Resin Technology Group UV MX-2240 Multi-Functional Hybrid, UV-Curing, Micro-Electronic System

Mix ratio 2 to 1 by volume.UV-MX 2240 is a low-viscosity, water-white photo/ chemical cross-linking encapsulant/sealant designed for micro-electronic applications. This two-part, Hybrid UV-epoxy based polymer is designed to gel with exposure to UV light followed by complete cure by internal chemical cross-link, with or without UV exposure. UV-MX 2240’s ability to “dark-cure” via conventional amine cure cross-linking makes it ideal for those applications that require the on-line speed of a UV cure and the versatility of a conventional two-part epoxy cure.Applications: Recommended for laminating, bonding and sealing applications of glass products where excellent wetting and outstanding impact strength is required. Electronic-Opto: Back filling of connectors, LED potting, glass touch screens.Processing: UV light cure: Intensity of 200 mw/cm2; Spectral output of 300 to 500 nanometers; Optimum wavelength of 375 nanometers.Information provided by Resin Technology Group.