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- Polymer Property : Cure Time = 60.0 min
Polymer Property : Cure Time = 60.0 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 60.0 min @Temperature 95.0 °C |
1.00 hour @Temperature 203 °F |
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| Parker Chomerics CHO-BOND 360-208 Conductive Epoxy Low cost, electrically conductive epoxy adhesive that combines the good adhesive characteristics as epoxy, and the superior electrical conductivity of silver. It is recommended as a thermo-setting E.. |
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| Cure Time | 60.0 min @Temperature 80.0 °C |
1.00 hour @Temperature 176 °F |
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| Parker Chomerics CHO-BOND 592 Conductive Epoxy Highly conductive silver-filled epoxy adhesive which combines the best properties of metals and organics. This two-component system is unique in that it combines long pot life, good electrical condu.. |
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| Cure Time | 60.0 min @Temperature 25.0 °C |
1.00 hour @Temperature 77.0 °F |
De-mold Time |
| Northstar Polymers MPL-R20B Rigid Polyurethane Foam Formulation This rigid polyurethane foam system is one of a family of polymer systems developed by Northstar Polymers for specific applications. Urethane foams molded with this system exhibit closed cell struct.. |
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| Cure Time | 60.0 min @Temperature 82.2 °C |
1.00 hour @Temperature 180 °F |
Complete Cure Cycle |
| Northstar Polymers MPS-F04A Hand-Mixable Flexible Foam This foam formulation is designed to make molded flexible foam parts/sheets/dies/blocks by hand-mixing or by the meter dispensing equipment. The components are stable liquid at room temperature and.. |
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| Cure Time | 60.0 min @Temperature 82.2 °C |
1.00 hour @Temperature 180 °F |
Complete Cure Cycle |
| Northstar Polymers MPS-F06B Hand-Mixable Flexible Foam This foam formulation is designed to make molded flexible foam parts/sheets/dies/blocks by hand-mixing or by the meter dispensing equipment. The components are stable liquid at room temperature and.. |
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| Cure Time | 60.0 min @Temperature 65.0 °C |
1.00 hour @Temperature 149 °F |
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| Resin Technology Group 2TN Oxy-Bond™ Two-Component Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma.. |
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| Cure Time | 60.0 min @Temperature 23.0 °C |
1.00 hour @Temperature 73.4 °F |
Aluminum, handling strength |
| Permabond HL126 Anaerobic Threadlocker PERMABOND® HL126 Threadlocker is a water thin product for locking pre-assembled parts through wicking action. PERMABOND® HL126 Threadlocker prevents vibration loosening. Because of the low viscosi.. |
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| Cure Time | 60.0 min @Temperature 150 °C |
1.00 hour @Temperature 302 °F |
Post Cure |
| Shin-Etsu Silicones LIMSâ„¢ KEG2000-75A/B Elastomer KEG2000-75 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. Its viscosity is low enough to allow easy pum.. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond FDA2YL02 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-2 YL02 is a medium viscosity epoxy resin system specifically developed for adhesive and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug.. |
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| Cure Time | 60.0 - 90.0 min @Temperature 93.3 °C |
1.00 - 1.50 hour @Temperature 200 °F |
|
| Master Bond EP41S Fast Curing Epoxy Features Chemical Resistance Description: Master Bond EP41S is a two component epoxy resin compound for durable, high performance, tough, high strength coatings, liners and sealants with outstanding resistance to organic solven.. |
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| Cure Time | 60.0 min @Temperature 65.0 °C |
1.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond 2106T Fast Cure Thixotropic Epoxy Adhesive TRA-BOND 2106T is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where FAST CURING is required. This versatile two-part epoxy system contai.. |
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| Cure Time | 60.0 min @Temperature 65.0 °C |
1.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond 216R01 Fire Retardant Epoxy TRA-BOND 216R01 is a fast curing material with a set time of 5 to 7 minutes. Samples tested were certified to the requirements of UL94 V-O, and is RoHS compliant. TRA-BOND 216R01 develops significa.. |
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| Cure Time | 60.0 min @Temperature 75.0 °C |
1.00 hour @Temperature 167 °F |
|
| Tra-Con Tra-Bond Ablebond 868-7 Thixotropic Epoxy Adhesive Ablebond 868-7 flexible epoxy adhesive is a thixotropic version of the 868-series. This nonsag adhesive provides strong bonds to a variety of surfaces.Information provided by Tra-Con Inc. |
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| Cure Time | 60.0 min @Temperature 65.0 °C |
1.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond F131 High Tg Room Temperature Cure Fiber Optic Adhesive TRA-BOND F131 is a fiber-optic adhesive used for terminating ALL types of fiber-optic connectors as well as LED displays, lenses and other optical components. It produces a typical Tg of 95°C thus .. |
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| Cure Time | 60.0 min @Temperature 100 °C |
1.00 hour @Temperature 212 °F |
|
| Trelleborg Emerson & Cuming Eccobond® D 275 One-Component Fast Cure Epoxy Adhesive Emerson & Cuming D 275 Eccobond® One-Component Fast Cure Epoxy AdhesiveSemi-rigid, high strength, fast curing, pourable, epoxy structural adhesive. Good peel strength (12 pli), Recommended for bond.. |
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| Cure Time | 60.0 min @Temperature 100 °C |
1.00 hour @Temperature 212 °F |
|
| Dow Corning OE-6450 Two-part, solvent-less, high purity and heat cure type semiconductor protective coating of siliconeInformation provided by Dow Corning |
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| Cure Time | 60.0 min @Temperature 60.0 °C |
1.00 hour @Temperature 140 °F |
|
| Cytec CC-1191 (Conap) Acrylic Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i.. |
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| Cure Time | 60.0 min @Temperature 60.0 °C |
1.00 hour @Temperature 140 °F |
|
| Cytec CE-1170 (Conap) Acrylic Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i.. |
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| Cure Time | 60.0 min @Temperature 70.0 °C |
1.00 hour @Temperature 158 °F |
|
| Epoxy Technology EPO-TEK® 320NC-2 Optically Opaque Epoxy Material Description: A two component, black colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modific.. |
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| Cure Time | 60.0 min @Temperature 180 °C |
1.00 hour @Temperature 356 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® H35-175MPT Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35MPT is a single component, silver-filled, electrically conductive epoxy designed for military hybrid die and component attach. High viscosity version of EPO-TEK® H.. |
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| Cure Time | 60.0 min @Temperature 180 °C |
1.00 hour @Temperature 356 °F |
|
| Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / J.. |
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| Cure Time | 60.0 - 240 min @Temperature 160 - 180 °C |
1.00 - 4.00 hour @Temperature 320 - 356 °F |
optional |
| Abatron AboCast 8103-13 One-Component Epoxy AboCast 8103-13 is the low-viscosity one-component clear epoxy system with deep impregnation that offers high performance at relatively high temperatures. It is best for thin-wall casting. Suggested.. |
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| Cure Time | 60.0 - 240 min @Temperature 160 - 180 °C |
1.00 - 4.00 hour @Temperature 320 - 356 °F |
optional |
| Abatron AboCast 8504-5 One-Component Epoxy AboCast 8504-5 is a clear, plasticized one-component epoxy system with very high strength and impact. It provides exceptional physical properties and thermal shock resistance from sub-zero to modera.. |
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| Cure Time | 60.0 min @Temperature 177 °C |
1.00 hour @Temperature 351 °F |
|
| Henkel Hysol EA 9845 SF Composite Surfacing Film Epoxy-based composite surfacing film improves surface quality of honeycomb stiffened composite parts. Reduced weight vs conventional surfacing films. Cures at 250°F/121°C or 350°F/177°C with a v.. |
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| Cure Time | 60.0 min @Temperature 26.0 °C |
1.00 hour @Temperature 78.8 °F |
Full Load |
| Chesterton ARC NVE VC Vinyl Ester Sealer Description: ARC NVE VC (Veil Coat) is a two-component, modified epoxy novolac vinyl ester sealer coat formulated for application by brush, roller or spray at 0.15-0.25 mm (0.07-0.010”) wet film th.. |
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| Cure Time | 60.0 min @Temperature 23.0 °C |
1.00 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond A131 Anaerobic Threadsealant Permabond® A131 is an anaerobic adhesive designed to seal threaded metal pipe connections carrying a wide variety of gases and liquids, including potable water. Suitable for use on both parallel an.. |
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| Cure Time | 60.0 min @Temperature 177 °C |
1.00 hour @Temperature 351 °F |
|
| Henkel Hysol PL 460 Core Splice Adhesive Foaming epoxy adhesive in paste form for easy extrusion through packaged cartridges. Expands and cures at temperatures from 250°F / 121°C to 350°F / 177°C. Qualified to Boeing BMS 5-90, Type IV... |
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