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Tra-Con Tra-Bond F110 Optically Transparent Low Viscosity Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy
Manufacturer Tra-Con, Inc.
Trade Name Tra-Bond
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Tra-Bond F110 Optically Transparent Low Viscosity Epoxy Adhesive.pdf
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Material Notes:
TRA-BOND F110 is a rigid, optically clear adhesive with a very low viscosity. This room temperature curing system is an excellent choice for thin bond-line assembly and repair applications of prisms, lenses and other optic components. Its high strength makes this epoxy ideal for structural applications and its insulative properties are perfect for intricate bonding of electronic components. TRA-BOND F110 exhibits excellent wetting and wicking capabilities which allows it to adhere strongly to glass, ceramics, metals and most rigid plastics. Its highly structured matrix gives F110 good resistance to salt solutions, mild acids and alkalis and many other chemicals. Information provided by Tra-Con Inc.
Physical Properties Metric English Comments
Specific Gravity 1.17 g/cc
1.17 g/cc
Mixed
Solids Content 100 %
100 %
Reactive Solids Content
Volatile Organic Compounds (VOC) Content 39.1 g/l
39.1 g/l
Viscosity 300 cP

@Temperature 25.0 °C
300 cP

@Temperature 77.0 °F
After mixing
Mechanical Properties Metric English Comments
Hardness, Shore D 85
85
Adhesive Bond Strength 14.8 MPa
2150 psi
Lap shear, alum to alum, 24 hrs @ 25°C
17.9 MPa
2600 psi
Lap shear, alum to alum, 1 hr @ 65°C
20.7 MPa
3000 psi
Lap shear, alum to alum, 4 hrs @ 65°C
Izod Impact, Notched 0.128 J/cm
0.240 ft-lb/in
Thermal Properties Metric English Comments
CTE, linear 60.0 µm/m-°C

@Temperature 20.0 °C
33.3 µin/in-°F

@Temperature 68.0 °F
Maximum Service Temperature, Air 130 °C
266 °F
Minimum Service Temperature, Air -60.0 °C
-76.0 °F
Glass Transition Temp, Tg 90.0 °C
194 °F
Ultimate Tg
Optical Properties Metric English Comments
Refractive Index 1.54
1.54
Transmission, Visible 97 %
97 %
3200-9000 Å
Electrical Properties Metric English Comments
Volume Resistivity 6.00e+13 ohm-cm
6.00e+13 ohm-cm
Dielectric Constant 4.3

@Frequency 1000 Hz
4.3

@Frequency 1000 Hz
Dielectric Strength 16.1 kV/mm
410 kV/in
Processing Properties Metric English Comments
Cure Time 60.0 - 120 min

@Temperature 65.0 °C
1.00 - 2.00 hour

@Temperature 149 °F
1440 min

@Temperature 25.0 °C
24.0 hour

@Temperature 77.0 °F
Pot Life 30 min
30 min
Descriptive Properties Value Comments
Color Transparent, Clear
Mix Ratio, parts by weight 100/11
Resin/Hardener
Thixotropic Index 1
Working Life hours 1
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