Polymer Property : Cure Time = 60.0 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	60.0 - 120 min @Temperature 65.0 °C	1.00 - 2.00 hour @Temperature 149 °F
Resinlab® EP1285HD-9 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C..
Cure Time	60.0 min @Temperature 60.0 °C	1.00 hour @Temperature 140 °F
Parker Chomerics THERM-A-FORM T644 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co..
Cure Time	60.0 min @Temperature 65.0 °C	1.00 hour @Temperature 149 °F
Resin Technology Group 2TN Oxy-Bond™ Two-Component Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Cure Time	60.0 - 180 min @Temperature 23.0 °C	1.00 - 3.00 hour @Temperature 73.4 °F	M10 steel, working strength
Permabond HL126 Anaerobic Threadlocker PERMABOND® HL126 Threadlocker is a water thin product for locking pre-assembled parts through wicking action. PERMABOND® HL126 Threadlocker prevents vibration loosening. Because of the low viscosi..
Cure Time	60.0 min @Temperature 23.0 °C	1.00 hour @Temperature 73.4 °F	M10 steel, working strength
Permabond HM160 Anaerobic Retaining Compound Permabond® HM160 is a medium viscosity liquid adhesive that cures when confined between metal parts to form a tough, hard plastic. In the uncured, liquid state, the adhesive wets the metal surfaces..
Cure Time	60.0 - 120 min @Temperature 23.0 °C	1.00 - 2.00 hour @Temperature 73.4 °F	black iron, fixture time
Permabond LH056 Anaerobic Threadsealant Permabond LH056 is a thread sealant designed for use in sealing metal pipes and fittings in sprinkler systems which may also contain CPVC piping. Permabond LH056 prevents leaks even on pipes that ar..
Cure Time	60.0 min @Temperature 23.0 °C	1.00 hour @Temperature 73.4 °F	Zinc, handling strength
Permabond HH040 Anaerobic Retainer Permabond® HH040 is a single component liquid that cures only when in contact with metal parts and oxygen is excluded. The liquid adhesive fills the “air space” between parts and upon cure unitiz..
Cure Time	60.0 min @Temperature 23.0 °C	1.00 hour @Temperature 73.4 °F	Zinc, handling strength
Permabond MH199 Anaerobic Gasketmaker Permabond® MH199 is an anaerobic material designed for making “formed in situ” gaskets between metal surfaces. It is capable of replacing a wide range of conventional gaskets, thereby offering po..
Cure Time	60.0 - 120 min @Temperature 93.3 °C	1.00 - 2.00 hour @Temperature 200 °F
Master Bond EP21TDCSMed Two Component, Silver Conductive USP Class VI Epoxy Master Bond Polymer System EP21TDCS MED is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. The high strength..
Cure Time	60.0 min @Temperature 120 °C	1.00 hour @Temperature 248 °F
Tra-Con Tra-Bond 342-3.5 Room Temperature Cure Epoxy Adhesive TRA-BOND 342-3.5 room temperature curing epoxy adhesive is designed for applications which require outstanding thermal shock properties. This adhesive may be used to bond semi-porous materials such ..
Cure Time	60.0 min @Temperature 95.0 °C	1.00 hour @Temperature 203 °F
Tra-Con Tra-Bond 642-1 Epoxy Adhesive TRA-BOND 642-1 unfilled epoxy adhesive is designed to provide a long pot life and cure rapidly at elevated temperatures. Information provided by Tra-Con Inc.
Cure Time	60.0 - 120 min @Temperature 65.0 °C	1.00 - 2.00 hour @Temperature 149 °F
Tra-Con Tra-Bond F113 High Impact Optically Clear Epoxy Adhesive TRA-BOND F113 is an optically clear, low viscosity, high impact epoxy adhesive developed for bonding and small volume potting of plastic or glass optical fibers, lenses, and prisms, LED displays, an..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond FDA23 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-23 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini..
Cure Time	60.0 min @Temperature 125 °C	1.00 hour @Temperature 257 °F
Tra-Con Tra-Duct 2979LV Microelectronic Conductive Epoxy Adhesive TRA-DUCT 2979LV is a fast curing one-part epoxy adhesive with superior electrical conductivity and bonding capability. It has been shown to retain these properties through hundreds of hours of rapid..
Cure Time	60.0 min @Temperature 65.0 °C	1.00 hour @Temperature 149 °F
Tra-Con Tra-Bond 2106T Fast Cure Thixotropic Epoxy Adhesive TRA-BOND 2106T is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where FAST CURING is required. This versatile two-part epoxy system contai..
Cure Time	60.0 min @Temperature 75.0 °C	1.00 hour @Temperature 167 °F
Tra-Con Tra-Bond Ablebond 868-7U Thixotropic Epoxy Adhesive Ablebond 868-7UNF is the unfilled version of 868-7, a nonsagging, flexible epoxy adhesive. Information provided by Tra-Con Inc.
Cure Time	60.0 min @Temperature 100 °C	1.00 hour @Temperature 212 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® 375 High Temperature Epoxy Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy..
Cure Time	60.0 min @Temperature 150 °C	1.00 hour @Temperature 302 °F
Epoxy Technology EPO-TEK® EE165-3 Silver Filled Epoxy A two component, silver-filled, electrically conductive epoxy made for bonding of SMDs, and general solder replacement at the PCB level and circuit assembly. It was designed to be low modulus and f..
Cure Time	60.0 min @Temperature 150 °C	1.00 hour @Temperature 302 °F	minimum
Epoxy Technology EPO-TEK® MA-5 Optical Grade Epoxy Material Description: A single component, B-stageable, optical grade epoxy for fiber optic assembly. It may be used for B-stage sealing of fiber cables into ferrules, or fiber optic feed through in..
Cure Time	60.0 min @Temperature 125 °C	1.00 hour @Temperature 257 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® T7139 Glob Top Epoxy Product Description: EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.Advantages & Application N..
Cure Time	60.0 min @Temperature 180 °C	1.00 hour @Temperature 356 °F
Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / J..
Cure Time	60.0 - 360 min @Temperature 80.0 °C	1.00 - 6.00 hour @Temperature 176 °F	optional 3rd step
Abatron AboCast 8502-6/AboCure 8502-6 Colorless, Low-Exotherm Epoxy Casting Compound AboCast 8502-6/AboCure 8502-6 is a flexible, colorless, low-exotherm epoxy casting compound for spherical masses up to 2000 grams. It is a 2-component structural and dielectric liquid system with lo..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Atom Adhesives AA-BOND FDA26 Epoxy Adhesive AA-BOND FDA26 is Versatile adhesive guaranteed a high strength bond. AA-BOND FDA26 is two part adhesive used and cured at room temperature for bonding, repair applications by manufacturers of food p..
Cure Time	60.0 min @Temperature 82.0 °C	1.00 hour @Temperature 180 °F
Henkel Hysol EA 9323 Paste Adhesive System Viscous, but pourable, liquid adhesive that yields tough, durable adhesive bonds over a wide temperature range.Application: Structural Repair
Cure Time	60.0 min @Temperature 26.0 °C	1.00 hour @Temperature 78.8 °F	Foot Traffic
Chesterton ARC NVE VC Vinyl Ester Sealer Description: ARC NVE VC (Veil Coat) is a two-component, modified epoxy novolac vinyl ester sealer coat formulated for application by brush, roller or spray at 0.15-0.25 mm (0.07-0.010”) wet film th..
Cure Time	60.0 min @Temperature 66.0 °C	1.00 hour @Temperature 151 °F
Henkel Hysol EA 9395 Paste Adhesive System Two-part, nonmetallic-filled version of Hysol EA 9394.Applications: Potting Structural Repair Composite Bonding
Cure Time	60.0 - 75.0 min @Temperature 121 °C	1.00 - 1.25 hour @Temperature 250 °F
Master Bond Supreme 10HTND-3 Non-Drip Epoxy Resists High Temperatures Description: Master Bond Supreme 10HTND-3 features a blend of performance properties including both high shear and peel strengths along with a totally non-drip application feature. This one componen..