Polymer Property : Flexural Modulus = 1800 ksi Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Flexural Modulus	12.4 GPa	1800 ksi	ASTM D790
Nylene® Vexel™ B12GF45 SA , 45% Glass Reinforced PBT Description: Vexel™ B12GF45 SA is a 45% glass fiber reinforced PBT with improved surface aPolyphenylene Etherarance. Information provided by Custom Resins. ALM, Nylene Canada, and Custom Resins are..
Flexural Modulus	12.4 GPa	1800 ksi	1.3 mm/min; ASTM D790
Ovation Polymers Opnyl OP6GF50 Nylon 6, 50% Glass Reinforced, Dry Nylon 6 - Glass reinforced (50 %), high tensile strength, stiffness and HDT. *All properties are measured after 48 hours of conditioning at 23°C and 50% relative humidity. For Nylon compounds the m..
Flexural Modulus	12.4 GPa	1800 ksi	ASTM D790
PolyOne Edgetek® NY-20CF/000 BLACK Polyamide 6 (Nylon 6) Information provided by PolyOne
Flexural Modulus	12.4 GPa	1800 ksi	ASTM D790
Solvay Specialty Polymers Amodel® AF-4133 V0 Polyphthalamide (PPA) Resin, 33% Glass Reinforced (discontinued AMODEL AF-4133 V0 is a 33% glass reinforced grade of polyphthalamide (PPA) resin that was designed specifically to process with water-cooled molds and meet the requirements of most electrical/electr..
Flexural Modulus	12.4 GPa	1800 ksi	ASTM D790
Custom Resins Vexel™ E20GF45 , 45% Glass Reinforced PET (discontinued **) Description: Vexel™ E20GF45 is a 45% glass fiber reinforced, general purpose PET. Information provided by Custom Resins.
Flexural Modulus	12.41 GPa	1800 ksi	2.6 mm/min, 100 mm span; ASTM D790
SABIC Innovative Plastics ULTEM 3452 PEI 45% Glass fiber and mineral filled, enhanced flow Polyetherimide (Tg 217C) with enhanced dimensional stability. ECO Conforming, UL94 V0 and 5VA listing in recognized colors.
Flexural Modulus	12.41 GPa	1800 ksi	2.6 mm/min, 100 mm span; ASTM D790
SABIC Innovative Plastics ULTEM 3452 PEI (Asia Pacific) 45% Glass fiber and mineral filled, enhanced flow Polyetherimide (Tg 217C) with enhanced dimensional stability. ECO Conforming, UL94 V0 and 5VA listing in recognized colors.
Flexural Modulus	12.4 GPa	1800 ksi	ASTM D790
Techmer ES HiFillÂ® PA6/6 GF50 L UV 50% Glass Filled (Conditioned) Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber Reinforcement, 50% Filler by WeightAdditive: Lubricant and UV StabilizerFeatures: Lubricated and Good UV ResistanceInformat..
Flexural Modulus	12.41 GPa	1800 ksi	ASTM D790
SABIC Innovative Plastics LNP THERMOCOMP RF0079SZ PA 66 (Asia Pacific) LNP* Thermocomp* RF0079SZ is a compound based on Nylon 66 resin containing Glass Fiber. Added features of this material include: Flame Retardant, Heat Stabilized.
Flexural Modulus	12.4 GPa	1800 ksi	ASTM D790
Sumitomo Bakelite North America RXÂ® 1366FR-P Short-Glass Reinforced Diallyl Phthalate Short glass fiber reinforced, flame retardant, diallyl ortho-phthalate molding compound which meets the requirements of ASTM D5948 Type SDG-F.Information provided by Vyncolit, a Sumitomo Bak Group
Flexural Modulus	12.41 GPa	1800 ksi	ASTM D790
SABIC Innovative Plastics LNP STAT-KON DE0049P PC LNP* STAT-KON* DE0049P is a compound based on Polycarbonate resin containing 20% Carbon Fiber. Added features of this material include: Exceptional Processing, Flame Retardant. Electrically Conduct..
Flexural Modulus	12.41 GPa	1800 ksi	ASTM D790
SABIC Innovative Plastics LNP VERTON RV008S PA 66 LNP* VERTON* RV008S is a compound based on Nylon 66 resin containing 40% Long Glass Fiber. Added features of this material include: Heat Stabilized, Structural.
Flexural Modulus	12.41 GPa	1800 ksi	ASTM D790
SABIC Innovative Plastics LNP VERTON RVL28 PA 66 LNP* VERTON* RVL28 is a compound based on Nylon 66 resin containing 40% Long Glass Fiber, 10% PTFE. Added features of this material include: Easy Molding, Heat Stabilized, Wear Resistant, Structura..
Flexural Modulus	12.4 GPa	1800 ksi	Lengthwise; ASTM D790
Bedford Plastics Glass Reinforced Vinylester Structural Fiberglass Profiles Flame retardant grade; see details in the property table.Pultrusion results in the production and supply of one of the worlds strongest and most durable products available today. The pultruded prod..
Flexural Modulus	12.4 - 13.8 GPa	1800 - 2000 ksi
Bulk Molding Compounds BMC 1050 Thermoset Polyester BMC 1050 is a cosmetic, appliance grade material with superior heat stability. As with all other BMCI compounds, this Series can be supplied in logs, slugs or bulk.Typical applications are toaster e..
Flexural Modulus	12.4 - 13.8 GPa	1800 - 2000 ksi
Bulk Molding Compounds BMC 200 Thermoset Polyester, Electrical Grade BMC 200 is a high strength, low shrink molding compound. It can be supplied in bulk or extruded in pre-weighted slugs.Typical applications are circuit breakers, insulators, bobbins, electrical conne..
Flexural Modulus	12.4 - 14.5 GPa	1800 - 2100 ksi
Bulk Molding Compounds BMC 700 Thermoset Polyester, High Arc Quench Electrical Grade BMC 700 is a general purpose, mineral filled, glass fiber-reinforced polyester compound that was initially designed for molding arc chutes. It has superior arc quench properties. As with all other B..
Flexural Modulus	12.4 - 13.8 GPa	1800 - 2000 ksi
Bulk Molding Compounds BMC HT12-1027 Unsaturated Polyester Bulk Molding Compound BMC HT12-1027 is a highly engineered Unsaturated Polyester Bulk Molding Compound developed for automotive under-hood applications. This compound is specified by Ford motor company for solenoid caps..
Flexural Modulus	12.4 - 13.8 GPa	1800 - 2000 ksi
Bulk Molding Compounds BMC T12-15541 General Purpose Molding Compound BMC T12 is a general purpose molding compound. Due to the excellent flow and controlled reactivity, BMC T12 is well suited for injection, transfer or compression molding of intricate parts. Typica..
Flexural Modulus	12.4 GPa	1800 ksi	ASTM D790
Asahi Kasei Thermylon® NSG-240A 50% Ceramic and Glass Fiber Reinforced Information provided by Asahi Thermofil
Flexural Modulus	12.4 GPa	1800 ksi	ASTM D790
Sumitomo Bakelite North America Epiall® 1960B-1 Mineral and Glass Filled Electrical Encapsulation Grade Epoxy Epiall 1960B-1 is a mineral and short fiberglass filled epoxy compound, formulated for the encapsulation of passive electronic devices.Information provided by Sumitomo Bak North America, Inc.