- HOME
- POLYMER SEARCH
- Polymer Property : Cure Time = 60.0 min
Polymer Property : Cure Time = 60.0 min Product List
Processing PropertiesTips: 30 items are displayed at most.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time |
60.0
min @Temperature 23.0 °C |
1.00
hour @Temperature 73.4 °F |
Aluminum, handling strength |
|
Permabond HH190 Anaerobic Gasketmaker
Permabond® HH190 Gasketmaker is an anaerobic curing flange sealant that can replace, or be used as a dressing for, conventional pre-cut gaskets. Since HH190 is a flowable paste, it conforms to the ..
|
|||
| Cure Time |
60.0
min @Temperature 23.0 °C |
1.00
hour @Temperature 73.4 °F |
Aluminum, handling strength |
|
Permabond HL126 Anaerobic Threadlocker
PERMABOND® HL126 Threadlocker is a water thin product for locking pre-assembled parts through wicking action. PERMABOND® HL126 Threadlocker prevents vibration loosening. Because of the low viscosi..
|
|||
| Cure Time |
60.0
-
180
min @Temperature 23.0 °C |
1.00
-
3.00
hour @Temperature 73.4 °F |
M10 steel, working strength |
|
Permabond HM128 Anaerobic Threadlocker
Permabond® HM128 Threadlocker is a high strength adhesive for permanent assembly. It is typically used for preventing vibration loosening of bolts, studs and cap screws. Full cure to a cross-linked..
|
|||
| Cure Time |
60.0
-
180
min @Temperature 23.0 °C |
1.00
-
3.00
hour @Temperature 73.4 °F |
M10 steel, working strength |
|
Permabond HM162 Anaerobic Retainer
Permabond® HM162 is a medium viscosity retaining compound that cures when confined between metal parts to form an extremely tough bond. It is best suited for cylindrical parts and where high temper..
|
|||
| Cure Time |
60.0
min @Temperature 23.0 °C |
1.00
hour @Temperature 73.4 °F |
Aluminum, handling strength |
|
Permabond LM012 Anaerobic Threadsealant
Permabond® LM012 is an unfilled, medium viscosity anaerobic adhesive. Its major benefit as related to other pipe sealants is that it is an unfilled resin that is compatible with hydraulic fluids. I..
|
|||
| Cure Time |
60.0
min @Temperature 95.0 °C |
1.00
hour @Temperature 203 °F |
|
|
Parker Chomerics CHO-BOND 360-20 Conductive Epoxy
Low cost, electrically conductive epoxy adhesive that combines the good adhesive characteristics as epoxy, and the superior electrical conductivity of silver. It is recommended as a thermo-setting E..
|
|||
| Cure Time |
60.0
min @Temperature 150 °C |
1.00
hour @Temperature 302 °F |
Post Cure |
|
Shin-Etsu Silicones LIMSâ„¢ KE1950-10A/B Elastomer
KE-1950-10 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy ..
|
|||
| Cure Time |
60.0
min @Temperature 150 °C |
1.00
hour @Temperature 302 °F |
Post Cure |
|
Shin-Etsu Silicones LIMSâ„¢ KE1950-40A/B Elastomer
KE-1950-40 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy ..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 - 98.9 °C |
1.00
-
2.00
hour @Temperature 200 - 210 °F |
first |
|
Master Bond EP112LS Two part, heat curing epoxy for potting, encapsulation, coating, sealing and impregnation
Master Bond EP112LS is a low viscosity two component epoxy resin system for potting, encapsulation, sealing, coating and impregnation. The mix ratio is an easy to use 100:80 by weight. EP112LS offer..
|
|||
| Cure Time |
60.0
-
90.0
min @Temperature 177 °C |
1.00
-
1.50
hour @Temperature 350 °F |
|
|
Master Bond EP17HT-LO One component epoxy system for bonding, sealing, coating and casting
Product Description: Master Bond EP17HT-LO is a one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features good physical properties, electrical insulation pr..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP21TDCS Silver Filled Electrically Conductive Epoxy Compound
Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP21TDCSMed Two Component, Silver Conductive USP Class VI Epoxy
Master Bond Polymer System EP21TDCS MED is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. The high strength..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP30AOHT Dimensionally Stable, Two Component Epoxy
Description: Master Bond Polymer System EP30AOHT is a two component epoxy resin system for high performance bonding, potting, sealing and coating, formulated to cure at room temperature or more rapi..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP51FL-1 Rapid Curing Cryogenic Two Component Epoxy
Master Bond Polymer System EP51FL-1 is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very sl..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP76M-F Electrically Conductive, Two Part Epoxy
Description: Master Bond EP76M-F is a two component, nickel filled, electrically conductive epoxy system for high performance bonding, sealing, and coating formulated to cure at room temperature or ..
|
|||
| Cure Time |
60.0
min @Temperature 93.0 °C |
1.00
hour @Temperature 199 °F |
|
|
Tra-Con Tra-Bond 724-14C Polyurethane Adhesive
TRA-BOND 724-14C premixed and frozen, polyurethane adhesive is designed for good adhesion, providing strong, resilient bonds to a wide variety of substrates, including aluminum, solder, nylon, mylar..
|
|||
| Cure Time |
60.0
-
120
min @Temperature 93.3 °C |
1.00
-
2.00
hour @Temperature 200 °F |
|
|
Master Bond EP21TDCSLO Two Component Silver Conductive Epoxy Adhesive
Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rap..
|
|||
| Cure Time |
60.0
min @Temperature 65.0 °C |
1.00
hour @Temperature 149 °F |
|
|
Tra-Con Tra-Bond F109 Fiber Optic Epoxy Adhesive
TRA-BOND F109 is specially designed to be used in fiber optic connectors where connections must be made in high humidity environments. This two part, low viscosity epoxy remains at a constant viscos..
|
|||
| Cure Time |
60.0
min @Temperature 125 °C |
1.00
hour @Temperature 257 °F |
|
|
Tra-Con Tra-Duct 2924 Conductive Silver Epoxy Adhesive
TRA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage, low resistivity bonding applications where good electrical and physical properties over a wide temperatur..
|
|||
| Cure Time |
60.0
min @Temperature 60.0 °C |
1.00
hour @Temperature 140 °F |
|
|
Cytec CC-1191 (Conap) Acrylic Dielectric Conformal Coating
Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
|
|||
| Cure Time |
60.0
min @Temperature 100 °C |
1.00
hour @Temperature 212 °F |
|
|
Epoxyset Epoxibond EB-348 Low Expansion Epoxy Adhesive
EB-348 is a highly filled, extremely low expansion, epoxy adhesive. This low out-gassing adhesive exhibits excellent wettability without preheating metal bonding surfaces and has a good dimensional ..
|
|||
| Cure Time |
60.0
min @Temperature 177 °C |
1.00
hour @Temperature 350 °F |
Step 2 |
|
Aremco Ceramabond™ 600-N High Temperature Ceramic Adhesive/Paste, Alumino-Silica Filled
Aremco Ceramabond™ 600-N High Temperature Ceramic Adhesive/Paste, Alumino-Silica Filled
|
|||
| Cure Time |
60.0
-
120
min @Temperature 180 °C |
1.00
-
2.00
hour @Temperature 356 °F |
|
|
Abatron AboCast 8708-6 One-Component Structural/Dielectric Epoxy
AboCast 8708-6 is a highly filled, class H (180°C) structural, castable adhesive compound for SLOW high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating; Emb..
|
|||
| Cure Time |
60.0
-
240
min @Temperature 65.0 °C |
1.00
-
4.00
hour @Temperature 149 °F |
|
|
Atom Adhesives AA-BOND FDA16 Epoxy Adhesive
AA-BOND FDA16 is a medium viscosity epoxy resin system specifically developed for medical device applications. AA-BOND FDA16 has been tested in accordance with USP biological reactivity tests, in vi..
|
|||
| Cure Time |
60.0
min @Temperature 121 °C |
1.00
hour @Temperature 250 °F |
>0.5 Hour Air Set Required Prior to Curing |
|
Aremco Corr-Paint™ CP2020 High Temperature Protective Coating Urethane, Aluminum Filled
This epoxy and urethane based coating is used for producing corrosion and wear resistant barriers to 500 °F. Typical applications include tanks, pipelines, boilers, precipitators, scrubbers, bag ho..
|
|||
| Cure Time |
60.0
-
180
min @Temperature 23.0 °C |
1.00
-
3.00
hour @Temperature 73.4 °F |
M10 steel, working strength |
|
Permabond MH052 Anaerobic Threadsealant
Permabond® MH052 is ideal for the sealing of threaded joints. It is approved for use with natural gas and LPG for working pressure up to 20 bar (290 psi) and also for gaseous oxygen up to 10 bar (1..
|
|||
| Cure Time |
60.0
min @Temperature 60.0 °C |
1.00
hour @Temperature 140 °F |
|
|
Resinlab® EP1296 Highly Filled, Moderately Thixotropic Black Casting Resin
Resinlab™ EP1296 is a highly filled, moderately thixotropic black casting resin designed for applications requiring good thermal conductivity, low shrinkage and a low CTE. It was especially formula..
|
|||
| Cure Time |
60.0
min @Temperature 23.0 °C |
1.00
hour @Temperature 73.4 °F |
M10 steel, working strength |
|
Permabond A134 Anaerobic Retainer
Permabond® A134 is a high-strength anaerobic product designed for the permanent locking and sealing of metal parts. Its 'non-drip' formulation makes it suitable for use on larger fittings, coarse t..
|
|||
Copyright © lookpolymers.com All Rights Reserved