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Epoxyset Epoxibond EB-315 Low Expansion Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Epoxyset
Trade Name Epoxibond
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxyset Epoxibond EB-315 Low Expansion Epoxy Adhesive.pdf
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Material Notes:
EB-315 is a highly filled, heat curing, high temperature resistant epoxy adhesive. Due to its low coefficient of thermal expansion and outgassing, it can be used for bonding and sealing in critical instrument applications.Information provided by Epoxyset Inc.
Physical Properties Metric English Comments
Density 1.80 g/cc
0.0650 lb/in³
Water Absorption 0.20 %
0.20 %
Viscosity 80000 cP
80000 cP
Mechanical Properties Metric English Comments
Hardness, Shore D 92
92
ASTM D2240
Adhesive Bond Strength 14.5 MPa
2100 psi
Lap Shear Strength
Thermal Properties Metric English Comments
CTE, linear 25.0 µm/m-°C
13.9 µin/in-°F
Maximum Service Temperature, Air 210 °C
410 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Glass Transition Temp, Tg >= 120 °C
>= 248 °F
Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 150 °C
0.500 hour

@Temperature 302 °F
60.0 min

@Temperature 100 °C
1.00 hour

@Temperature 212 °F
Pot Life 120 min
120 min
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