gwent Electronic Materials C2000511D1 Platinized Carbon Ink Platinised Carbon Ink is designed to be used for screen printing working electrodes. It has been optimized to give superior electrochemical performance and designed to be used for printing working e.. |
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Cure Time | 30.0 min @Temperature 130 °C |
0.500 hour @Temperature 266 °F |
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Uniseal BETABRACE™ 85001 Epoxy BETABRACE™ 85001 is a composite used for reinforcing sheet metal. It is composed of a moderate temperature curing tacky polymer, woven glass fabric, and release paper. BETABRACE™ 85001 provides .. |
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Cure Time | 30.0 min @Temperature 120 °C |
0.500 hour @Temperature 248 °F |
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Tra-Con Tra-Bond 342-13ACC Single Component Low Viscosity Epoxy Adhesive TRA-BOND 342-13ACC single component, low viscosity epoxy adhesive exhibits high bond strength and excellent thermal shock characteristics. This adhesive may be cured at room temperature in 24 hours .. |
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Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
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Tra-Con Tra-Bond F211 General Purpose Fiber Optic Epoxy Adhesive TRA-BOND F211 is a general purpose fiber optic epoxy adhesive recommended for bonding and small volume potting applications where superior wetting and physical properties are needed at both high and.. |
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Cure Time | 30.0 min @Temperature 43.0 °C |
0.500 hour @Temperature 109 °F |
Tack Free |
Chesterton ARC BX1 Sliding Wear Compound Description: An advanced contractor grade ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at.. |
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Cure Time | 30.0 min @Temperature 43.0 °C |
0.500 hour @Temperature 109 °F |
Full Load |
Chesterton ARC MX5 Rapid Curing Fine Particle Wear Compound Description: An advanced ceramic reinforced composite for the emergency repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is applied at a th.. |
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Cure Time | 30.0 min @Temperature 177 °C |
0.500 hour @Temperature 350 °F |
Recommended Cure Cycle |
Arlon 30400R040 0.04" Uncured, Unsupported Silicone Rubber on Release Carrier Design/Construction:Side 1: Uncured, Unsupported Silicone RubberSubstrate: Kodacel CarrierInterleave: 0.003" PolyethyleneThis data represents typical values for the production material and should.. |
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Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
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ACC QGel 300 QSI Quantum Silicones High Strength Gel QGel 300 is a clear, very soft, tough, moderately cross-linked, silicone polymer. Silicone gels are used to provide protection from vibration, thermal or mechanical shock. Silicone gels also provide.. |
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Cure Time | 30.0 min @Temperature 100 °C |
0.500 hour @Temperature 212 °F |
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ACC QLE 1101 QSI Quantum Silicones Specialty Silicone Coating QLE 1101 is a low viscosity, two-component, addition cure, silicone elastomer.Key Features: Fast cure at elevated temperaturesLow linear shrinkageTransparent, ideal for pigmentationLow viscosity Par.. |
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Cure Time | 30.0 min @Temperature 149 °C |
0.500 hour @Temperature 300 °F |
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3M Scotchcast™ 260 Electrical Epoxy Powder Resin 3M Scotchcast Electrical Resin 260 is a widely used, well-known general purpose epoxy powder resin. A one-part, green pigmented, rapid heat-curing product, it is designed to provide a continuous, to.. |
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Cure Time | 30.0 min @Temperature 75.0 °C |
0.500 hour @Temperature 167 °F |
Dry to handle, at 50% humidity and 75°C |
Blue River Coatings Undercoat Primer BLUE RIVER COATINGS UNDERCOAT PRIMER is a high quality, single component primer, not requiring any catalyzing agent. Performance obtained is equal or superior to that of two-component, catalyzed epo.. |
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Cure Time | 30.0 min @Temperature 177 °C |
0.500 hour @Temperature 350 °F |
Recommended Cure Cycle |
Arlon 55191R060 0.060" (1.52 mm) Uncured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured Silicone RubberSide 2: Uncured Silicone Rubber This data Represents typical values for the production material. The data should not be used to write, or in place .. |
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Cure Time | 30.0 min @Temperature 177 °C |
0.500 hour @Temperature 350 °F |
Recommended Cure Cycle |
Arlon R31551R030 0.030" (0.762 mm) Uncured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured Silicone Rubber Side 2: Uncured Silicone Rubber This data Represents typical values for the production material. The data should not be used to write, or in place.. |
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Cure Time | 30.0 min @Temperature 60.0 °C |
0.500 hour @Temperature 140 °F |
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Atom Adhesives AA-DUCT 906 Epoxy Adhesive AA-DUCT 906 represents the newest technology since the introduction of electrically conductive silver compounds. This unique formulation is based on a silver coated ceramic that results in lower mat.. |