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Henkel Hysol PL 696 Film Adhesive

Category Polymer , Adhesive , Film , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Henkel
Trade Name Hysol
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Henkel Hysol PL 696 Film Adhesive.pdf
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Material Notes:
Epoxy-based structural film adhesive designed primarily for out-of-autoclave curing process applications requiring low cure temperatures as well as low curing pressures and is also available in lightning strike confiations. In addition, it improves surface quality of composite structures, while having the ability to bond a variety of similar and dissimilar materials.Applications: Composite Bonding Metal and Honeycomb Bonding Composite Surfacing
Physical Properties Metric English Comments
Storage Temperature -18.0 °C
-0.400 °F
Mechanical Properties Metric English Comments
Adhesive Bond Strength 14.0 MPa

@Temperature 121 °C
2030 psi

@Temperature 250 °F
Lap Shear
23.0 MPa

@Temperature -55.0 °C
3340 psi

@Temperature -67.0 °F
Lap Shear
25.0 MPa

@Temperature 25.0 °C
3630 psi

@Temperature 77.0 °F
Lap Shear
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 121 °C
250 °F
Glass Transition Temp, Tg 105 °C
221 °F
wet
109 °C
228 °F
dry
Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 93.0 °C
0.500 hour

@Temperature 199 °F
60.0 min

@Temperature 60.0 °C
1.00 hour

@Temperature 140 °F
Descriptive Properties Value Comments
Honeycomb Climbing Drum Peel, mN/m 154
at 25°C
Out-Time (days) 3
at 25°C
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